Texas Instruments Collection Integrated Circuit

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Summary comments provided by Texas Instruments' staff.


   
G00187   NMAH Catalog Number 1987.0487.035
 
TI number: G00187
Array, large scale integration - See G00186 for complete description.

Related material in collection: G00026, 186, 191-4, 306, 333. Summary comment by: Jim Hull, Jack Kilby, Charles Phipps.

G00192   NMAH Catalog Number 1987.0487.036
 
TI number: G00192
Array, large scale integration -

G00193   NMAH Catalog Number 1987.0487.037
 
TI number: G00193
Array, Large Scale Integration - Item is an early display sample LSI/DRA device used by the Equipment Group in conjunction with the Reliable Advanced Solid-State Radar (RASSR) program.

Metal lid indicates one of the early prototype devices. The serial number used indicates it was not a good working unit. See G00186 for fabrication discussion. See G00194 for RASSR application information.

Related material in collection: G00026, 186-7, 191-2, 194, 306, 333. Summary comment by: Jim Hull, Jack Kilby, Charles Phipps.

G00191   NMAH Catalog Number 1987.0487.038
 
TI number: G00191
Wafers, array, large scale integration - Display has three slices illustrating the three successive levels of metalization.

See G00186 for fabrication discussion.

Related material in collection: G00026, 186-7, 192-4, 306, 333. Summary comment by: Jim Hull, Jack Kilby, Charles Phipps.

G00395   NMAH Catalog Number 1987.0487.050
 
TI number: G00395
Photo Available Integrated Circuit Flip Flop Display - This display was built and used for demonstration of the TI Type 502 Flip Flop which was the first production IC offered to the commercial market by TI. It was announced in March, 1960, and sold for $450 each.

The display was used at the 1961 IRE show to demonstrate the operation of the Flip Flop. The first unit is connected as oscillator driving a counter. A scope was connected to monitor and display the wave form. Heidt reported that the display was operated for several years as a form of life test and, also, that in February, 1986, four of the units would still function.

Related material in collection: G00013, 342, PG00083, 97. Summary comment by: Don Heidt, Jim Hull, Jack Kilby, Charles Phipps.

G00392   NMAH Catalog Number 1987.0487.060
 
TI number: G00392
Integrated Circuit - This boxed set contains an open and a sealed IC representing probable late 1963 or early 1964 production. SN022 indicates a special device type, possibly from the SN51 family. Without opening, it is not known if both are the same type.

Aluminum-Gold lead pattern not on grid. The chip still had the curved interconnects but all bonding pads are shown on the edge of the chip. Downhill bonding to the package leads was typical of the early package designs, resulting in a potential problem of the wire shorting to the chip.

Summary comment by: Willis Adcock, Jim Lacy, Howard Moss.

G00410   NMAH Catalog Number 1987.0487.062
 
TI number: G00410
Integrated Circuit, Flip Flop - This SN530 has a date code of 412, 12th week of 1964, which indicates it was one of the earliest production devices of series. The initial devices of the series were announced in early 1964. The circuit is a Single-phase J-K Flip-flop with preset.

The SN53/73 circuitry was modified diode transistor logic (DTL) in which transistors replaced conventional diodes to improve performance compared to DTL circuitry. This series was not interchangeable with the standard 930 DTL IC's. The SN53 series was specified for military applications with a free-air operating temperature range of -55 degrees to +125 degrees C. The SN73 series was specified for industrial applications with a range of 0 degrees to +70 degrees C. The SN53/73 series remained in production to the mid 1970's.

Related material in collection: G00293. Summary comment by: Gerald McGee, Charles Phipps.

L00396   NMAH Catalog Number 1987.0487.066
 
TI number: L00396
Test Board, Integrated Circuit - This item is an earlier version of the IC test board, L00230. See the Artifact Identification Sheet for additional information.

These boards were used extensively for engineering test and evaluation work, even after introduction of the Mech Pak carrier. Pressing the board down on a flat surface raised the board contacts so that the IC could be placed under them. The IC type is not known, but the gold metalization and the pattern design indicates a 1964-5 device.

Related material in collection: G00096, 82, L00230, 397. Summary comment by: Bill Brower, Ralph Dosher, Charles Phipps.

L00397   NMAH Catalog Number 1987.0487.067
 
TI number: L00397
Test Board, Integrated Circuit - This board is a latter version of the board, G00096, designed to hold a flat pack IC mounted in the Mech pak carrier of testing and burn-in. This board was probably done in 1964.

These board designs originated in the SC Group Integrated Circuits. The production design was a joint effort with Industrial Products of Apparatus which manufactured them. They were widely sold to TI's flatpack customers. Industrial Products in Houston subsequently became a part of Data Systems Group. See Related Material for additional information.

Related material in collection: G00082, 96-7, L00230, 396. Summary comment by: Bill Brower, Ralph Dosher, Charles Phipps.

G00398   NMAH Catalog Number 1987.0487.068.01
 
TI number: G00398
Test Board, Integrated Circuits - These boards are one of the first designs of a test board to handle IC's in the flatpack (1959-61). The design preceded that represented by L00396 and required the device to be soldered in place.

The type IC soldered to each board is not known, but each is in the original solder seal package. The meaning of the numbers is not known, but they apparently were for identification in testing. In that period, the limited number of IC's made this method of mounting reasonable. This board provided a convenient and protected means of handling these somewhat fragile new packages, although their removal required care. Experience led to the design of the spring clip board.

Related material in collection: L00230, 396. Summary comment by: Bill Brower, Jim Hull, Charles Phipps.

G00398   NMAH Catalog Number 1987.0487.068.02
 
TI number: G00398
Test Board, Integrated Circuits - These boards are one of the first designs of a test board to handle IC's in the flatpack (1959-61). The design preceded that represented by L00396 and required the device to be soldered in place.

The type IC soldered to each board is not known, but each is in the original solder seal package. The meaning of the numbers is not known, but they apparently were for identification in testing. In that period, the limited number of IC's made this method of mounting reasonable. This board provided a convenient and protected means of handling these somewhat fragile new packages, although their removal required care. Experience led to the design of the spring clip board.

Related material in collection: L00230, 396. Summary comment by: Bill Brower, Jim Hull, Charles Phipps.

G00383   NMAH Catalog Number 1987.0487.069.01
 
TI number: G00383
Wafers, Integrated Circuit - These slices are from a TMX3536 Video Display Processor prototype lot processed in the TIJ Miho Front End in early 1982. The TMX indicates an engineering development sample of the TMS3536. See G00382 for description of the device and its development.

These are 125 mm. slices, one of which was received broken in two pieces. The bar (chip) size is .222" x .206", and the process is MOS. See the Artifacts Historical File for additional information.

Related material in collection: G00382. Summary comment by: Jean Luc Villevieille.

G00383   NMAH Catalog Number 1987.0487.069.02
 
TI number: G00383
Wafers, Integrated Circuit - These slices are from a TMX3536 Video Display Processor prototype lot processed in the TIJ Miho Front End in early 1982. The TMX indicates an engineering development sample of the TMS3536. See G00382 for description of the device and its development.

These are 125 mm. slices, one of which was received broken in two pieces. The bar (chip) size is .222" x .206", and the process is MOS. See the Artifacts Historical File for additional information.

Related material in collection: G00382. Summary comment by: Jean Luc Villevieille.

G00371   NMAH Catalog Number 1987.0487.102
 
TI number: G00371
Integrated Circuit - This is an uncapped packaged gate array chip from a slice represented by G00370. It is a good example of the application of E-Beam Direct Writing for the preparation of Applications Specific Integrated Circuits (ASIC).

The item is a 1985 product and was submitted, with G00370, by TIL as a 1985 significant development. See the Artifacts Historical File for additional information.

Related material in collection: G00370. Summary comment by: Chris Black.

G000367   NMAH Catalog Number 1987.0487.104.01
 
TI number: G000367
Integrated Circuits, Tachometer Driver - This device represented one of TIL's first major automotive engagements. The circuit performs the frequency to voltage conversion required to display the revolutions of a car's engine or drive shaft on an analog voltmeter.

The technology is standard N+bipolar with DUF, epitaxial collector, diffused isolation, diffused base/emitter and aluminum metallization. The device was developed in 1970-1, and production began about 1973. Starting in 1975, 500K units have been shipped annually, with shipments expected to continue into the 1990's. Several other devices having only slight specification variations are available from TIL. See the Artifact Historical File for additional information.

Related material in collection: G00368, Z00369. Summary comment by: Barry Cooper, Dave Cutler.

G000367   NMAH Catalog Number 1987.0487.104.02
 
TI number: G000367
Integrated Circuits, Tachometer Driver - This device represented one of TIL's first major automotive engagements. The circuit performs the frequency to voltage conversion required to display the revolutions of a car's engine or drive shaft on an analog voltmeter.

The technology is standard N+bipolar with DUF, epitaxial collector, diffused isolation, diffused base/emitter and aluminum metallization. The device was developed in 1970-1, and production began about 1973. Starting in 1975, 500K units have been shipped annually, with shipments expected to continue into the 1990's. Several other devices having only slight specification variations are available from TIL. See the Artifact Historical File for additional information.

