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A/D Converter or ADC |
Analog-to-digital converter.
A device to convert variable or analog signals to digital representation |
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Access Time |
The time interval between the instant that data is called from or delivered to a storage device (memory) and the instant that
requested retrieval or storage is complete |
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Algorithm |
A prescribed set of well defined rules for the solution of a problem. Algorithms are implemented on a computer by a stored
sequence of instructions. |
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Alignment |
The arranging of the mask and wafer in correct positions, one with respect to the other. Special alignment patterns are
normally part of the mask. |
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Analog |
Indicates continuous, non-digital representation of phenomena. An analog voltage, for example, may take any value. |
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Binary |
A system of numbers using 2 as a base in contrast to the decimal system which uses 10 as a base. The binary system requires
only two symbols...0 and 1. |
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Bipolar or BiPolar |
refers to transistors formed with two (N- and P- type) semiconductor types. (N=negative; P=positive) |
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Bit |
A binary digit. A bit is the smallest unit of storage in a digital computer and is used to represent one of two
digits in the binary number system. |
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Buried Layer |
A low-resistivity diffused region placed under the collector to reduce its series resistance. |
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Bus |
A circuit or group of circuits which provide a communication path between two or more devices. |
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Byte |
A set of contiguous binary bits, usually eight (8), which operate on as a unit. A byte can also be a sub-set of a computer
word. |
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CA |
Construction Analysis |
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CCITT |
Consultative Committee for International Telephony and Telegraphy |
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Channel |
A region of surface conduction opposite in type from that of the bulk doping of an FET transistor. |
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Chip |
A single square or rectangular piece of semiconductor material into which a specific electrical circuit has been fabricated.
Plural is dice. Also called a die. |
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CMOS |
Complementary Metal Oxide Semiconductor. A logic family made by combining N- channel and P- channel MOS
transistors. |
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Comparator |
Also called a differential comparator. A circuit that compares two analog inputs and produces a 1 or 0 logic level output,
depending on which voltage input is more positive.
|
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CPU |
Central Processing Unit. The part of the computer that fetches, decodes, and executes program
instructions and maintains status of results. |
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D/A Converter or DAC |
A device to convert digital representation into an analog voltage or current level. |
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Data |
A general term used to denote any or all facts, numbers, letters, and symbols. It connotes basic elements of information
which can be processed or produced by a computer. |
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Depletion Device |
A type of MOSFET which is "on" |
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Development System |
Microcomputer system complete with peripherals, memory and software, used to write, compile, run and debug application
programs for one or more target microprocessors. |
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Die |
A single square or rectangular piece of semiconductor material into which a specific electrical circuit has been fabricated.
Plural is dice. Also called a chip. |
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Diffusion |
A method of doping or modifying the characteristics of semiconductor material by "baking" wafers of the base
semiconductor material in furnaces with controlled atmospheres of impurity materials. |
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DIP |
Dual-In-line Package. The most common type of IC package, circuit leads or pins extend symmetrically
outward and downward from opposite sides of the rectangular package body. |
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Discrete |
A semiconductor device containing only one active device, such as a transistor or a diode. |
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Donor |
An impurity that can make a semiconductor N-type by donating extra "free" electrons to the conduction band. The
free electrons are carriers of negative charge. |
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Doping |
The introduction of an impurity into a semiconductor to modify its electrical properties by creating a concentration of N or
P carriers. |
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Dynamic RAM |
A type of semiconductor memory in which the presence or absence of a capacitive charge represents the state of a binary
storage element. The charge must be periodically refreshed. |
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EAROM |
Electrically Alterable ROM, a read-only memory whose contents may be altered on rare occasions through
electrical stimuli. |
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ECL |
Emitter Coupled Logic. A form of current-mode logic in which the output is available from an
emitter-follower output stage. |
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EEPROM |
Electrically Erasable Read Only Memory |
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Enhancement Device |
A type of MOSFET which requires a control signal input to turn on the device. This device is "off" when no input
signal is present. |
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Epitaxial Layer |
A deposited layer of material having the same crystallographic characteristics as the substrate material. |
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EPROM |
Erasable PROM, similar to ROM, but enables the user to erase stored information and replace it with new
information, when necessary. Most EPROMs are erased through exposure to ultra-violet light. |
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FA |
Failure Analysis |
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FET |
Field Effect Transistor |
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Firmware |
Software in hardware form, referring specifically to microcode in ROM. |
