Abstract of the Disclosure

A semiconductor wafer or die bonding tool adapted to be connected to a workholder of a semiconductor bonding apparatus of the type adapted to locate a semiconductor wafer opposite the bonding tool in an approximately oriented position. The apparatus is adapted to engage the bonding tool upon the wafer and in a camming action to orient and position the wafer in the tip of the tool by engagement of perimetrical edges of the upper surface of the wafer upon a recessed working face in the tip of the tool. The working surface in the tip of the tool is characterized by a plurality of individual facets co-operable with upper edge portions of the wafer to avoid contacting the wafer surface during vibration incurred in bonding the wafer to a substrate.

• Figure 1 is a perspective view of a wafer pickup and bonding tool embodying this invention.
• Figure 2 is an enlarged bottom plan view of the wafer pickup and bonding tool.
• Figure 3 is a sectional view taken along lines 3-3 of Figure 1.
• Figure 3A is a sectional view similar to Figure 3 with the wafer being grasped by the tool.
• Figure 4 is a sectional view of a mirrored wafer tray embodied in this invention.

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