United States Patent 2,756,485Process of Assembling Electrical CircuitsFiled August 28, 1950 |
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Moe Abramson and Stanislaus F. Danko assignors to The United States of Americaas represented by The Secretary of the Army6 Claims (CL.29 -- 155.5) Granted under Title 35, U.S. Code (1952), sec. 266) |
...other attempts to simplify the manufacturing process focused on the interconnection of components. In 1949 Danko and Abrahamson [sic] of the Signal Corps announced the "Auto-Sembly" process,4 in which component leads were inserted into a copper foil interconnection pattern and dip soldered. With the development of board lamination and etching techniques, this concept evolved into the standard printed circuit board fabrication process in use today. |
| IEEE TRANSACTIONS ON ELECTRON DEVICES, Vol. ED-23, No. 7, July 1979 Jack S. Kilby, Fellow, IEEE |
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