Abstract of the Disclosure

This is a process for mass producing semiconductor devices. Each of a plurality of semiconductor wafers are mounted on one of a group of conductive leads which extend from a sheet metal member. The first conductive lead is directly connected to the collector electrode while the base and emitter electrodes are connected to adjacent conductive leads by soldered leads. The wafer and adjacent portions of the conductive leads are immersed in encapsulating material and the device is encapsulated. The conductive leads are then severed from the sheet metal member to yield a finished device.

• Figures 1 and 2 show two different embodiments of the invention.

 Citations [54]:
  
3,121,279  02/1964  Van Hoof
3,341,649  09/1967  James
3,171,187  03/1965  Ikeda