Series 7
Integrated Circuit Engineering Collection
PACKAGING

Description:

A series of published packaging strategies for electronic, semiconductor and solid-state devices.

They describe the intrinsic capabilities of IC technologies and the constraints imposed by packaging. The latest being the MCM.

Box 1 (13)   Box 1 (13), 1982
Electronic Packaging Strategies for the 80’s, Volume 1: Summary for Executives
Contents: published report by ICE

Box 1 (13)   Box 1 (13), 1982
Electronic Packaging Strategies for the 80’s, Volume 2: Application Oriented Considerations
Contents: published report by ICE

Box 1 (13)   Box 1 (13), 1982
Electronic Packaging Strategies for the 80’s, Volume 3: Design Considerations
Contents: published report by ICE

Box 1 (13)   Box 1 (13), 1982
Electronic Packaging Strategies for the 80’s, Volume 4: Density & Speed Considerations
Contents: published report by ICE

Box 1 (13)   Box 1 (13), 1982
Electronic Packaging Strategies for the 80’s, Volume 5: Thermal Considerations
Contents: published report by ICE

Box 1 (13)   Box 1 (13), 1982
Electronic Packaging Strategies for the 80’s, Volume 6: Quality Assurance Reliability and Testing
Contents: published report by ICE

The Archives Center maintains container lists with unique collection names, series numbers and most important the Archive Center Number. When requesting information for your research either from the collecting division or the Archives it is imperative to include the associated number(s). Your contacts for requesting information and/or appointments to research the Chip Collection are:

NMAH Archives Center
Manuscript Technology Collections

Hal Wallace, Curator - CHIPS
Information Technology & Society - Electricity Collections


National Museum of American History


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