PATENT COVER GRAPHIC


United States Patent 3,462,650
August 19, 1969

Electrical Circuit Manufacture
Klaus Hennings
Hans-Jurgen Schiitz
Gerhard Ulbricht


Filed May 6, 1966
Image of US PATENT 3,462,650

Abstract of the Disclosure

An integrated circuit arrangement disposed on a semiconductor body and composed of active semiconductor components, passive components and conducting paths connecting together the various components, there being at least one component on each of two opposed surfaces of the semiconductor body and the body being formed to present conductive path connections which extend therethrough to permit connections to be made between the two body surfaces.
Figure descriptions: cover graphic

  • Figure 1a is a cross-sectional view of a portion of an arrangement in one stage of fabrication according to the present invention.
  • Figure 1b is a view similar to that of Figure 1 of the arrangement in a further stage of fabrication.
  • Figure 1c is another view similar to that of Figure 1a showing the arrangement in a still further stage of fabrication.
  • Figure 2 is a cross-sectional view of a portion of another unit according to the present invention.



 Citations [54]:
  
3,137,796 06/1964 Luscher 3,150,299 09/1964 Noyce 3,350,760 11/1967 Kilby 3,381,182 04/1968 Thornton
National Museum of American History
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