Series 9
ICECAP REPORTS

Description:

ICECAP 1980 - 90: A newsletter-type report published by Integrated Circuit Engineering a minimum of 12 times a year. Except where sources of information are referenced, the data presented have been obtained from interviews with industry spokesmen or other public sources.

For example:
THE JAPANESE THREAT: PART I
The increasing penetration of Japanese firms in the world IC market, and particularly into the US market, evokes a number of reactions: general nervousness, downright fear, out-and-out anger, begrudging admiration, and from the more crude, explicative sprinkled with decidedly impolite 3 - letter contractions of the national heritage.

Ironically, at least three of the more outspoken US industry leaders are complaining of unfair practices even while purchasing Japanese ICs to supplement their own production.

And in the general electronics industry the availability of Japanese 16K MOS RAM probably boosted industry output by several hundred million dollars over what would have been possible without the parts.

Other stories included in the May issue are:
  • The Gold Adder: Snake in the Grass
  • Silicon shortage: The Polygraph Syndrome
  • The Shrink: Headache-Maker
  • ISCC World Opinion Forum

The following are examples ICECAP reports transcribed exactly:
  IC Packaging 2-10 (1982)
  GaAs - Still a Promise? 2-12 (1982)

ICECAP newsletters available for review/research by appoinment only:

