Series 6
MANUFACTURING FACILITIES

Description:

Publications which provide organized examination of each major IC process, from the older technologies to the more recent CMOS (Complimentary Metal Oxide Semiconductor) and BiCMOS (Device having bipolar and CMOS transistors) processes.

The processes for deposition and the reasons for the use of new materials for IC metalization are reviewed in detail. Each major process from crystal growing through device packaging, is described with clear, concise illustrations (over 400) making it easy to follow the process steps.

While the content is primarily based on silicon processing, the basics of gallium arsinide are covered.

Notes: All the material is in three ring binders, and are published reports.

Box 1 (12)   Box 1 (12), 1980
 
LSI Manufacturing Facilities Concepts
Contents: SAME; published report by ICE; blueprints

Box 1 (12)   Box 1 (12), 1980
 
LSI Manufacturing Facilities Guidelines
Contents: SAME; published report by ICE

Box 1 (12)   Box 1 (12), 1983
 
VLSI Manufacturing Facilities Guidelines, Volume 3
Contents: SAME; published report by ICE; blueprints

Box 1 (12)   Box 1 (12), 1983
 
VLSI Manufacturing Facilities Guidelines, Volume 1
Contents: SAME; published report by ICE

Box 1 (12)   Box 1 (12), 1983
 
VLSI Manufacturing Facilities Guidelines, Volume 2
Contents: SAME; published report by ICE

The Archives Center maintains container lists with unique collection names, series numbers and most important the Archive Center Number. When requesting information for your research either from the collecting division or the Archives it is imperative to include the associated number(s). Your contacts for requesting information and/or appointments to research the Chip Collection are:

NMAH Archives Center
Manuscript Technology Collections

Hal Wallace, Curator - CHIPS
Information Technology & Society - Electricity Collections


National Museum of American History


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