Related material in collection: G00368, Z00369. Summary comment by: Barry Cooper, Dave Cutler.

G00372   NMAH Catalog Number 1987.0487.105.01
 
TI number: G00372
Integrated Circuits - This circuit and the 2N2322 were probably the first ALU designs made in TI. The designs were done in 1966-7, using standard TTL; and production continued until 1979-80.

These devices illustrate the international nature of the TI semiconductor operations. They were designed for and used in a Nixdorf computer. The program was sold by TID; circuits were designed by the IC design group in Dallas, and product was then manufactured and shipped by TID. However, the symbolization of these units indicate they were assembled by TIL in 1979. The companion units, G00373, show Freising (TID). See the Artifact Historical File for additional information.

Related material in collection: G00373. Summary comment by: Walter Bucksch, Guenter Heinecke.

G00372   NMAH Catalog Number 1987.0487.105.02
 
TI number: G00372
Integrated Circuits - This circuit and the 2N2322 were probably the first ALU designs made in TI. The designs were done in 1966-7, using standard TTL; and production continued until 1979-80.

These devices illustrate the international nature of the TI semiconductor operations. They were designed for and used in a Nixdorf computer. The program was sold by TID; circuits were designed by the IC design group in Dallas, and product was then manufactured and shipped by TID. However, the symbolization of these units indicate they were assembled by TIL in 1979. The companion units, G00373, show Freising (TID). See the Artifact Historical File for additional information.

Related material in collection: G00373. Summary comment by: Walter Bucksch, Guenter Heinecke.

G00373   NMAH Catalog Number 1987.0487.106.01
 
TI number: G00373
Integrated Circuits - This circuit and the SN2321 were probably the first ALU designs made in TI. The designs were done in 1966-7, using standard TTL; and production continued until 1979-80.

These devices illustrate the international nature of the TI semiconductor operations. They were designed for and used in a Nixdorff computer. The program was sold by TID; circuits were designed by the IC design group in Dallas, and product was then manufactured and shipped by TID. The symbolization on these units indicate they were assembled in 1979 by TID in Freising. The companion units, G00372, indicate 1979 assembly by TIL. See Artifact Historical File for additional information.

Related material in collection: G00372. Summary comment by: Walter Bucksch, Guenter Heinecke.

G00373   NMAH Catalog Number 1987.0487.106.02
 
TI number: G00373
Integrated Circuits - This circuit and the SN2321 were probably the first ALU designs made in TI. The designs were done in 1966-7, using standard TTL; and production continued until 1979-80.

These devices illustrate the international nature of the TI semiconductor operations. They were designed for and used in a Nixdorff computer. The program was sold by TID; circuits were designed by the IC design group in Dallas, and product was then manufactured and shipped by TID. The symbolization on these units indicate they were assembled in 1979 by TID in Freising. The companion units, G00372, indicate 1979 assembly by TIL. See Artifact Historical File for additional information.

Related material in collection: G00372. Summary comment by: Walter Bucksch, Guenter Heinecke.

G00380   NMAH Catalog Number 1987.0487.107.01
 
TI number: G00380
Integrated Circuits - These devices are samples made in early 1970 in the MOS Design Center in Nice. The process was called SAMNOS for self aligned MNOS. The technology was based on the masking efficiency of the silicon nitride which was used as a diffusion mask and an oxidation barrier.

The process was described by Bernard Bazin in SOLID-STATE ELECTRONICS, 1972, Vol. 15. A patent for the process was issued in France in 1972. Copies of the article and the patent are in the Artifacts Historical File. The design used was that of an earlier device, a quadruple decade counter with memory. Bar size is 111 x 94 mils. The performance of both were similar except that the maximum input frequency was doubled for the SAMOS version. See the Artifacts Historical File for additional information.

Related material in collection: PG00094 Summary comment by: Jean Lesieur.

G00380   NMAH Catalog Number 1987.0487.107.02
 
TI number: G00380
Integrated Circuits - These devices are samples made in early 1970 in the MOS Design Center in Nice. The process was called SAMNOS for self aligned MNOS. The technology was based on the masking efficiency of the silicon nitride which was used as a diffusion mask and an oxidation barrier.

The process was described by Bernard Bazin in SOLID-STATE ELECTRONICS, 1972, Vol. 15. A patent for the process was issued in France in 1972. Copies of the article and the patent are in the Artifacts Historical File. The design used was that of an earlier device, a quadruple decade counter with memory. Bar size is 111 x 94 mils. The performance of both were similar except that the maximum input frequency was doubled for the SAMOS version. See the Artifacts Historical File for additional information.

Related material in collection: PG00094 Summary comment by: Jean Lesieur.

G00381   NMAH Catalog Number 1987.0487.108
 
TI number: G00381
Wafer Integrated Circuit - The two slices are from the engineering work on the development of a semiconductor TV channel switch. The work was done by TID in Freising from mid 1971 to mid 1972. The customer was Grundig.

The switch was designed for eight TV channel which could be selected randomly. To achieve this function, four chips were required, two analog switch and two control chips derived from two master chips with lead pattern alterations. Two 28 pin packages, each with an analog and a control chip, were used. These two slices contain SN16781 Analog Switch chips (.102" x .076") and SN16837 Control chips (.103" x .122"). Processing was standard TI linear bipolar. The SN16837 was a reservation on the original chip, the SN16775, but was not used in full production because of a complete chip set redesign. Design work started August, 1971; the first packaged samples were available October, 1971. Production shipments were started in mid 1972 with the revised chips and has been continuous to date, June, 1986. Patents were secured both in Germany and the United States. See the Artifacts Historical File for additional information.

Summary comment by: Walter Bucksch, Guenter Heinecke.

G00381   NMAH Catalog Number 1987.0487.109
 
TI number: G00381
Wafer Integrated Circuit - The two slices are from the engineering work on the development of a semiconductor TV channel switch. The work was done by TID in Freising from mid 1971 to mid 1972. The customer was Grundig.

The switch was designed for eight TV channel which could be selected randomly. To achieve this function, four chips were required, two analog switch and two control chips derived from two master chips with lead pattern alterations. Two 28 pin packages, each with an analog and a control chip, were used. These two slices contain SN16781 Analog Switch chips (.102" x .076") and SN16837 Control chips (.103" x .122"). Processing was standard TI linear bipolar. The SN16837 was a reservation on the original chip, the SN16775, but was not used in full production because of a complete chip set redesign. Design work started August, 1971; the first packaged samples were available October, 1971. Production shipments were started in mid 1972 with the revised chips and has been continuous to date, June, 1986. Patents were secured both in Germany and the United States. See the Artifacts Historical File for additional information.

Summary comment by: Walter Bucksch, Guenter Heinecke.

G00382   NMAH Catalog Number 1987.0487.110.01
 
TI number: G00382
Integrated Circuits - These devices are prototypes of the TMS3536 Video Display Processor developed by TI France. Its function is to provide signals required for display of alphanumeric characters, block graphics, and graphics defined on a dot by dot basis.

Details of the application and performance of the TMS3536 are contained in brochures in the Artifact Historical Files. Development was started in 1979, first material was received at the end of 1981, first full spec samples were made in early 1982 and production was started in 1983. This product is a good example of the international operations of TI. The design and assembly was done by TIF in Nice, the development slices were processed by TIJ at Miho and production slices were started at TIJ Hatogaya. Production of the TMS3556, a slight modification of the TMS3536 continues in 1986. Copies of French patents covering the device and system are in the File. Applications were also filed in Germany, Italy, the Netherlands, the U.K. and the U.S. See the Artifacts Historical File for additional information.

Related material in collection: G00383. Summary comment by: Gerard Chauvel, Jean Luc Villevielle.

G00382   NMAH Catalog Number 1987.0487.110.02
 
TI number: G00382
Integrated Circuits - These devices are prototypes of the TMS3536 Video Display Processor developed by TI France. Its function is to provide signals required for display of alphanumeric characters, block graphics, and graphics defined on a dot by dot basis.

Details of the application and performance of the TMS3536 are contained in brochures in the Artifact Historical Files. Development was started in 1979, first material was received at the end of 1981, first full spec samples were made in early 1982 and production was started in 1983. This product is a good example of the international operations of TI. The design and assembly was done by TIF in Nice, the development slices were processed by TIJ at Miho and production slices were started at TIJ Hatogaya. Production of the TMS3556, a slight modification of the TMS3536 continues in 1986. Copies of French patents covering the device and system are in the File. Applications were also filed in Germany, Italy, the Netherlands, the U.K. and the U.S. See the Artifacts Historical File for additional information.

Related material in collection: G00383. Summary comment by: Gerard Chauvel, Jean Luc Villevielle.

G00316   NMAH Catalog Number 1987.0487.111
 
TI number: G00316
Integrated Circuit - This circuit is from the first development lot of complex IC's designed and fabricated at TI. The work was probably done in late 1972. In this six lead package, the chip had special metallization and/or bonding for test purposes.

This circuit work was done as part of Contract No. DAAA21-72-C-0767 entitled COMPLEMENTARY MOS RAM FUSE ELECTRONICS for Picatinny Arsenal. The work was performed from June 28, 1972 to November 5, 1973. A copy of the Final Report is in the Artifacts History File and on microfilm in the TI report files.

