Abstract of the Disclosure

In placing microminiature circuit elements such as beam lead transistors on a substrate, accurate alignment with the corresponding conducting paths on the substrate is assured by covering the substrate surface with a photoresist, removing the photoresist by a photographic process in those areas in which the circuit elements are to be placed and bonded, and placing elements in the photoresist depressions formed thereby.

• Figure 1 is a sketch of misaligned microminiature circuit elements on a supporting substrate.
• Figure 2 is a sketch of properly aligned microminiature circuit elements on a supporting substrate.

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2,805,968  09/1957  Dunn
3,290,756  12/1966  Dreyer
1,027,550  04/1966  Great Britain