PATENT COVER GRAPHIC


United States Patent 3,536,964
October 27, 1970

Semiconductor Device Sealed Gas-Tight By Thixotropic Material
Udo Lob
Hans-Jurgen Nixdorf


Filed July 13, 1967
Image of US PATENT 3,536,964

Abstract of the Disclosure

A semiconductor component is sealed in a housing by an intermediate portion of thixotropic fusible synthetic material which fills the gap formed between an under housing member and an over housing member in a gas-tight manner. The under housing member supports the semiconductor component and the over housing member covers the semiconductor component.
Figure descriptions: cover graphic

  • Figure 1 is a view, partly in section, of a first embodiment of the semiconductor device of the present invention, prior to heating.
  • Figure 2 is a view, partly in section, of the embodiment of Figure 1 subsequent to heating.
  • Figure 3 is a view, partly in section,of a second embodiment of the semiconductor device of the present invention, prior to heating.

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2,636,062 04/1953 Colton 3,241,010 03/1966 Eddleston 2,817,048 12/1957 Thuermel et al 3,299,328 01/1967 Martin et al 3,085,180 04/1963 Zwijsen 3,310,716 03/1967 Emeis 3,221,277 11/1965 Hauer 3,328,650 06/1967 Boxer 3,223,903 12/1965 Solomon 3,337,678 08/1967 Steimak 3,231,795 01/1966 Steinelper
National Museum of American History
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