Abstract of the Disclosure

Described is a method for simultaneously producing a multiplicity of semiconductor circuit components, such as for microcircuits. The method comprises providing a semiconductor wafer on one face thereof with electrically functionary regions to ultimately function as respective semiconductor components. Grooves are then etched into said one wafer face thereby removing non-functionary material of the wafer. The wafer on the one face and on the surface of said grooves are provided with conductive electrical connections. Semiconductor material is then removed from the entire other face of said wafer until the resulting wafer pieces containing said functionary regions are mechanically interconnected only by the network formed of the totality of said electrical interconnections and terminal connections. The resulting interspaces are filled with solidifying insulating material.

• Figure 1 shows schematically a longitudinal section of part of a silicon wafer in a first stage of the method according to the invention.
• Figure 2, 3 and 4 illustrate the same sectional portion of the wafer in respective subsequent stages of manufacture.
• Figure 5 illustrates a further stage of the same process.
• Figure 6 shows in a corresponding longitudinal section the ultimate stage relating to the contacting of the terminal connections of one of the microcircuits produced.

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