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Flat Pack |
An IC package which has leads extending from the package in the same plane as the package so that leads can be spot welded to
terminals on a substrate or soldered to a printed circuit board. |
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Flip-Flop |
An electrical circuit having two stable states, on or off. The basic component of a logic or memory circuit. |
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FPLA |
Field Programmable Logic Array, a PLA can be programmed by the user. |
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Gate |
The basic digital logic element ... where the binary value of the output depends on the values of the inputs. |
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Gate Equivalent |
The basic unit of measure for digital circuit complexity, based on the number of elementary logic gates that would have to be
interconnected to form the same circuit function. |
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Glassivation |
The protective coating placed on the entire die surface, usually silicon dioxide or silicon nitride. Also
called passivation. |
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HMOS |
High-performance Metal Oxide Semiconductor |
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Hole |
The absence of a valance electron in a semiconductor crystal. The movement of a hole is equivalent to the movement of a
positive charge. |
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Hybrid Circuit |
Any combination of two or more of the following in ONE package: active substrate integrated circuit; passive
substrate integrated circuit; discrete component. |
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I/O |
Input/Output relating to the equipment or method used for transmitting information into and out of a
computer. |
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IC |
Integrated Circuit -- a semiconductor die containing multiple elements that act together to form the complete
device circuit. |
|
IEEE |
Institute of Electrical and Electronics Engineers |
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ILL |
Integrated Injection Logic, a bipolar structure characterized by an integrated PNP load device and
inverted operation of the NPN logic transistor. |
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Ion Implantation |
Introduction into a semiconductor of selected impurities via high voltage ion bombardment to achieve desired electrical
properties in selected regions. |
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Junction |
The boundary between a P region and an N region in a semiconductor substrate. |
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LED |
Light Emitting Diode, a semiconductor device that emits light whenever current passes through it. |
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Linear IC |
An analog integrated circuit, as opposed to a digital integrated circuit. |
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LS TTL |
Low-power Schottky Transistor Transistor Logic, the power dissipation of LS TTL is
typically 1/5th that of conventional TTL. |
|
LSI |
Large Scale Integration-- LSI devices contain 100 or more gate equivalents or other circuitry of similar
complexity. |
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Majority Carrier |
The mobile charge carrier (hole or electron) that predominates in a semiconductor material. |
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Mask |
A patterned screen, usually of glass, used to expose selected areas of a semiconductor (that has been covered with a
photoresist) to a light source that causes polymerization. |
|
MESFET |
Metalic Schottky Field Effect Transistor, a field effect transistor whose gate structure
consists of a metalic Schottky barrier. |
|
Microcode |
A set of control functions performed by the instruction decoding and execution logic of a CPU or microprocessor which defines
the instruction repertoire of that computer. |
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Microcomputer |
A microprocessor complete with stored program memory (read only memory ROM), random access memory (RAM), and Input/Output
(I/O) logic. If all functions are on the same chip, this is sometimes called a microcontroller. Microcomputers are capable of performing useful
work without additional supporting logic. |
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Microcontroller |
If all functions, ROM, RAM, I/O are on the same chip, this is sometimes called a microcontroller.. |
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Microelectronics |
Microscopically small components or circuits made by means of photolithography techniques. |
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Micron |
Synonymous with micrometer: one millionth of a meter. |
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Microprocessor |
The basic arithmetic of a computers, Central Processing Unit (CPU) |
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Mil |
One thousandth of an inch, equal to 25.4 microns. |
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Monolithic Device |
A device whose circuitry is completely contained on a single die or chip |
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MOS |
Metal Oxide Semiconductor, devices using FETs in which current flow through a channel of N- or P- type
semiconductor material is controlled by the electric field around a gate structure. MOSFETs are unipolar devices characterized by extremely high
input resistance. |
|
MOSFET |
Metal Oxide Semiconductor Field Effect
Transistor
|
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MSI |
Medium Scale Integration, ICs containing ten or more gate equivalents but less than
100. |
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N-Channel MOS |
A type of MOSFET using electrons to conduct current in the semiconductor channel. The channel has a predominantly
negative charge. |
|
Op Amp |
Operational Amplifier, a general purpose IC used as a basic building block for implementation of linear
functions. |
|
Optical Isolator |
A circuit-isolation device consisting of an LED and a photodiode or photo transistor in close proximity. Current through the
LED causes internal light emission, which current flow in the (isolated) photo transistor. |
|
P-Channel MOS |
A type of MOSFET using holes to conduct current in the semiconductor channel. The channel has a predominantly
positive charge. |
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P/O |
Purchase Order |
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PA |
Product Analysis
|
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Passivation |
The protective coating placed on the entire die surface, usually silicon dioxide or silicon nitride. Also
called glassivation. |
|
PCM |
Pulse Code Modulation, digital transmission
of analog signals by sending periodic binary-coded samples of the
signal value.
