Abstract of the Disclosure

An integrated circuit arrangement disposed on a semiconductor body and composed of active semiconductor components, passive components and conducting paths connecting together the various components, there being at least one component on each of two opposed surfaces of the semiconductor body and the body being formed to present conductive path connections which extend therethrough to permit connections to be made between the two body surfaces.

• Figure 1a is a cross-sectional view of a portion of an arrangement in one stage of fabrication according to the present invention.
• Figure 1b is a view similar to that of Figure 1 of the arrangement in a further stage of fabrication.
• Figure 1c is another view similar to that of Figure 1a showing the arrangement in a still further stage of fabrication.
• Figure 2 is a cross-sectional view of a portion of another unit according to the present invention.

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3,137,796  06/1964  Luscher
3,150,299  09/1964  Noyce
3,350,760  11/1967  Kilby
3,381,182  04/1968  Thornton