1981 Issue 1-6: Bonus Issue
1981 Issue 1-7: Lithography: Part 1
1981 Issue 1-8: Editorial Semicustom: High Density Business
1981 Issue 1-9: Lithography: Part 2
1981 Issue 1-10: China: The Door Opens
1981 Issue 1-11: Silver Supply
1981 Issue 1-12: International Electron Devices Meeting - 1981
1982 Issue 2-1: Condesin 4 Megabit Memory Chip
1982 Issue 2-2: Non-volatile Semiconductor Memory: Part One
1982 Issue 2-3: 64K Dram Electrical Characterization
1982 Issue 2-4: Non-volatile Semiconductor Memory: Part Two
1982 Issue 2-5: Motorola 256K Dram Product Review
1982 Issue 2-6: Non-volatile Semiconductor Memory: Part Three
1982 Issue 2-7: Non-volatile Memory: Part 3
1982 Issue 2-8: The IBM-Intel 64K Connection
1982 Issue 2-9: Low Cost is my Name - Yield is my Game
1982 Issue 2-10: IC Packaging - Part One
1982 Issue 2-11: Does Quality Imply Reliability?
1982 Issue 2-12: GaAs - Still a Promise?
1983 Issue 3-1: 64K Dram Design Considerations
1983 Issue 3-2: The Japanese VLSI Robot Marches On
1983 Issue 3-3: System Memory Perspective
1983 Issue 3-4: CMOS Perspective
1983 Issue 3-5: New Approaches to Mainframe Computer Systems
1983 Issue 3-6: Tape Automated Bonding: A New Awakening
1983 Issue 3-7: Integrated Circuit Design: Handcrafting to Automatic
1983 Issue 3-8: IC Fabrication Worldwide
1983 Issue 3-9: HI-REL Semiconductors
1983 Issue 3-10: Semiconductor User Concerns
1983 Issue 3-11: Blind EPROMs
1983 Issue 3-12: MOS: The Linear Alternative
1984 Issue 4-1: ISSCC Conference Review
ICEbreaker Report 4-1: 1984: IC Sales +52 Percent!!!
1984 Issue 4-2: China Trip
1984 Issue 4-3: Play it Again Hewlett-Packard
1984 Issue 4-4: ABoom Time@ Startups
1984 Issue 4-5: GaAs - Another Look
1984 Issue 4-6: Custom Integrated Circuits Conference - >84
1984 Issue 4-7: Packaging Observations
1984 Issue 4-8: Semiconductor Optoelectronics
1984 Issue 4-9: Lithography - Keystone in IC Processing and Economics
1984 Issue 4-10: Profitability in the IC Industry
ICEbreaker Report 4-10: 1985 Forecast
1984 Issue 4-11: 10 Years of IC Company Acquisitions - How Successful?
ICEbreaker Report 4-11: End of Year Shipment Push Holds True to Form
1984 Issue 4-12: 1984 IEDM
1985 Issue 5-1: Television - A Digital IC Fontier
1985 Issue 5-2: The Semiconductor Chip Protection Act of 1984
1985 Issue 5-3: Semiconductor Facility Site Selection Guidelines
1985 Issue 5-4: Silicon Compilers - At the Starting Line
1985 Issue 5-5: Overview of Yield Projection Techniques
ICEbreaker Report, June, 1985: Key Points for 1Q85
1985 Issue 5-6: Japanese Electronic Conglomerates
1985 Issue 5-7: A Comparison of Silicon-on-Insulator Technologies
1985 Issue 5-8: 1985 CICC: Part Two
ICEbreaker Report, October, 1985: U.S. Market Sinks Worldwide Semiconductor Industry
1985 Issue 5-9: Si Valley B GaAs Sky?
ICEbreaker Report, November, 1985: Risky Business
1985 Issue 5-10: Adopting New Competitive Strategies
1985 Issue 5-11: Japanese IC Producers: Tightening the Belt
1985 Issue 5-12: Japan's Semiconductor Facilities
ICEbreaker Report, 4th Quarter 1985: Key Points for 4Q85
1986 Issue 6-1: ASIC Miscellany
1986 Issue 6-2: Reliability and GaAs Symposium Highlights
1986 Issue 6-3: Unique Approaches to ASICs
ICEbreaker Report, 1st Quarter, 1986: Key Points for 1Q86
1986 Issue 6-4: International Electron Devices Meeting: Washington, D.C., December 1-4, 1985
1986 Issue 6-5: Semiconductor Content in Electronic Systems
1986 Issue 6-6: Current and Potentially Emerging Computer Memory Technologies
ICEbreaker Report, 2nd Quarter, 1986: Key Points for 2Q86
1986 Issue 6-7: 1986 Packaging Observations
1986 Issue 6-8: How's Business? An Examination of the First Half of 1986
1986 Issue 6-9: IC Industry Long-Term Records
1986 Issue 6-10: U.S. - Japan Semiconductor Trade Agreement
1986 Issue 6-11: Important Legal Cases Currently Pending
ICEbreaker Report, 2nd Quarter, 1986: Key Points for 3Q86
1986 Issue 6-12: Overview of Laser Applications in Semiconductor Processing
1987 Issue 7-1: IBM Watching
1987 Issue 7-2: Smart Cards - The Next Boom?
1987 Issue 7-3: U.S. Military ASIC Market
1987 Issue 7-4: Distribution Blues
1987 Issue 7-5: Paper Lion Recovery?
1987 Issue 7-6: ASIC Manufacturing - A New Frontier
ICEbreaker Report, 1st Quarter, 1987: Key Points for 1Q87
1987 Issue 7-7: Research Cooperatives: The European Experience
ICEbreaker Report, 2nd Quarter, 1987: Key Points for 2Q87
1987 Issue 7-8: VLSI Packaging Trends
1987 Issue 7-9: A Review of the Traditional IC Foundry
1987 Issue 7-10: New Dynamic RAM Realities
ICEbreaker Report, 3rd Quarter 1987: Key Points for 3Q87
1987 Issue 7-11: The Billion Dollar Club
1987 Issue 7-12: The U.S. - Japan Trade Agreement: 1 2 Years Later
1988 Issue 8-1: Faster than a Speeding Bullet (and CMOS, Too)
1988 Issue 8-2: 1988 Outlook and Forecast
1988 Issue 8-3: AProduction Sharing@ - An Imperative IC Industry Transition
ICEbreaker Report, 1st Quarter, 1988: Key Points for 1Q88
1988 Issue 8-4: Semiconductor Industry Startup (1983-1988) Overview
1988 Issue 8-5: DRAM Dramatics
1988 Issue 8-6: GaAs Continues its Struggle
ICEbreaker Report, 2nd Quarter 1988: Key Points for 2Q88
1988 Issue 8-7:ASICs from Asia
1988 Issue 8-8: High Speed SRAMs - High Speed Market
1988 Issue 8-9: PLDs Come of Age
ICEbreaker Report, 3rd Quarter, 1988: Kep Points for 3Q88
1988 Issue 8-10: Hot Products Realize Enormous Profits - For a Select Few
1988 Issue 8-11: Five-Year DRAM Pricing Forecast
1988 Issue 8-12: Chips and PCs
ICEbreaker Report, 4th Quarter, 1988: Key Points for 4Q88
1989 Issue 9-1: The Korean Miracle: Fire in the East
1989 Issue 9-2: HDTV: The Next PC?
1989 Issue 9-3: 1989 ISSCC Conference Review
ICEbreaker Report, 1st Quarter, 1989: Key Points for 1 Q89
1989 Issue 9-4: Mixed-Mode Ics - An Overview
1989 Issue 9-5: 1989 Custom Integrated Circuit Conference (CICC) Review
1989 Issue 9-6: Quick-Turn Fabrication Equipment
ICEbreaker Report, 2nd Quarter, 1989: Ky Points for 2Q89
1989 Issue 9-7: The New Taiwan (Part 2)
1989 Issue 9-2: Meeting the Challenges of TAB
1989 Issue 9-9: U.S. Military IC Market
ICEbreaker Report, 3rd Quarter, 1989: Key Points for 3Q89
1989 Issue 9-10: 1989 Bi-polar Circuits and Technology Meeting (BCTM) Review
1989 Issue 9-11: Young Lions
1989 Issue 9-12: IC Fab Expansion into other Countries
ICEbreaker Report, 4th Quarter, 1989: Key Points for 4Q89
Report, March 1990, 1M DRAM Prices Firm Up
1990 Issue 10-1: Europe: The Approaching AUnified@ Economic Community
1990 Issue 10-2: 1990 International Solid-State Circuits Conference Review
1990 Issue 10-3: DSP - Transforming the Electronics Industry
ICEbreaker Report, 1st Quarter, 1990: Key Points for 1Q90
1990 Issue 10-4: Fast SRAM Market Review
1990 Issue 10-5: 1990 Custom Integrated Circuit Conference (CICC) Review
1990 Issue 10-6: Semiconductor Facilities: A First Half 1990 Update
ICEbreaker Report, 2nd Quarter 1990: Key Points for 2Q90
1990 Issue 10-7: The DRAM Futures Contracts: Problems of Visibility
1990 Issue 10-8: ROW Update
1990 Issue 10-9: The 1990 IEPS Conference
ICEbreaker Report, 3rd Quarter, 1990: Key Points for 3Q90
1990 Issue 10-10: Bi-polar Process Trends
1990 Issue 10-12: X-Ray Lithography Developments



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