Summary comment by: Barney Carbajal, Jim Hull.

G00293   NMAH Catalog Number 1987.0487.128
 
TI number: G00293
Photo Available Kit, Integrated Circuits - In the mid 1960's, the Semiconductor Group sold these kits for equipment design engineers to use in becoming familiar with IC applications.

Series 73 logic employed a modified form to diode transistor logic (DTL) in which transistors replaced conventional diodes to improve performance. This kit was made up in mid 1966.

Related material in collection: G00294. Summary comment by: Gerald McGee, Charles Phipps.

G00294   NMAH Catalog Number 1987.0487.129
 
TI number: G00294
Photo Available Kit, Integrated Circuits - In the mid 1960's, the Semiconductor Group sold these kits for equipment design engineers to use in becoming familiar with IC applications.

Series 54/74 circuitry is transistor logic. It was introduced by TI in October of 1964 in the metal flat package and in the third quarter of 1966 in the plastic dual-in-line package. This series rapidly became the industry standard for digital applications and was copied by other semiconductor manufacturers. This kit was made up in mid 1966.

Related material in collection: G00293. Summary comment by: Gerald McGee, Charles Phipps.

G00244   NMAH Catalog Number 1987.0487.141
 
TI number: G00244
Integrated Circuits - The display contains two SN7420N units which were from the first lot of IC's produced in Brazil - Campinas, January 26, 1973.

These units were from the first molding lot, January 26, 1973. No date code was applied because units from this lot were to be used for qualification and evaluation by QRA.

Summary comment by: Ed Gonzalez.

G00326   NMAH Catalog Number 1987.0487.161.01
 
TI number: G00326
Integrated Circuit - This ROM type was designed and built for use in the TI SPEAK & SPELL.

The symbolization in front of the date code identifies the wafer processing facility (Dallas MOS 2) and chip revision. These units were assembled and tested in the Singapore plant during the 32nd week of 1978. This was during the early stage of SPEAK & SPELL production.

Related material in collection: S00324-5, G00327-8. Summary comment by: Gene Frantz.

G00326   NMAH Catalog Number 1987.0487.161.02
 
TI number: G00326
Integrated Circuit - This ROM type was designed and built for use in the TI SPEAK & SPELL.

The symbolization in front of the date code identifies the wafer processing facility (Dallas MOS 2) and chip revision. These units were assembled and tested in the Singapore plant during the 32nd week of 1978. This was during the early stage of SPEAK & SPELL production.

Related material in collection: S00324-5, G00327-8. Summary comment by: Gene Frantz.

G00326   NMAH Catalog Number 1987.0487.161.03
 
TI number: G00326
Integrated Circuit - This ROM type was designed and built for use in the TI SPEAK & SPELL.

The symbolization in front of the date code identifies the wafer processing facility (Dallas MOS 2) and chip revision. These units were assembled and tested in the Singapore plant during the 32nd week of 1978. This was during the early stage of SPEAK & SPELL production.

Related material in collection: S00324-5, G00327-8. Summary comment by: Gene Frantz.

G00326   NMAH Catalog Number 1987.0487.161.04
 
TI number: G00326
Integrated Circuit - This ROM type was designed and built for use in the TI SPEAK & SPELL.

The symbolization in front of the date code identifies the wafer processing facility (Dallas MOS 2) and chip revision. These units were assembled and tested in the Singapore plant during the 32nd week of 1978. This was during the early stage of SPEAK & SPELL production.

Related material in collection: S00324-5, G00327-8. Summary comment by: Gene Frantz.

G00326   NMAH Catalog Number 1987.0487.161.05
 
TI number: G00326
Integrated Circuit - This ROM type was designed and built for use in the TI SPEAK & SPELL.

The symbolization in front of the date code identifies the wafer processing facility (Dallas MOS 2) and chip revision. These units were assembled and tested in the Singapore plant during the 32nd week of 1978. This was during the early stage of SPEAK & SPELL production.

Related material in collection: S00324-5, G00327-8. Summary comment by: Gene Frantz.

G00326   NMAH Catalog Number 1987.0487.161.06
 
TI number: G00326
Integrated Circuit - This ROM type was designed and built for use in the TI SPEAK & SPELL.

The symbolization in front of the date code identifies the wafer processing facility (Dallas MOS 2) and chip revision. These units were assembled and tested in the Singapore plant during the 32nd week of 1978. This was during the early stage of SPEAK & SPELL production.

Related material in collection: S00324-5, G00327-8. Summary comment by: Gene Frantz.

G00326   NMAH Catalog Number 1987.0487.161.07
 
TI number: G00326
Integrated Circuit - This ROM type was designed and built for use in the TI SPEAK & SPELL.

The symbolization in front of the date code identifies the wafer processing facility (Dallas MOS 2) and chip revision. These units were assembled and tested in the Singapore plant during the 32nd week of 1978. This was during the early stage of SPEAK & SPELL production.

Related material in collection: S00324-5, G00327-8. Summary comment by: Gene Frantz.

G00327   NMAH Catalog Number 1987.0487.162.01
 
TI number: G00327
Integrated Circuit - This ROM type was designed and built for use in the TI SPEAK & SPELL.

The symbolization in front of the date code identifies the wafer processing facility (Dallas MOS 2) and chip revision. These units were assembled and tested in the Singapore plant during the 23rd week of 1979.

Related material in collection: S00324-5, G00326,8. Summary comment by: Gene Frantz.

G00327   NMAH Catalog Number 1987.0487.162.02
 
TI number: G00327
Integrated Circuit - This ROM type was designed and built for use in the TI SPEAK & SPELL.

The symbolization in front of the date code identifies the wafer processing facility (Dallas MOS 2) and chip revision. These units were assembled and tested in the Singapore plant during the 23rd week of 1979.

Related material in collection: S00324-5, G00326,8. Summary comment by: Gene Frantz.

G00327   NMAH Catalog Number 1987.0487.162.03
 
TI number: G00327
Integrated Circuit - This ROM type was designed and built for use in the TI SPEAK & SPELL.

The symbolization in front of the date code identifies the wafer processing facility (Dallas MOS 2) and chip revision. These units were assembled and tested in the Singapore plant during the 23rd week of 1979.

Related material in collection: S00324-5, G00326,8. Summary comment by: Gene Frantz.

G00327   NMAH Catalog Number 1987.0487.162.04
 
TI number: G00327
Integrated Circuit - This ROM type was designed and built for use in the TI SPEAK & SPELL.

The symbolization in front of the date code identifies the wafer processing facility (Dallas MOS 2) and chip revision. These units were assembled and tested in the Singapore plant during the 23rd week of 1979.

Related material in collection: S00324-5, G00326,8. Summary comment by: Gene Frantz.

G00327   NMAH Catalog Number 1987.0487.162.05
 
TI number: G00327
Integrated Circuit - This ROM type was designed and built for use in the TI SPEAK & SPELL.

The symbolization in front of the date code identifies the wafer processing facility (Dallas MOS 2) and chip revision. These units were assembled and tested in the Singapore plant during the 23rd week of 1979.

Related material in collection: S00324-5, G00326,8. Summary comment by: Gene Frantz.

G00327   NMAH Catalog Number 1987.0487.162.06
 
TI number: G00327
Integrated Circuit - This ROM type was designed and built for use in the TI SPEAK & SPELL.

The symbolization in front of the date code identifies the wafer processing facility (Dallas MOS 2) and chip revision. These units were assembled and tested in the Singapore plant during the 23rd week of 1979.

Related material in collection: S00324-5, G00326,8. Summary comment by: Gene Frantz.

G00327   NMAH Catalog Number 1987.0487.162.07
 
TI number: G00327
Integrated Circuit - This ROM type was designed and built for use in the TI SPEAK & SPELL.

The symbolization in front of the date code identifies the wafer processing facility (Dallas MOS 2) and chip revision. These units were assembled and tested in the Singapore plant during the 23rd week of 1979.

Related material in collection: S00324-5, G00326,8. Summary comment by: Gene Frantz.

G00327   NMAH Catalog Number 1987.0487.162.08
 
TI number: G00327
Integrated Circuit - This ROM type was designed and built for use in the TI SPEAK & SPELL.

The symbolization in front of the date code identifies the wafer processing facility (Dallas MOS 2) and chip revision. These units were assembled and tested in the Singapore plant during the 23rd week of 1979.

Related material in collection: S00324-5, G00326,8. Summary comment by: Gene Frantz.

G00327   NMAH Catalog Number 1987.0487.162.09
 
TI number: G00327
Integrated Circuit - This ROM type was designed and built for use in the TI SPEAK & SPELL.

The symbolization in front of the date code identifies the wafer processing facility (Dallas MOS 2) and chip revision. These units were assembled and tested in the Singapore plant during the 23rd week of 1979.

Related material in collection: S00324-5, G00326,8. Summary comment by: Gene Frantz.

G00327   NMAH Catalog Number 1987.0487.162.10
 
TI number: G00327
Integrated Circuit - This ROM type was designed and built for use in the TI SPEAK & SPELL.

The symbolization in front of the date code identifies the wafer processing facility (Dallas MOS 2) and chip revision. These units were assembled and tested in the Singapore plant during the 23rd week of 1979.

