|
EXAMPLE:
| END ITEMS | LOGIC |
CRITICAL
TECHNOLOGY
ELEMENTS |
LOGIC |
KEY COMMODITES | LOGIC |
KEY
PARAMETERS |
|---|
|
A. Substrate
Wafers |
*Orientation
Accuracy
*Resistivity
Accuracy |
|---|
| - Wafer
Slicing
|
|---|
| a. Interior
Diamater [sic]
Saws | OR |
*Minimum
Kerf
Width
*Minimum
Induced
Stress |
|---|
| THEN | B. Wire Saws |
|---|
| *Minimum
Kerf
Width
*Minimum
Induced
Stress |
|---|
| - Wafer
Lapping
|
a. Wafer
Polishers | |
*Minimum
Induced
Stress
*Maximum
Polishing
Depth |
|---|
B. Epitaxially
Built
Up Wafers |
*Crystal
Orientation
*Minimum
Gas
Purity |
|---|
| - Molecular
Beam
Epitaxy
|
|---|
| OR | a. MBE Machines |
|---|
| *Maximum
Beam
Precision |
|---|
|
