PATENT COVER GRAPHIC


United States Patent 3,491,435
January 27, 1970

Process For Manufacturing Headless Encapsulated Semiconductor Devices
Horst Knau
Valentin Moll
Dieter Sautter


Filed May 25, 1966
Image of US PATENT 3,491,435

Abstract of the Disclosure

This is a process for mass producing semiconductor devices. Each of a plurality of semiconductor wafers are mounted on one of a group of conductive leads which extend from a sheet metal member. The first conductive lead is directly connected to the collector electrode while the base and emitter electrodes are connected to adjacent conductive leads by soldered leads. The wafer and adjacent portions of the conductive leads are immersed in encapsulating material and the device is encapsulated. The conductive leads are then severed from the sheet metal member to yield a finished device.
Figure descriptions: cover graphic

  • Figures 1 and 2 show two different embodiments of the invention.

 Citations [54]:
  
3,121,279 02/1964 Van Hoof 3,341,649 09/1967 James 3,171,187 03/1965 Ikeda
National Museum of American History
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