Related material in collection: S00324-5, G00326,8. Summary comment by: Gene Frantz.

G00327   NMAH Catalog Number 1987.0487.162.11
 
TI number: G00327
Integrated Circuit - This ROM type was designed and built for use in the TI SPEAK & SPELL.

The symbolization in front of the date code identifies the wafer processing facility (Dallas MOS 2) and chip revision. These units were assembled and tested in the Singapore plant during the 23rd week of 1979.

Related material in collection: S00324-5, G00326,8. Summary comment by: Gene Frantz.

G00327   NMAH Catalog Number 1987.0487.162.12
 
TI number: G00327
Integrated Circuit - This ROM type was designed and built for use in the TI SPEAK & SPELL.

The symbolization in front of the date code identifies the wafer processing facility (Dallas MOS 2) and chip revision. These units were assembled and tested in the Singapore plant during the 23rd week of 1979.

Related material in collection: S00324-5, G00326,8. Summary comment by: Gene Frantz.

G00327   NMAH Catalog Number 1987.0487.162.13
 
TI number: G00327
Integrated Circuit - This ROM type was designed and built for use in the TI SPEAK & SPELL.

The symbolization in front of the date code identifies the wafer processing facility (Dallas MOS 2) and chip revision. These units were assembled and tested in the Singapore plant during the 23rd week of 1979.

Related material in collection: S00324-5, G00326,8. Summary comment by: Gene Frantz.

G00328   NMAH Catalog Number 1987.0487.163.01
 
TI number: G00328
Integrated Circuit - This ROM type was designed and built for use in the TI SPEAK & SPELL.

The symbolization in front of the date code identifies the wafer processing facility (Dallas MOS 1) and chip revision. The P indicates that these units were assembled and tested in the Houston prototype line in the 41st week of 1979. The reason for using the prototype line is not known, but it was usually to check a new or revised design or a process change. In this case, it may have been to check the start of this device in DM0S1. (See G00327 production information.)

Related material in collection: S00324-5, G00326-7. Summary comment by: Gene Frantz.

G00328   NMAH Catalog Number 1987.0487.163.02
 
TI number: G00328
Integrated Circuit - This ROM type was designed and built for use in the TI SPEAK & SPELL.

The symbolization in front of the date code identifies the wafer processing facility (Dallas MOS 1) and chip revision. The P indicates that these units were assembled and tested in the Houston prototype line in the 41st week of 1979. The reason for using the prototype line is not known, but it was usually to check a new or revised design or a process change. In this case, it may have been to check the start of this device in DM0S1. (See G00327 production information.)

Related material in collection: S00324-5, G00326-7. Summary comment by: Gene Frantz.

G00328   NMAH Catalog Number 1987.0487.163.03
 
TI number: G00328
Integrated Circuit - This ROM type was designed and built for use in the TI SPEAK & SPELL.

The symbolization in front of the date code identifies the wafer processing facility (Dallas MOS 1) and chip revision. The P indicates that these units were assembled and tested in the Houston prototype line in the 41st week of 1979. The reason for using the prototype line is not known, but it was usually to check a new or revised design or a process change. In this case, it may have been to check the start of this device in DM0S1. (See G00327 production information.)

Related material in collection: S00324-5, G00326-7. Summary comment by: Gene Frantz.

G00328   NMAH Catalog Number 1987.0487.163.04
 
TI number: G00328
Integrated Circuit - This ROM type was designed and built for use in the TI SPEAK & SPELL.

The symbolization in front of the date code identifies the wafer processing facility (Dallas MOS 1) and chip revision. The P indicates that these units were assembled and tested in the Houston prototype line in the 41st week of 1979. The reason for using the prototype line is not known, but it was usually to check a new or revised design or a process change. In this case, it may have been to check the start of this device in DM0S1. (See G00327 production information.)

Related material in collection: S00324-5, G00326-7. Summary comment by: Gene Frantz.

G00328   NMAH Catalog Number 1987.0487.163.05
 
TI number: G00328
Integrated Circuit - This ROM type was designed and built for use in the TI SPEAK & SPELL.

The symbolization in front of the date code identifies the wafer processing facility (Dallas MOS 1) and chip revision. The P indicates that these units were assembled and tested in the Houston prototype line in the 41st week of 1979. The reason for using the prototype line is not known, but it was usually to check a new or revised design or a process change. In this case, it may have been to check the start of this device in DM0S1. (See G00327 production information.)

Related material in collection: S00324-5, G00326-7. Summary comment by: Gene Frantz.

G00328   NMAH Catalog Number 1987.0487.163.06
 
TI number: G00328
Integrated Circuit - This ROM type was designed and built for use in the TI SPEAK & SPELL.

The symbolization in front of the date code identifies the wafer processing facility (Dallas MOS 1) and chip revision. The P indicates that these units were assembled and tested in the Houston prototype line in the 41st week of 1979. The reason for using the prototype line is not known, but it was usually to check a new or revised design or a process change. In this case, it may have been to check the start of this device in DM0S1. (See G00327 production information.)

Related material in collection: S00324-5, G00326-7. Summary comment by: Gene Frantz.

G00328   NMAH Catalog Number 1987.0487.163.07
 
TI number: G00328
Integrated Circuit - This ROM type was designed and built for use in the TI SPEAK & SPELL.

The symbolization in front of the date code identifies the wafer processing facility (Dallas MOS 1) and chip revision. The P indicates that these units were assembled and tested in the Houston prototype line in the 41st week of 1979. The reason for using the prototype line is not known, but it was usually to check a new or revised design or a process change. In this case, it may have been to check the start of this device in DM0S1. (See G00327 production information.)

Related material in collection: S00324-5, G00326-7. Summary comment by: Gene Frantz.

G00328   NMAH Catalog Number 1987.0487.163.08
 
TI number: G00328
Integrated Circuit - This ROM type was designed and built for use in the TI SPEAK & SPELL.

The symbolization in front of the date code identifies the wafer processing facility (Dallas MOS 1) and chip revision. The P indicates that these units were assembled and tested in the Houston prototype line in the 41st week of 1979. The reason for using the prototype line is not known, but it was usually to check a new or revised design or a process change. In this case, it may have been to check the start of this device in DM0S1. (See G00327 production information.)

Related material in collection: S00324-5, G00326-7. Summary comment by: Gene Frantz.

G00328   NMAH Catalog Number 1987.0487.163.09
 
TI number: G00328
Integrated Circuit - This ROM type was designed and built for use in the TI SPEAK & SPELL.

The symbolization in front of the date code identifies the wafer processing facility (Dallas MOS 1) and chip revision. The P indicates that these units were assembled and tested in the Houston prototype line in the 41st week of 1979. The reason for using the prototype line is not known, but it was usually to check a new or revised design or a process change. In this case, it may have been to check the start of this device in DM0S1. (See G00327 production information.)

Related material in collection: S00324-5, G00326-7. Summary comment by: Gene Frantz.

G00328   NMAH Catalog Number 1987.0487.163.10
 
TI number: G00328
Integrated Circuit - This ROM type was designed and built for use in the TI SPEAK & SPELL.

The symbolization in front of the date code identifies the wafer processing facility (Dallas MOS 1) and chip revision. The P indicates that these units were assembled and tested in the Houston prototype line in the 41st week of 1979. The reason for using the prototype line is not known, but it was usually to check a new or revised design or a process change. In this case, it may have been to check the start of this device in DM0S1. (See G00327 production information.)

Related material in collection: S00324-5, G00326-7. Summary comment by: Gene Frantz.

G00328   NMAH Catalog Number 1987.0487.163.11
 
TI number: G00328
Integrated Circuit - This ROM type was designed and built for use in the TI SPEAK & SPELL.

The symbolization in front of the date code identifies the wafer processing facility (Dallas MOS 1) and chip revision. The P indicates that these units were assembled and tested in the Houston prototype line in the 41st week of 1979. The reason for using the prototype line is not known, but it was usually to check a new or revised design or a process change. In this case, it may have been to check the start of this device in DM0S1. (See G00327 production information.)

Related material in collection: S00324-5, G00326-7. Summary comment by: Gene Frantz.

G00328   NMAH Catalog Number 1987.0487.163.12
 
TI number: G00328
Integrated Circuit - This ROM type was designed and built for use in the TI SPEAK & SPELL.

The symbolization in front of the date code identifies the wafer processing facility (Dallas MOS 1) and chip revision. The P indicates that these units were assembled and tested in the Houston prototype line in the 41st week of 1979. The reason for using the prototype line is not known, but it was usually to check a new or revised design or a process change. In this case, it may have been to check the start of this device in DM0S1. (See G00327 production information.)

Related material in collection: S00324-5, G00326-7. Summary comment by: Gene Frantz.

G00328   NMAH Catalog Number 1987.0487.163.13
 
TI number: G00328
Integrated Circuit - This ROM type was designed and built for use in the TI SPEAK & SPELL.

The symbolization in front of the date code identifies the wafer processing facility (Dallas MOS 1) and chip revision. The P indicates that these units were assembled and tested in the Houston prototype line in the 41st week of 1979. The reason for using the prototype line is not known, but it was usually to check a new or revised design or a process change. In this case, it may have been to check the start of this device in DM0S1. (See G00327 production information.)

