The Chip Collection - ICE Collection, Project SOCRATES

#4 PARAMETERS OF END ITEMS IDENTIFIED
The technical experts identify the key parameters of the end items. If the end item is not the last end item in the production line then the key parameters are those attributes of the end item which are required for the next process in the production line and or the end item itself to operate at a state-of-the-art level. The key parameters of the last end item are those attributes of the item which are used to measure its state-of-the-artness as dictated by the definition of the technology as required by the consumer. Each Key Parameter listed is an attribute of the End Item which can be represented by a single numerical value. In some cases the value recorded for a parameter will include an "@" statement.

EXAMPLE: *

END ITEMS	LOGIC	KEY PARAMETERS

A. Substrate Wafers		ORIENTATION ACCURACY RESISTIVITY ACCURACY
	THEN
B. Epitaxially Built up		*CRYSTAL ORIENTATION
Wafers		*MINIMUM LAYER THICKNESS

#5 PROCESSES IDENTIFIED

The technical experts then identify the key processes, in the production line, which are critical to producing each end item identified in step #3 at a state-of-the-art level. The logic terms between Processes are also stated.

EXAMPLE :

END ITEMS	LOGIC	CRITICAL TECHNOLOGIES	LOGIC	KEY PARAMETERS
		Elements

A. SUBSTRATE WAFERS				ORIENTATION ACCURACY RESISTIVITY ACCURACY
		1. Wafer Slicing
	THEN		THEN
		2. Wafer Lapping
B.EPITAXIALLY BUILT UP				CRYSTAL ORIENTATION MINIMUM LAYER THICKNESS
		1. CVD Epitaxy
			OR
		2. Molecular Beam Epitaxy
			OR
		3. Liquid Phase Epitaxy

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