| Series 4 |
CONSTRUCTION ANALYSIS
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| Description:
Construction Analysis is a complete physical characterization of a specific circuit. The analysis covers x-ray, optical, scanning electron micrographs, cross sections, topological layout and dimensions, layer thickness, and material analysis. ESD and latchup sensitivity are also included on specific circuit analyses. Some of the many uses ICE has found for construction analysis are: access technology, selecting preferred vendors and second sources, documenting process changes, background for failure analysis and patent investigations. These reports are published and sold through Integrated Circuit Engineering to the industry-at-large. Many are available in the Smithsonian collection on CD-ROM. Most have client-published information added to the analysis as an addendum. For example the... FAIRCHILD 93Z565 PROM, March 1984, outlines the complete chip, from text information to photographs. The construction analysis often rendered the chip useless and non-existent after the investigations were completed. In this case the construction analysis verifies and provides complete definition and locations of the circuit areas, e.g. logic, memory matrix & cells, input/output buffers addresses, decoder(s) and binary addresses. Active links below will display CD-ROM reports which are currently online at this web site. Requires Adobe Acrobat Reader SCA 9712-569: report was issued the 12th month of 1997 and is the 569th report in the series.
SUB 9408-05: report is part of the 1994 series, issued August 1994 and is the 5th report (of six issued). |
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