Related material in collection: S00324-5, G00326-7. Summary comment by: Gene Frantz.

G00412   NMAH Catalog Number 1987.0487.164.01
 
TI number: G00412
Integrated Circuits - These IC's were engineering samples built during the development phase of the program, 1974-1976. These are beam lead chips as shown by the uncapped devices. The non-hermetic package was temporary for testing while an adequate carrier was being developed, indicating these were early units.

A total of 13 radiation hardened beam lead IC's were developed by TI for the Lockheed C4 Poseidon program, but the production order was lost to competition on price. A conformal coating was used in the temporary packages for protection during environmental testing. Later, a chip carrier was developed to replace the package for all testing. Acceptable chips were removed for the carrier and mounted and shipped on glass.

Summary comment by: Bill Brower, John Morrison.

G00412   NMAH Catalog Number 1987.0487.164.02
 
TI number: G00412
Integrated Circuits - These IC's were engineering samples built during the development phase of the program, 1974-1976. These are beam lead chips as shown by the uncapped devices. The non-hermetic package was temporary for testing while an adequate carrier was being developed, indicating these were early units.

A total of 13 radiation hardened beam lead IC's were developed by TI for the Lockheed C4 Poseidon program, but the production order was lost to competition on price. A conformal coating was used in the temporary packages for protection during environmental testing. Later, a chip carrier was developed to replace the package for all testing. Acceptable chips were removed for the carrier and mounted and shipped on glass.

Summary comment by: Bill Brower, John Morrison.

G00412   NMAH Catalog Number 1987.0487.164.03
 
TI number: G00412
Integrated Circuits - These IC's were engineering samples built during the development phase of the program, 1974-1976. These are beam lead chips as shown by the uncapped devices. The non-hermetic package was temporary for testing while an adequate carrier was being developed, indicating these were early units.

A total of 13 radiation hardened beam lead IC's were developed by TI for the Lockheed C4 Poseidon program, but the production order was lost to competition on price. A conformal coating was used in the temporary packages for protection during environmental testing. Later, a chip carrier was developed to replace the package for all testing. Acceptable chips were removed for the carrier and mounted and shipped on glass.

Summary comment by: Bill Brower, John Morrison.

G00412   NMAH Catalog Number 1987.0487.164.04
 
TI number: G00412
Integrated Circuits - These IC's were engineering samples built during the development phase of the program, 1974-1976. These are beam lead chips as shown by the uncapped devices. The non-hermetic package was temporary for testing while an adequate carrier was being developed, indicating these were early units.

A total of 13 radiation hardened beam lead IC's were developed by TI for the Lockheed C4 Poseidon program, but the production order was lost to competition on price. A conformal coating was used in the temporary packages for protection during environmental testing. Later, a chip carrier was developed to replace the package for all testing. Acceptable chips were removed for the carrier and mounted and shipped on glass.

Summary comment by: Bill Brower, John Morrison.

G00412   NMAH Catalog Number 1987.0487.164.05
 
TI number: G00412
Integrated Circuits - These IC's were engineering samples built during the development phase of the program, 1974-1976. These are beam lead chips as shown by the uncapped devices. The non-hermetic package was temporary for testing while an adequate carrier was being developed, indicating these were early units.

A total of 13 radiation hardened beam lead IC's were developed by TI for the Lockheed C4 Poseidon program, but the production order was lost to competition on price. A conformal coating was used in the temporary packages for protection during environmental testing. Later, a chip carrier was developed to replace the package for all testing. Acceptable chips were removed for the carrier and mounted and shipped on glass.

Summary comment by: Bill Brower, John Morrison.

G00412   NMAH Catalog Number 1987.0487.164.06
 
TI number: G00412
Integrated Circuits - These IC's were engineering samples built during the development phase of the program, 1974-1976. These are beam lead chips as shown by the uncapped devices. The non-hermetic package was temporary for testing while an adequate carrier was being developed, indicating these were early units.

A total of 13 radiation hardened beam lead IC's were developed by TI for the Lockheed C4 Poseidon program, but the production order was lost to competition on price. A conformal coating was used in the temporary packages for protection during environmental testing. Later, a chip carrier was developed to replace the package for all testing. Acceptable chips were removed for the carrier and mounted and shipped on glass.

Summary comment by: Bill Brower, John Morrison.

G00412   NMAH Catalog Number 1987.0487.164.07
 
TI number: G00412
Integrated Circuits - These IC's were engineering samples built during the development phase of the program, 1974-1976. These are beam lead chips as shown by the uncapped devices. The non-hermetic package was temporary for testing while an adequate carrier was being developed, indicating these were early units.

A total of 13 radiation hardened beam lead IC's were developed by TI for the Lockheed C4 Poseidon program, but the production order was lost to competition on price. A conformal coating was used in the temporary packages for protection during environmental testing. Later, a chip carrier was developed to replace the package for all testing. Acceptable chips were removed for the carrier and mounted and shipped on glass.

Summary comment by: Bill Brower, John Morrison.

G00412   NMAH Catalog Number 1987.0487.164.08
 
TI number: G00412
Integrated Circuits - These IC's were engineering samples built during the development phase of the program, 1974-1976. These are beam lead chips as shown by the uncapped devices. The non-hermetic package was temporary for testing while an adequate carrier was being developed, indicating these were early units.

A total of 13 radiation hardened beam lead IC's were developed by TI for the Lockheed C4 Poseidon program, but the production order was lost to competition on price. A conformal coating was used in the temporary packages for protection during environmental testing. Later, a chip carrier was developed to replace the package for all testing. Acceptable chips were removed for the carrier and mounted and shipped on glass.

Summary comment by: Bill Brower, John Morrison.

G00412   NMAH Catalog Number 1987.0487.164.09
 
TI number: G00412
Integrated Circuits - These IC's were engineering samples built during the development phase of the program, 1974-1976. These are beam lead chips as shown by the uncapped devices. The non-hermetic package was temporary for testing while an adequate carrier was being developed, indicating these were early units.

A total of 13 radiation hardened beam lead IC's were developed by TI for the Lockheed C4 Poseidon program, but the production order was lost to competition on price. A conformal coating was used in the temporary packages for protection during environmental testing. Later, a chip carrier was developed to replace the package for all testing. Acceptable chips were removed for the carrier and mounted and shipped on glass.

Summary comment by: Bill Brower, John Morrison.

G00412   NMAH Catalog Number 1987.0487.164.10
 
TI number: G00412
Integrated Circuits - These IC's were engineering samples built during the development phase of the program, 1974-1976. These are beam lead chips as shown by the uncapped devices. The non-hermetic package was temporary for testing while an adequate carrier was being developed, indicating these were early units.

A total of 13 radiation hardened beam lead IC's were developed by TI for the Lockheed C4 Poseidon program, but the production order was lost to competition on price. A conformal coating was used in the temporary packages for protection during environmental testing. Later, a chip carrier was developed to replace the package for all testing. Acceptable chips were removed for the carrier and mounted and shipped on glass.

Summary comment by: Bill Brower, John Morrison.

G00412   NMAH Catalog Number 1987.0487.164.11
 
TI number: G00412
Integrated Circuits - These IC's were engineering samples built during the development phase of the program, 1974-1976. These are beam lead chips as shown by the uncapped devices. The non-hermetic package was temporary for testing while an adequate carrier was being developed, indicating these were early units.

A total of 13 radiation hardened beam lead IC's were developed by TI for the Lockheed C4 Poseidon program, but the production order was lost to competition on price. A conformal coating was used in the temporary packages for protection during environmental testing. Later, a chip carrier was developed to replace the package for all testing. Acceptable chips were removed for the carrier and mounted and shipped on glass.

Summary comment by: Bill Brower, John Morrison.

G00176   NMAH Catalog Number 1987.0487.176.01
 
TI number: G00176
Integrated Circuit - Devices are from the first production run of IC's in the TI San Salvador plant - January, 1974.

Except for slice preparation (Front End), all fabrication and testing was done in San Salvador. Device type is SN74H30N.

G00176   NMAH Catalog Number 1987.0487.176.02
 
TI number: G00176
Integrated Circuit - Devices are from the first production run of IC's in the TI San Salvador plant - January, 1974.

Except for slice preparation (Front End), all fabrication and testing was done in San Salvador. Device type is SN74H30N.

G00177   NMAH Catalog Number 1987.0487.179
 
TI number: G00177
Integrated Circuit - Device is from the first day of production in the TI Kuala Lumpur plant - December 11, 1972. Date code 7305 indicates final acceptance and symbolization date.

Except for slice preperation (Front End), all fabrication and initial testing was done in Kuala Lumpur. Final acceptance testing and symbolization was done in Stafford. Shortly thereafter capability for final test and symbolization was established in Malaysia. Device type shown is SN7400N.

Related material in collection: G00196.

G00391   NMAH Catalog Number 1987.0487.183
 
TI number: G00391
Integrated Circuit Display, Bipolar - These displays, contained in a small box were used as IC marketing aids in the mid to late 1960's. It contains a processed 1 1/4" silicon slice and a bonded IC in a flat-pack without the lid mounted in a Mech-Pak carrier.

