Abstract of the Disclosure

This invention relates to the assembly of electrical circuits.

• Figure 1 is a perspective view of a metallic circuit etched from a copper face deposited on a dielectric base or deck.
• Figure 2 is a cross-sectional view illustrating the step of soldering the circuit components to the printed board.
• Figure 3 is a cross-sectional view illustrating an eyelet positioned in a hole on the circuit pattern to which a circuit component is to be secured.
• Figure 4 is a cross-sectional view showing an eyelet interconnecting printed circuits formed on both sides of the base.
• Figure 5 is a cross-sectional view showing a structural connector rod joining the printed circuits formed on both sides of the base.
• Figure 6 is a perspective view showing a multiple deck assembly according to the present invention.

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