TI number: G00361
Preforms, Gold - Gold preforms such as these have been widely used in semiconductor device production. Because gold readily alloys with germanium and silicon, the preforms provided a covalent and reliable means of mounting semiconductor chips.

The material was usually 3 - 5 mils thick approximately 99.999% pure. In some applications, it would have a small amount of germanium alloyed in to lower the melting point. The size of the preform was normally about the same as that of the chip being mounted.

Summary comment by: Jim Lineback, Jimmy Squires, Bob Wallace.