The chip in the package is not the same device type as those on the slice.

Related material in collection: G00305. Summary comment by: Eugene McFarland, Charles Phipps.

G00180   NMAH Catalog Number 1987.0487.185
 
TI number: G00180
Integrated circuit display, microwave - Display contains a slice and several chips of the first microwave integrated circuit produced at TI. It was developed an produced in the Semiconductor Research and Development Laboratory (SRDL), March, 1966.

The circuit was designed for the MERA program. It was a T/R switch, switching the antenna between transmit and receive. According to Roger Webster, "It was truly the first monolithic microwave IC. Also , it was the first monolithic microwave IC that worked." Item G00311 is a duplicate of this item except for mounting.

Related material in collection: G00100-2, 310-1. Summary comment by: Tom Hyltin, Frank Opp, Roger Webster.

G00205   NMAH Catalog Number 1987.0487.202.01
 
TI number: G00205
Integrated Circuits - These are early Series 51 IC's in the No. 1 flat pack design, ceramic base and solder sealed. Production in this package ended in late 1962 or very early in 1963.

The collection consists of two SN514 Dual Gates, one without the lid. The series 51 were RCTL logis circuits that were introduced in early 1962 as the first TI catalog line. They were called Solid Circuits, a registered trademark.

Related material in collection: G00088. Summary comment by: Willis Adcock, Jack Kilby, Charles Phipps.

G00205   NMAH Catalog Number 1987.0487.202.02
 
TI number: G00205
Integrated Circuits - These are early Series 51 IC's in the No. 1 flat pack design, ceramic base and solder sealed. Production in this package ended in late 1962 or very early in 1963.

The collection consists of two SN514 Dual Gates, one without the lid. The series 51 were RCTL logis circuits that were introduced in early 1962 as the first TI catalog line. They were called Solid Circuits, a registered TI trademark.

Related material in collection: G00088. Summary comment by: Willis Adcock, Jack Kilby, Charles Phipps.

G00206   NMAH Catalog Number 1987.0487.203
 
TI number: G00206
Integrated Circuit - This circuit is labeled SNX74H74F with no date code, indicating that it was an engineering sample for internal evaluation or use by a selected customer. The production device was introduced in early 1972.

The SB74H was an extension of the SN74 TTL series of IC's designed for higher current requirements. Devices is an MechPak carrier.

Summary comment by: George Graham, Earl Wilson.

G00207   NMAH Catalog Number 1987.0487.204.01
 
TI number: G00207
Integrated circuit - These unit's were built in early 1970 (Date Code 7017) to a customer's non-catalog specification. The type number was assigned sequentially for a specific customer specification.

The customer and device specifications are not known. Usually the special devices were selected from a standard device lot with parameter deviations. However, in some instances, they would also require mask changes. These devices are mounted in Mech-Pak carriers and also have an insulator on the bottom of the package. At the time, some IC chips were not insulated from the package internally; and, when requested by the customer, flatpacks were supplied with an insulator mounted on the base.

Summary comment by: Gene McFarland, Howard Moss, Charles Phipps.

G00207   NMAH Catalog Number 1987.0487.204.02
 
TI number: G00207
Integrated circuit - These unit's were built in early 1970 (Date Code 7017) to a customer's non-catalog specification. The type number was assigned sequentially for a specific customer specification.

The customer and device specifications are not known. Usually the special devices were selected from a standard device lot with parameter deviations. However, in some instances, they would also require mask changes. These devices are mounted in Mech-Pak carriers and also have an insulator on the bottom of the package. At the time, some IC chips were not insulated from the package internally; and, when requested by the customer, flatpacks were supplied with an insulator mounted on the base.

Summary comment by: Gene McFarland, Howard Moss, Charles Phipps.

G00208   NMAH Catalog Number 1987.0487.205.01
 
TI number: G00208
Integrated Circuit - These are SN51 Series circuits built in early 1966 (Date Code 6605). The circuit is a Clock Driver Network which was introduced in early 1964.

Units are in Mech-Pak carriers. Series 51 were RCTL circuits.

Related material in collection: G00088. Summary comment by: Willis Adcock, Jack Kilby, Charles Phipps.

G00208   NMAH Catalog Number 1987.0487.205.02
 
TI number: G00208
Integrated Circuit - These are SN51 Series circuits built in early 1966 (Date Code 6605). The circuit is a Clock Driver Network which was introduced in early 1964.

Units are in Mech-Pak carriers. Series 51 were RCTL circuits.

Related material in collection: G00088. Summary comment by: Willis Adcock, Jack Kilby, Charles Phipps.

G00251   NMAH Catalog Number 1987.0487.206
 
TI number: G00251
Carrier, Integrated Circuit - The item is an experimental IC flatpack carrier made in the 1962-3 period.

The carrier was designed to support the flatpack and protect the leads. Also, it had features for mechanical handling and stacking. The major shortcoming was the lack of means for testing the IC while in the carrier.

Summary comment by: Willis Adcock, Jack Kilby, Charles Phipps.

G00252   NMAH Catalog Number 1987.0487.207.01
 
TI number: G00252
Carriers, Integrated Circuit - This carrier was designed and put into production use in 1963. It was the TI standard carrier for handling completed flatpack IC's for testing, burn-in and shipping.

See G00095 for information of how the Mech Pak was a key part in the production start-up of IC production at TI.

Related material in collection: G00097. Summary comment by: Willis Adcock, Jack Kilby, Howard Moss, Charles Phipps.

G00252   NMAH Catalog Number 1987.0487.207.02
 
TI number: G00252
Carriers, Integrated Circuit - This carrier was designed and put into production use in 1963. It was the TI standard carrier for handling completed flatpack IC's for testing, burn-in and shipping.

See G00095 for information of how the Mech Pak was a key part in the production start-up of IC production at TI.

Related material in collection: G00097. Summary comment by: Willis Adcock, Jack Kilby, Howard Moss, Charles Phipps.

G00252   NMAH Catalog Number 1987.0487.207.03
 
TI number: G00252
Carriers, Integrated Circuit - This carrier was designed and put into production use in 1963. It was the TI standard carrier for handling completed flatpack IC's for testing, burn-in and shipping.

See G00095 for information of how the Mech Pak was a key part in the production start-up of IC production at TI.

Related material in collection: G00097. Summary comment by: Willis Adcock, Jack Kilby, Howard Moss, Charles Phipps.

G00199   NMAH Catalog Number 1987.0487.211
 
TI number: G00199
Integrated Circuit, Bipolar - Item is an example of late 1984 new products in the TI bipolar IC line. The device is a 16 bit programmable read only memory in a 24 pin plastic package.

Bar (chip) size .132 x .140 inch. See PG00098 for photograph of the chip.

Related material in collection: PG00098. Summary comment by: Earl Wilson.

G00249   NMAH Catalog Number 1987.0487.214
 
TI number: G00249
Integrated Circuit Display, Master Wafer - This item is one of the displays used in the mid 1960's to promote the Master Slice concept developed by TI. In addition to briefly describing the concept, key production steps are illustrated.

The display has the original title of SOLID CIRCUIT Semiconductor Networks under which TI introduced integrated circuits. The master slice idea was to provide a means of producing a new custom IC with a minimum of design time. For this slice design, 31 components were diffused into each bar (chip) such that a lead pattern mask was the only difference between several standard and custom circuits. Diffused slices could be the inefficient use of bar space caused the idea to be dropped in favor of efficient individual designs.

Related material in collection: G00344. Summary comment by: Jack Kilby, Howar Moss, Charles Phipps.

L00230   NMAH Catalog Number 1987.0487.217
 
TI number: L00230
Test Board, Integrated Circuit - This board design was one of the first for testing integrated circuits in the flat package. It was used in the 1962-3 period.

The board was designed in SC Integrated Circuits with help from Industrial Products of the Apparatus Division and manufactured good mechanical protection of the IC in testing and burn in, its size and loading time were negative factors. It was superceded after a short time by the Mech-Pak carrier and the various associated test and burn in fixtures. This portion of Industrial Products subsequently evolved into a part of Data Systems.

Related material in collection: G00082, 96, L00396-7. Summary comment by: Bill Brower, Ralph Dosher, Charles Phipps.

G00264   NMAH Catalog Number 1987.0487.221
 
TI number: G00264
Integrated Circuit Package Strip - The item is the first IC plastic package strip molded at TI. It was molded on an SRDL press in June, 1996.

This engineering design was modified several times before being released for production, but the strip represents the first one by TI.

Summary comment by: Ross Schraeder.

G00129   NMAH Catalog Number 1987.0487.233
 
TI number: G00129
Integrated Circuit - The 'calculator-on-a-chip' was an MOS integrated circuit announced by TI in September, 1971. In addition to its being offered for sale to the industry, a variation was a key element in TI's first portable calculator, the Datamath, introduced in September, 1972.

Item was part of the original S/B Lobby display and was used in the 50th Anniversary exhibit. This special package was used for display purposes. The device offered a complete four-function business calculator with a 3,500 bit read only memory, shift register and sequential address memory. The chip provided the equivalent of some 20,000 transistors. Changing a single photo mask permitted functional variations, including slide rule type calculations as well. Patent No. 4074351 was issued in July, 1971, to Gary Boon and Michael J. Cochran and assigned to TI. For additional information, see the Artifacts Historical Files.

