PATENT COVER GRAPHIC


United States Patent 3,466,741
September 16, 1969

Method Of Producing Integrated Circuits And The Like
Richard Wiesner

Filed May 5, 1966
Image of US PATENT 3,466,741

Abstract of the Disclosure

Described is a method for simultaneously producing a multiplicity of semiconductor circuit components, such as for microcircuits. The method comprises providing a semiconductor wafer on one face thereof with electrically functionary regions to ultimately function as respective semiconductor components. Grooves are then etched into said one wafer face thereby removing non-functionary material of the wafer. The wafer on the one face and on the surface of said grooves are provided with conductive electrical connections. Semiconductor material is then removed from the entire other face of said wafer until the resulting wafer pieces containing said functionary regions are mechanically interconnected only by the network formed of the totality of said electrical interconnections and terminal connections. The resulting interspaces are filled with solidifying insulating material.
Figure descriptions: cover graphic

  • Figure 1 shows schematically a longitudinal section of part of a silicon wafer in a first stage of the method according to the invention.
  • Figure 2, 3 and 4 illustrate the same sectional portion of the wafer in respective subsequent stages of manufacture.
  • Figure 5 illustrates a further stage of the same process.
  • Figure 6 shows in a corresponding longitudinal section the ultimate stage relating to the contacting of the terminal connections of one of the microcircuits produced.

 Citations [54]:
  
3,074,145 01/1963 Rowe 3,307,239 03/1967 Lepselter 3,158,788 11/1964 Last 1,188,731 03/1965 Germany 3,206,647 09/1965 Kahn 3,290,753 12/1966 Chang 3,300,832 01/1967 Cave
National Museum of American History
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