|
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PE |
Product Evaluation
|
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Photoresist |
Light-sensitive material deposited as a uniform thin film on a wafer or substrate. Exposure of specific patterns is performed
through masking operations. |
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PIA |
(typically) the product being investigated
|
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PLA |
Programmable Logic Array, a general purpose
logic circuit containing an array of logic gates which can be connected
(programmed) to perform various functions.
|
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PLL or PL2
|
Phase-Lock-Loop, a circuit that compares the
phase difference between a reference frequency and a voltage-controlled
oscillator, whereby the oscillators frequency is changed by
an error voltage until its frequency coincides with the reference.
|
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Probing |
A term used to describe electrical testing that employs very finely-tipped probes applied sequentially to each of the
finished dice on a wafer. |
|
PROM |
Programmable Read Only Memory, a read-only
memory which can be programmed after manufacture by external equipment.
Typically, PROMs utilize fusible links which may be burned open
to produce a logic bit in a specific location.
|
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Protocol |
A set of rules for the formatting and relative timing between communicating processes. |
|
RADC |
Rome Air Development Center
|
|
RAM |
Random Access Memory, which stores digital
information temporarily and can be changed by the user. It constitutes
the basic storage element in a computer. Also called a read/write
memory.
|
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REID |
(chips which can replace money as the medium of exchange) |
|
ROM |
Read Only Memory, which permanently
stores information used repeatedly such as microcode or characters
for electronic display. Unlike RAM, ROM cannot be altered.
|
|
Schottky |
A form of TTL logic in which Schottky diodes are used to clamp the transistors out of saturation, effectively eliminating the
storage of charge within the transistor ... allowing increased switching speeds. |
|
Schottky TTL |
A form of TTL logic in which Schottky diodes are used to clamp the transistors out of saturation, effectively eliminating the
storage of charge within the transistor allowing increased switching speeds. |
|
Semiconductor |
A material with properties of both a conductor and an insulator. Common semiconductors include silicon and (expensive)
germanium. |
|
Silicon Gate |
A type of MOS in which the gate is made of silicon instead of metal. Faster and denser than metal-gate MOS. |
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Slice |
A this disc (not disk) of semiconducting material (usually silicon) on which many separate chips can be fabricated and
then cut into individual Ics. Also known as wafer. |
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SOCMOS |
Selective Oxidation Complementary Metal
Oxide Semiconductor
|
|
SOS |
Silicon-On-Sapphire, a faster MOS technology
in which the silicon is grown on a sapphire wafer only where needed.
Each device is thus isolated by air or oxide from other devices.
|
|
SSI |
Small Scale Integration, Ics containing fewer
than ten logic gates.
|
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Static RAM |
A type of Random Access Memory which does not require periodic referesh cycles, as does dynamic
RAM. |
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TASC*
|
A classified code name for Cold War-Military Contracts held within ICE which carry classified code numbers
(0000 - 4390) |
|
TDM |
Time Division Multiplex, a method of transmitting
several data signals over a single line by assigning each to different
time slots.
|
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Threshold |
The input voltage at which the output logic level changes state. |
|
Transistor |
The basic solid-state device used to amplify or switch electrical current. |
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TTLor T2L
|
Transistor Transistor Logic
|
|
UART |
A commonly-used LSI circuit which serves as a universal (asynchronous) serial communication line controller and data
interface for a microprocessor. |
|
Unipolar |
Transistors with majority current conduction (majority carrier) only, as observed in FETs. |
|
VLSI |
Very Large Scale Integration, these
devices are Ics that contain 1,000 or more gate equivalents.
|
|
Wafer |
A this disc (not disk) of semiconducting material (usually silicon) on which many separate chips can be fabricated and
then cut into individual Ics. Also known as slice. |
|
Alignment |
The arranging of a mask and wafer in correct positions with respect to each other. After alignment, radiation-sensitive
photoresist on the wafer is exposed by radiation passing through the non-opaque areas of the mask. |
|
Aligner |
An optical system used in transferring a mask or reticle image to a wafer. |
|
Active Component |
A (non-mechanical) circuit component that has gain or switches current flow, such as a diode, transistor, etc. |
|
Actinic |
The property of radiant energy, especially in the visible and UV spectral regions, by which chemical changes are
produced. |
|
Acceptor |
An impurity that can make a semiconductor P-type by causing the absence of electrons in the conduction band (called
"holes"). These "holes" are carriers of positive charge. |
|
Alignment Mark |
A reference mark used in the alignment of the several photomask layers required for a single device or circuit. |
|
ALSTTL |
Avanced Low-power Schottky
Transistor Transistor Logic, A fast bipolar logic
family with power dissipation about half that of LSTTL. |
|
Word |
A set of binary bits processed by the computer as the primary unit of information. |