Series 16 Integrated Circuit Engineering Collection Project Files

Project SOCRATES Page 13 of 17 Scanned Image

EXAMPLE:

END ITEMSLOGIC  CRITICAL
TECHNOLOGY
ELEMENTS
LOGIC KEY COMMODITESLOGIC  KEY
PARAMETERS

A. Substrate
Wafers
*Orientation
  Accuracy
*Resistivity
  Accuracy
  1. Wafer
    Slicing
a. Interior
  Diamater [sic]
  Saws
OR  
 
*Minimum
  Kerf
  Width
*Minimum
  Induced
  Stress
THENB. Wire Saws
*Minimum
  Kerf
  Width
*Minimum
  Induced
  Stress
  1. Wafer
    Lapping
 
a. Wafer
  Polishers
 
 
*Minimum
  Induced
  Stress
*Maximum
  Polishing
  Depth
B. Epitaxially
  Built
  Up Wafers
*Crystal
  Orientation
*Minimum
  Gas
  Purity
  1. Molecular
    Beam
    Epitaxy
ORa. MBE Machines
*Maximum
Beam
Precision

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