PATENT COVER GRAPHIC


United States Patent 3,457,123
July 22, 1969

Methods For Making Semiconductor Structures Having Glass Insulated Islands
Bernard VanPul

Filed June 28, 1965
Image of US PATENT 3,457,123

Abstract of the Disclosure

Disclosed is a method of manufacturing a semiconductor sandwich structure having discrete semiconductor islands therein. A wafer is selectively etched to provide individual cavities therein, and thereafter a glass containing mixture is applied to the etched surface of the wafer and fusion bonded at elevated temperatures between a supporting dummy substrate and the wafer. The supporting substrate and the wafer are both monocrystalline silicon, so that when the sandwich structure is heated to elevated temperatures, no bowing of the wafer takes place. Finally, the unetched surface of the wafer is removed to a depth sufficient to expose portions of the glass and thereby provide monocrystalline semiconductor islands which are each surrounded by an insulating layer of glass
Figure descriptions: cover graphic

  • Figure 1 is an enlarged cross-sectional view of an integrated circuit structure having isolating insulation, which structure constitutes one embodiment of the invention.
  • Figure 2 is a series of cross-sectional views illustrating an integrated circuit structure of the invention at different stages of its manufacture in accordance with the method of the invention, and
  • Figure 3 is a series of cross-sectional views illustrating an integrated circuit structure of the invention at different stages in the in situ formation of the glass isolating the discrete semiconductor islands.

 Citations [54]:
  
3,343,255 06/1965 Donovan 3,381,182 10/1964 Thorton 3,390,022 06/1965 Fa 3,332,137 07/1967 Kenney
National Museum of American History
HomeSearchChip TalkChip FunPatentsPeoplePicturesCreditsCopyrightComments