Related material in collection: G00123. Summary comment by: Dave Carlson, Ken Davis, Kevin McDonough.

G00156   NMAH Catalog Number 1987.0487.236
 
TI number: G00156
Integrated Circuit - The item is an example of an early special device. The date code indicates mid 1964 manufacture.

An integrated circuit differing in any manner from the catalog specifications was classified as a special device. Any electrical differences are not known; however, lead extensions were welded to the end leads for a special package configuration.

Summary comment by: Jim Lacy, Howard Moss, Charles Phipps.

G00157   NMAH Catalog Number 1987.0487.237
 
TI number: G00157
Integrated Circuit - The device is a Minuteman II gate built by TI in the early stage of the program, probably late 1963.

A photograph of the device chip is in the file. All MM IC's used the type of label shown in order to provide all the required information for each device. The color band is the standard component code for 904. The number, unique for each device, was used to maintain a record through all testing and use in the system. "1" designated a TI device. Serial numbers started at A00001. The 904 was a high usage type; hence the number A02602 designates a very early unit.

Related material in collection: See G00019 and G00145 for mounted units. Summary comment by: Jim Lacy, Howard Moss, Charles Phipps.

G00158   NMAH Catalog Number 1987.0487.238.01
 
TI number: G00158
Integrated Circuit - These devices, data code 415 (1964, 15th week) are from early production of TI's first catalog line of linear circuits.

These units were part of QRA Weekly-Add-To test lot. At that time, a random sample was taken from production each week and placed on life and environmental testing. The SN521 is an operational amplifier (Op Amp).

Summary comment by: Howar Moss, Charles Phipps.

G00158   NMAH Catalog Number 1987.0487.238.02
 
TI number: G00158
Integrated Circuit - These devices, data code 415 (1964, 15th week) are from early production of TI's first catalog line of linear circuits.

These units were part of QRA Weekly-Add-To test lot. At that time, a random sample was taken from production each week and placed on life and environmental testing. The SN521 is an operational amplifier (Op Amp).

Summary comment by: Howar Moss, Charles Phipps.

G00158   NMAH Catalog Number 1987.0487.238.03
 
TI number: G00158
Integrated Circuit - These devices, data code 415 (1964, 15th week) are from early production of TI's first catalog line of linear circuits.

These units were part of QRA Weekly-Add-To test lot. At that time, a random sample was taken from production each week and placed on life and environmental testing. The SN521 is an operational amplifier (Op Amp).

Summary comment by: Howar Moss, Charles Phipps.

G00158   NMAH Catalog Number 1987.0487.238.04
 
TI number: G00158
Integrated Circuit - These devices, data code 415 (1964, 15th week) are from early production of TI's first catalog line of linear circuits.

These units were part of QRA Weekly-Add-To test lot. At that time, a random sample was taken from production each week and placed on life and environmental testing. The SN521 is an operational amplifier (Op Amp).

Summary comment by: Howar Moss, Charles Phipps.

G00119   NMAH Catalog Number 1987.0487.240
 
TI number: G00119
Array, Diode-Integrated Circuit - This item, made in early 1977 contains a diode array and two IC's mounted on a ceramic substrate. It was part of an optical reader, but the customer and specific use are not known.

Summary comment by: John Gibson, Don Hyde.

G00123   NMAH Catalog Number 1987.0487.248.01
 
TI number: G00123
Integrated Circuit - These IC's are early production samples of the 'calculator on a chip' circuit announced by TI in September, 1971.

The TMS0111 was used in both the TI Minimath and the Datamath calculators. The basic chip design was known as the TMS0100. Variations were made to fit individual calculator requirements for outside customers as well as TI. NOTE: These are probably still good IC's. Handle in plastic foam to prevent damage from static electricity discharge. For additional information on the introduction of the circuit, see the Artifact Historical Files.

Related material in collection: S00091, 114, 121 and G00129.

G00123   NMAH Catalog Number 1987.0487.248.02
 
TI number: G00123
Integrated Circuit - These IC's are early production samples of the 'calculator on a chip' circuit announced by TI in September, 1971.

The TMS0111 was used in both the TI Minimath and the Datamath calculators. The basic chip design was known as the TMS0100. Variations were made to fit individual calculator requirements for outside customers as well as TI. NOTE: These are probably still good IC's. Handle in plastic foam to prevent damage from static electricity discharge. For additional information on the introduction of the circuit, see the Artifact Historical Files.

Related material in collection: S00091, 114, 121 and G00129.

G00281   NMAH Catalog Number 1987.0487.257
 
TI number: G00281
Integrated Circuit - This module controlled the speed and braking of the film drive motor in the SX-70 camera. The date code (7208) indicates it was from one of the first lots shipped to Polaroid.

The item was in a Polaroid file assembled by Prentiss (Buzz) Selby for the TI History Project.

Related material in collection: Z00081, 280, 287, G00282-4, 6. Summary comment by: Willis Adcock.

G00250   NMAH Catalog Number 1987.0487.263
 
TI number: G00250
Integrated Circuit Shipping Sleeve - The item is one of the early shipping sleeves used for IC's. It was designed for use with the Mech-Pak carrier and held up to 50 units. Its usage started in late 1963.

From the start with design, sleeve shipping containers became standard for TI.

Summary comment by: Willis Adcock, Howard Moss, Charles Phipps.

G00406   NMAH Catalog Number 1987.0487.264
 
TI number: G00406
Model, Integrated Circuit Flatpack - This is a display model of an IC in the 1/4in x 1/8in flatpack with partial cutaway lid. The date of the model is not known, but it is typical of the construction of the mid 1960's.

Summary comment by: Jim Lacy, Charles Phipps, Earl Wilson.

G00258   NMAH Catalog Number 1987.0487.271.01
 
TI number: G00258
Integrated Circuits - This unmounted display contains a standard DIP plastic IC and one encapsulated in clear plastic so that the chip, bonding wires and lead frame structure is seen.

The symbolization on the standard package has been damaged.

Summary comment by: Pete Shankle, Earl Wilson.

G00258   NMAH Catalog Number 1987.0487.271.02
 
TI number: G00258
Integrated Circuits - This unmounted display contains a standard DIP plastic IC and one encapsulated in clear plastic so that the chip, bonding wires and lead frame structure is seen.

The symbolization on the standard package has been damaged.

Summary comment by: Pete Shankle, Earl Wilson.

G00333   NMAH Catalog Number 1987.0487.310
 
TI number: G00333
Array, Large Scale Integration - See G00186 for complete description.

These two units were given to Whittington by a QRA engineer; therefore it was likely they were used for reliability or evaluation testing. The fact that they have both type numbers and serial numbers indicated that they had met production specifications.

Related material in collection: G00026, 186-7, 191-4, 306. Summary comment by: Jim Hull, Jack Kilby, Charles Phipps.

G00333   NMAH Catalog Number 1987.0487.311
 
TI number: G00333
Array, Large Scale Integration - See G00186 for complete description.

These two units were given to Whittington by a QRA engineer; therefore it was likely they were used for reliability or evaluation testing. The fact that they have both type numbers and serial numbers indicated that they had met production specifications.

Related material in collection: G00026, 186-7, 191-4, 306. Summary comment by: Jim Hull, Jack Kilby, Charles Phipps.

G00306   NMAH Catalog Number 1987.0487.312
 
TI number: G00306
Array, Large Scale Integration - See G00186 for complete description.

This uncapped array has the bond wires in place.

Related material in collection: G00026, 186-7, 191-4, 306, 333. Summary comment by: Jim Hull, Jack Kilby, Charles Phipps.

G00342   NMAH Catalog Number 1987.0487.313
 
TI number: G00342
Integrated Circuit, Flip Flop - This device is an engineering prototype of the first commercially available silicon monolithic integrated circuit. It was introduced by TI in March, 1960, as the SN502 Solid Circuit Flip Flop. The initial price was $450 each.

For the package, the frame, leads and base were assembled with glass frit. The kovar lid was soldered in place. From a discussion with Jack Kilby, the difference in package lead configuration between this device and the G00013 was due to this being an earlier prototype device. The March, 1960, catalog data sheet shows the lead configuration of G00013.

Related material in collection: G00013, PG00083, 99. Summary comment by: Willis Adcock, Jim Hull, Jack Kilby, Charles Phipps.

G00343   NMAH Catalog Number 1987.0487.314
 
TI number: G00343
Integrated Circuit - These two devices, SN1118 and SN1121, were contributed as examples of the start of the TI TTL product line. Date codes indicate they were made in the late 3rd and early 4th quarters of 1964.

The TI TTL product family, designated SN54/74, was announced in October, 1964, and production shipments started about the middle of 1965. Honeywell, St. Petersburg, was one of the first customers, and engineering devices were shipped to them in 1964 under special device numbers. Dupuis was an IC engineering technician at that time and saved these as some of the first TTL device, probably for Honeywell. Any further verification will require opening for analysis.

Related material in collection: G00294. Summary comment by: Ed Dupuis, Jack Kilby, Charles Phipps.

