Series 16 Integrated Circuit Engineering Collection Project Files

Project SOCRATES Page 10 of 17 Scanned Image

#4 PARAMETERS OF END ITEMS IDENTIFIED
The technical experts identify the key parameters of the end items. If the end item is not the last end item in the production line then the key parameters are those attributes of the end item which are required for the next process in the production line and or the end item itself to operate at a state-of-the-art level. The key parameters of the last end item are those attributes of the item which are used to measure its state-of-the-artness as dictated by the definition of the technology as required by the consumer. Each Key Parameter listed is an attribute of the End Item which can be represented by a single numerical value. In some cases the value recorded for a parameter will include an "@" statement.

EXAMPLE: *

END ITEMS
LOGIC
KEY PARAMETERS
A. Substrate Wafers
*ORIENTATION ACCURACY
*RESISTIVITY ACCURACY
THEN
B. Epitaxially Built up
*CRYSTAL ORIENTATION
Wafers
*MINIMUM LAYER THICKNESS

 

#5 PROCESSES IDENTIFIED

The technical experts then identify the key processes, in the production line, which are critical to producing each end item identified in step #3 at a state-of-the-art level. The logic terms between Processes are also stated.

EXAMPLE :

END ITEMS LOGIC CRITICAL TECHNOLOGIES LOGIC KEY PARAMETERS
          Elements
 
A. SUBSTRATE
 WAFERS
*ORIENTATION
ACCURACY
*RESISTIVITY
ACCURACY
1.  Wafer Slicing
THEN THEN
2.  Wafer Lapping
B.EPITAXIALLY
  BUILT UP
*CRYSTAL
ORIENTATION
*MINIMUM
LAYER
THICKNESS
1.  CVD Epitaxy
OR
2.  Molecular Beam
     Epitaxy
OR
3.  Liquid Phase
     Epitaxy

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