PATENT COVER GRAPHIC


United States Patent 3,494,017
February 10, 1970

Method Of Mounting Beam Lead Semiconductor Devices For Precision Shaping
Austin L. Tyler

Filed September 29, 1967
Image of US PATENT 3,494,017

Abstract of the Disclosure

In the fabrication of semiconductor integrated circuits of the type using dielectric isolation, precision mounting for polishing and precision etching is achieved using a mounting medium based on a polybutadiene styrene resin. The mounting medium is applied using a two-step procedure including a carefully controlled force-time sequence followed by a curing cycle in order to attain the desired precise mounting medium thickness.
Figure descriptions: cover graphic

  • Figures 1 through 4 show in cross-sectional views, the sequence of steps of a mounting procedure in accordance with the invention.

 Citations [54]:
  
2,984,897 05/1961 Godfrey 3,078,559 02/1963 Thomas 3,158,927 12/1964 Saunders 3,226,804 01/1966 Hasenclauer 3,417,454 12/1968 Beasley
National Museum of American History
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