TI number: G00198
Module Construction Display - This display shows the steps in the production of hybrid modules for IBM in the program known as ASLT by TI. These modules were produced in the Sherman plant from 1966 to 1968.

This series of modules were designed and originally built by IBM. The original TI Sherman plant was built in 1964 for this program, and the first production team underwent an extensive training program at the IBM Fishkill facility. The semiconductor chips were single and dual transistors and diodes. ASLT was superceded in 1968 by MST utilizing monolithic IC's and a single substrate.

Related material in collection: G00261. Summary comment by: Gene McFarland.

TI number: G00028
Transistor Fabrication Display - Shows process steps involved in the fabrication of the 2N1047 series of diffused mesa silicon power transistors. The 2N1047 was introduced in early 1958.

Item was part of original S/B Lobby display.

Related material in collection: G00273. Summary comment by: Howard Moss, Harry Owens, Elmer Wolff.

TI number: G00169
Header boat, graphite - This is the last graphite boat used for mass production of headers at TI - December, 1963. Graphite was replaced by ceramic.

TI started production of glass-to-metal seal headers for internal use in the spring of 1959. This graphite boat is typical of those used.

Summary comment by: Bill Dees, George Johns.

TI number: G00340
Transistor Automated Tape Assembly Display - SATAN was a TI project of 1970-72 that produced an automated assembly on tape of germanium transistors designed for thick film hybrid circuit applications.

SATAN was an acronym for Semiconductor Automated Tape Assembly with the "N" added to become SATAN. The construction is described in bulletins and data sheets in the Artifact Historical Files. The assembly was not fully automatic. Positioning for chip mounting, wire bonding and epoxy application was operator controlled with the use of TV monitors. The operation was activated by an operator controlled switch. The equipment was designed and built in the TI Deutschland plant. SATAN devices were especially designed to provide the thick film hybrid user with the ability to fabricate systems using a single mounting technique for all components. Also, these devices could be mounted in a TO-18 package if desired, as shown in the display. Production rates reached approximately 50k units per month for over a year. The principal customer was RCA Indianapolis for the XL100 color television audio circuit. Small quantities were used by others, such as Zenith. The limited hybrid thick film applications resulted in cancellation of the project.

Summary comment by: John Burge, Lee Kitchens.

TI number: G00261
Platform, Discrete Component - The item is two device mounting platforms with components. These were used for thick film circuits built in the Sherman plant for IBM and referred to as ASLT. See G00198 for fabrication steps.

See G00198 for additional information on ASLT.

Related material in collection: G00198. Summary comment by: Gene McFarland.

TI number: G00261
Platform, Discrete Component - The item is two device mounting platforms with components. These were used for thick film circuits built in the Sherman plant for IBM and referred to as ASLT. See G00198 for fabrication steps.

See G00198 for additional information on ASLT.

Related material in collection: G00198. Summary comment by: Gene McFarland.

TI number: G00253
Welder, Hand Held Tweezer - The item is the engineering prototype tweezer welder designed and built in SC Mechanization in 1958-9. These welders had wide use in production to fasten the device lead wires to the header (package) posts.

The welder was designed and produced at TI because there was not anything equivalent available on the market.

Summary comment by: Jim Moreland.

TI number: G00303
Crucible, Graphite - This graphite crucible with the quartz liner is the type used at TI in the early semiconductor activity. When the capability was developed to handle larger melts and grow larger crystals, about 1959-60, these crucibles were limited to use for grown junction transistor crystals.

This style crucible remained in use at TI until 1977 because of the continued production of silicon grown junction transistors. The liner and crucible were damaged because the melt was not completely used in growing the last crystal.

Summary comment by: Walt Runyan.

TI number: G00020
Transistor Fabrication Display - Display of the process steps in the fabrication of the 2N339 series of medium power grown junction silicon transistors. This series was introduced by TI in 1956.

Items in display: 1)Silicon,high purity material 2)Silicon single crystal seed 3)Silicon grown junction crystal 4)Silicon,half crystal 5)Silicon crystal with Cavitron cut 6)Silicon transistor bar 7)Transistor bar with fused wire 8)Transistor bar with lead dipped ends 9) Transistor bar soldered onto header 10)Transistor canned.

Related material in collection: G00010, 11. Summary comment by: Jim Lacy, Howard Moss, Harry Owens, Chuck Swenson.

TI number: G00014
Transistor, Ladder Assembly Display - Represents early 1954 effort to improve production methods by group fabrication.

Multiple germanium bars were fused to platinum strips with a Au-Ge die and platinum wire fused to bar junction with indium dot in single furnace operation. Bar units were cut apart and mounted on the header by welding. This process provided improved productivity at the time and was used at TI from 1954 to 1956 for some production.

Related material in collection: G00004. Summary comment by: Jim Lineback, Elmer Wolff.

TI number: G00111
Transistor Processing Display - The display illustrates crystals and processing steps for various silicon transistors of the late 1960's and early 1960's.

