PATENT COVER GRAPHIC


United States Patent 3,539,882
November 10, 1970

Flip Chip Thick Film Device
Charles D. Mulford, Jr
Charles F. Carroll


Filed May 22, 1967
Image of US PATENT 3,539,882

Abstract of the Disclosure

A thick film device that utilizes a flip chip type of semiconductor device mounted in an inverted manner on a thick film sustrate.
Figure descriptions: cover graphic

  • Figure 1 is a diagrammatic view of a semiconductor utilized in one embodiment of the invention.
  • Figure 2 is an end view illustrating the mounting of the device of Figure 1 on a thick film substrate.
  • Figure 3 is a diagrammatic view of a device illustrating another embodiment of the invention.
  • Figure 4 is an end view illustrating the mounting of the device of Figure 3 on a thick film substrate.



 Citations [54]:
  
3,292,240 12/1966 McNutt et al. 3,303,393 02/1967 Hymes et al. 3,361,868 01/1968 Bachman 3,373,481 03/1968 Lins et al. 3,374,533 03/1968 Burks et al. 3,380,155 04/1968 Burks 3,388,301 06/1968 James 3,404,215 10/1968 Burks et al.
National Museum of American History
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