PATENT COVER GRAPHIC

United States Patent 3,508,325
April 28, 1970

Method Of Making Insulation Structures For Crossover Leads In Integrated Circuitry
Thomas A. Perry

Filed January 25, 1965
Image of US PATENT 3,508,325

Abstract of the Disclosure

Disclosed are methods of fabricating lead arrangements for integrated circuits having multiple levels of conductive leads separated by insulated layers at the surface of a semiconductor substrate wherein an insulating layer spaced from a substrate surface preferably comprises a photo-definable material.
Figure descriptions: cover graphic

  • Figure 1 shows a semiconductor substrate having various components diffused therein. 

 Citations [54]:
  
3,266,127  08/1966  Harding
3,292,128  12/1966  Hall
3,312,871  04/1967  Seki
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