PATENT COVER GRAPHIC


United States Patent 3,471,754
October 7, 1969

Isolation Structure For Integrated Circuit
Kinji Hoshi
Kinji Wakamiya


Filed March 22, 1967
Image of US PATENT 3,471,754

Abstract of the Disclosure

An integrated circuit containing an insulating base having depressions therein with semiconductor pellets being received within the depressions and bonded therein by means of an epitaxial growth layer.
Figure descriptions: cover graphic

  • Figure 1 is a fragmentary plan view of a substrate used in accordance with the present invention.
  • Figure 2 is a cross-sectional view taken substantially along the line II-II of Figure 1.
  • Figure 3 is an enlarged plan view of the substrate after the semiconductor pellets have been deposited therein.
  • Figure 4 is a cross-sectional view taken substantially along the line IV-IV of figure 3.
  • Figure 5 is an enlarged plan view of the assembly after the epitaxial layer has been deposited thereon.
  • Figure 6 is a cross-sectional view taken substantially along the line VI-VI of Figure 5.
  • Figure 7 is an enlarged plan view of the assembly after the excess epitaxial layer has been removed therefrom.
  • Figure 8 is a cross-sectional view taken substantially along the line VIII-VIII of Figure 7.

 Citations [54]:
  
2,817,048 12/1957 Thuermel 3,128,332 04/1964 Burkig 3,133,336 05/1964 Marinace 3,169,892 02/1965 Lemelson 3,377,513 04/1968 Ashby
National Museum of American History
HomeSearchChip TalkChip FunPatentsPeoplePicturesCreditsCopyrightComments