Abstract of the Disclosure

The method for forming electrical contacts in the form of metallic bumps by electroplating such bumps through an opening in an electrically insulating film such as the photoresist, the electroplating action being discontinued and portions of the photoresist being removed around the bump formed at this point, after which the electroplating is continued which results in closing or filling in the gap which normally would occur under the bump

• Figures 1 through 5 are successive cross-sectional, elevational views of a portion of a semiconductor device illustrating the formation of an electrical contact or bump to one region thereof.

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