The item was part of the original S/B Lobby display. The display includes a single resistivity silicon crystal, a silicon grown junction transistor crystal, various processed slices and bars and uncapped transistors representing some of process steps used at that time.

Related material in collection: G00020, 28, 112 and 113. Summary comment by: Jim Lacy, Howard Moss, Harry Owens.

TI number: G00335
Production Process Display - This display, built about 1958, was used to illustrate the major process steps being used in manufacturing the product lines of the division.

Production steps for the following products are illustrated: Grown junction silicon transistor, Diffused-base ("mesa") silicon transistor, Alloy junction germanium transistor, Diffused-base ("mesa") germanium transistor, Diffused junction silicon diode, 1500 volt single junction silicon rectifier, Carbon film precision molded resistor, tan-TI-cap solid tantalum capacitor.

Related material in collection: 1987.0487.363(Identical Display). Summary comment by: Jim Lacy, Howard Moss, Harry Owens.

TI number: G00141
Production process display - This display was made in 1959 to show the principal process steps in making typical TI components of the period.

The following products are shown: Silicon grown junction transistors; Silicon diffused base mesa transistors; Germanium alloy junction transistors; Germanium diffused base mesa transistors; Silicon diffused junction diodes; Silicon 1500V single junction rectifiers; Carbon film precision resistors; Solid tantalum capacitors.

Related material in collection: 1987.0487.362(Identical display). Summary comment by: Jim Lacy, Howard Moss, Harry Owens.

TI number: S00315
Watch Assembly Display - The display shows the parts and fabrication steps for two TI watches, lady's and man's, in plastic cases. Also shown are five 3" slices illustrating stages in slice processing.

In addition to the slices, the display contains photographs of six different IC chips. The steps from lead frame to plastic module are shown, with two samples molded in clear plastic to show the position of the IC. Module parts, assembled modules, case parts and assembled watches are displayed. The module design and assembly method was common to all TI watches. The X-830 chip was the first TI watch chip and was designed with I2L (Current Injection Logic) technology. It was used in the first TI watch modules (1975) which were sold to Benrus but were not used by TI for watches. The X-902, also I2L, was the next design and was widely used in TI watches, which were introduced in late 1975. It was probably the largest volume chip used. The IC and module design and manufacturing technology not only made possible an electronic watch but provided the means for cost reductions and an accurate very low cost watch.

Summary comment by: Wally Banzhaf, Hector Cardenas, Bill Heye, Clark Williams.

TI number: G00004
Transistor, Ladder Assembly Display - This technique was an early (1954) effort to improve production by small batch fabrication.

Was part of the original South Building lobby display. Multiple germanium bars were fused to platinum strips with Au-Ge die, and platinum wire was fused to bar junctions with dots in a single furnace operation. Bar units were cut apart and mounted on a header by welding. This process provided improved productivity at the time and was used at TI from 1954 to 1956. The item is mounted on a display panel and has a separate display drawing of the assembly.

Related material in collection: G00014. Summary comment by: Jim Lineback, Elmer Wolff.

TI number: G00030
Header Fabrication Display - Displays step by step fabrication of the first 1/4in x 1/8in IC flatpack header design.

The final seal for this package was made by solder sealed kovar lid. The ceramic base, ring frame and lead frame were sealed together with glass frit. This design was used in the 1959-62 time period.

Related material in collection: G00031. Summary comment by: Willis Adcock, Bill Brower, Jack Kilby.

TI number: G00031
Header Fabrication Display - Displays step by step fabrication of the second production version of the 1/4" x 1/8" IC flatpack.

The header has a kovar base plate stitch welded to the lead frame. The lead frame was sealed to the ring frame with glass frit. For final seal, a kovar lid was stitch welded to the ring frame. Production in this package was started in early 1963. Although refinements in the design were made from time to time, it remaind the basic flatpack and was used for many special transistor and diode applications as well as IC's.

Related material in collection: G00030 Summary comment by: Willis Adcock, Bill Brower, Jack Kilby.

TI number: G00334
Integrated Circuit Fabrication Display - Displays step by step process of the fabrication of an integrated circuit (initially called Semiconductor Network at TI). The display probably was made in 1962 or early 1963 and represents production of that period.

This item is the same G00027 & 148 except for part details. The estimated date for the display is based on the 7/8" slice diameter, mask size, package construction and painted device.

Related material in collection: G00027, 148. Summary comment by: Willis Adcock, Howard Moss, Charles Phipps.

TI number: G00276
Bonder, Thermal Compression Ball - This hand operated ball bonder is a TI designed and built model of the type widely used to ball bond a gold wire to the transistor or integrated circuit chip.

The bonder is complete except for the microscope. The date manufactured is not known, but its last use was on microwave devices. It was taken out of production about June 1, 1985. The basic design was put into use about 1960. Production of these bonders, with evolutionary improvements, continued until about 1970 when TI designed automatic bonders began to take over. Use of these bonders continued for many special applications, and some are still in use at this time.

Related material in collection: PG00024. Summary comment by: Rich Mahle, Jim Moreland.