G00343   NMAH Catalog Number 1987.0487.315
 
TI number: G00343
Integrated Circuit - These two devices, SN1118 and SN1121, were contributed as examples of the start of the TI TTL product line. Date codes indicate they were made in the late 3rd and early 4th quarters of 1964.

The TI TTL product family, designated SN54/74, was announced in October, 1964, and production shipments started about the middle of 1965. Honeywell, St. Petersburg, was one of the first customers, and engineering devices were shipped to them in 1964 under special device numbers. Dupuis was an IC engineering technician at that time and saved these as some of the first TTL device, probably for Honeywell. Any further verification will require opening for analysis.

Related material in collection: G00294. Summary comment by: Ed Dupuis, Jack Kilby, Charles Phipps.

G00344   NMAH Catalog Number 1987.0487.316
 
TI number: G00344
Integrated Circuit - This device circuit type is not known, but it is a good example of the Master Slice concept originated and promoted by TI in the mid 1960's as a means of shortening device lead time.

See G00249 for a brief description of the Master Slice design and application. Dupuis was an engineering technician in Integrated Circuits at the time and saved this device as a Master Slice example. Further analysis would be required to determine device type identification.

Related material in collection: G00249 (1987.0487.214). Summary comment by: Jack Kilby, Howard Moss, Charles Phipps.

G00305   NMAH Catalog Number 1987.0487.317
 
TI number: G00305
Integrated Circuit Display, Bipolar - The display, contained in a small box, was used as an IC marketing aid, in the mid 1960's. It contains a processed 1 1/4" silicon slice and a bonded IC in a flat-pack without the lid mounted in a Mech-Pak carrier.

The chip in the package is not the same as those on the slice.

Related material in collection: G00391(.183). Summary comment by: Eugene McFarland, Charles Phipps.

G00310   NMAH Catalog Number 1987.0487.319
 
TI number: G00310
Wafers, Microwave Integrated Circuit - The display consists of three processed slices containing three microwave IC's. These circuits were developed in the 1965-7 period for use in the MERA program.

The display circuits are 500 MHz IF Preamp, Phase Shift Network (16 diode array), and TR Antenna Switch. The Antenna Switch was the first monolithic microwave integrated circuit.

Related material in collection: G00100-2, 180, 311. Summary comment by: Willis Adcock, Tom Hyltin, Roger Webster.

G00012   NMAH Catalog Number 1987.0487.320
 
TI number: G00012
Integrated Circuit - This is one of the three first monolithic integrated circuits built in the laboratory by Jack S. Kilby in 1958. The circuit is a phase shift oscillator.

To verify the feasibility of his idea, Kilby designed and fabricated in the laboratory three types of circuits: a flip flop, a multi vibrator and a phase shift oscillator. These were the basis of Kilby's patent, No. 3,138,743. This is the only circuit remaining in the hands of TI. One circuit was donated to the Chicago Museum of Science and Industry, and the other was lost.

Related material in collection: PG00032-35. Summary comment by: Willis Adcock, Jack Kilby.

G00082   NMAH Catalog Number 1987.0487.324
 
TI number: G00082
Test Board, Integrated Circuit - This board represents an early (1960) method of designing and working with integrated circuits.

Because integrated circuits in the flatpack were dissimilar to existing packages, TI had to develop test boards to facilitate use of I/C's. The boards shown were some of the first designs to allow engineers to breadboard a design and test the IC without damaging the package. Thus, the same IC could then be used in a prototype equipment. Shown with the test boards is an equivalent circuit with conventional components tightly assembled to illustrate the potential size reduction with an IC.

Related material in collection: G00096, L00230, 396, 397. Summary comment by: Willis Adcock, Jack Kilby, Charles Phipps.

G00013   NMAH Catalog Number 1987.0487.326
 
TI number: G00013
Integrated Circuit, Flip Flop - A prototype of first silicon monolithic integrated circuit commercially available. Device is in 1/4" x 1/8" flat pack (initial design). Frame, leads and base were assembled with glass frit. Kovar lid was soldered for hermetic seal.

This device was probably built in late 1958. The device type, SN502, was introduced to the market in March, 1959, as "Solid Circuit" Flip Flop, TI Type SN502, at $450 each. The item was part of the original S/B Lobby display.

Related material in collection: G00342, PG00083. Summary comment by: Willis Adcock, Jack Kilby, Charles Phipps.

G00088   NMAH Catalog Number 1987.0487.340.01
 
TI number: G00088
Integrated Circuit - Displayed are two Series 51 I/C's without lids. These devices represent the first catalog line of I/C's introduced by TI in 1962. The circuitry was RCTL (resistor-capacitor-transistor logic).

This item was part of the original S/B Lobby display. A significant clue to future developments in IC's was the SN514, shown on the accompanying illustration, which combined two NOR/NAND circuits in one package. The upper unit on the display is an SN514.

Summary comment by: Willis Adcock, Jack Kilby, Charles Phipps.

G00088   NMAH Catalog Number 1987.0487.340.02
 
TI number: G00088
Integrated Circuit - Displayed are two Series 51 I/C's without lids. These devices represent the first catalog line of I/C's introduced by TI in 1962. The circuitry was RCTL (resistor-capacitor-transistor logic).

This item was part of the original S/B Lobby display. A significant clue to future developments in IC's was the SN514, shown on the accompanying illustration, which combined two NOR/NAND circuits in one package. The upper unit on the display is an SN514.

Summary comment by: Willis Adcock, Jack Kilby, Charles Phipps.

G00026   NMAH Catalog Number 1987.0487.352
 
TI number: G00026
Array, Large Scale Integration - See G00186 for complete description.

This display contains both an uncapped and a capped array. It was used to show to potential customers.

Related material in collection: G00186, 7, 191-4, 306, 333. Summary comment by: Jim Hull, Jack Kilby, Charles Phipps.

G00065   NMAH Catalog Number 1987.0487.361.01
 
TI number: G00065
Integrated Circuit - The assortment contains samples of function timing generator, controller, and sense amplifier for 512K and 1M bits MBM.

Summary comment by: Bill Alexander, Mike Valek.

G00065   NMAH Catalog Number 1987.0487.361.02
 
TI number: G00065
Integrated Circuit - The assortment contains samples of function timing generator, controller, and sense amplifier for 512K and 1M bits MBM.

Summary comment by: Bill Alexander, Mike Valek.

G00065   NMAH Catalog Number 1987.0487.361.03
 
TI number: G00065
Integrated Circuit - The assortment contains samples of function timing generator, controller, and sense amplifier for 512K and 1M bits MBM.

Summary comment by: Bill Alexander, Mike Valek.

G00065   NMAH Catalog Number 1987.0487.361.04
 
TI number: G00065
Integrated Circuit - The assortment contains samples of function timing generator, controller, and sense amplifier for 512K and 1M bits MBM.

Summary comment by: Bill Alexander, Mike Valek.

G00065   NMAH Catalog Number 1987.0487.361.05
 
TI number: G00065
Integrated Circuit - The assortment contains samples of function timing generator, controller, and sense amplifier for 512K and 1M bits MBM.

Summary comment by: Bill Alexander, Mike Valek.

G00065   NMAH Catalog Number 1987.0487.361.06
 
TI number: G00065
Integrated Circuit - The assortment contains samples of function timing generator, controller, and sense amplifier for 512K and 1M bits MBM.

Summary comment by: Bill Alexander, Mike Valek.

G00065   NMAH Catalog Number 1987.0487.361.07
 
TI number: G00065
Integrated Circuit - The assortment contains samples of function timing generator, controller, and sense amplifier for 512K and 1M bits MBM.

Summary comment by: Bill Alexander, Mike Valek.

G00065   NMAH Catalog Number 1987.0487.361.08
 
TI number: G00065
Integrated Circuit - The assortment contains samples of function timing generator, controller, and sense amplifier for 512K and 1M bits MBM.

Summary comment by: Bill Alexander, Mike Valek.

G00065   NMAH Catalog Number 1987.0487.361.09
 
TI number: G00065
Integrated Circuit - The assortment contains samples of function timing generator, controller, and sense amplifier for 512K and 1M bits MBM.

Summary comment by: Bill Alexander, Mike Valek.

G00065   NMAH Catalog Number 1987.0487.361.10
 
TI number: G00065
Integrated Circuit - The assortment contains samples of function timing generator, controller, and sense amplifier for 512K and 1M bits MBM.

Summary comment by: Bill Alexander, Mike Valek.

G00065   NMAH Catalog Number 1987.0487.361.11
 
TI number: G00065
Integrated Circuit - The assortment contains samples of function timing generator, controller, and sense amplifier for 512K and 1M bits MBM.

Summary comment by: Bill Alexander, Mike Valek.

G00065   NMAH Catalog Number 1987.0487.361.12
 
TI number: G00065
Integrated Circuit - The assortment contains samples of function timing generator, controller, and sense amplifier for 512K and 1M bits MBM.

Summary comment by: Bill Alexander, Mike Valek.

G00065   NMAH Catalog Number 1987.0487.361.13
 
TI number: G00065
Integrated Circuit - The assortment contains samples of function timing generator, controller, and sense amplifier for 512K and 1M bits MBM.

Summary comment by: Bill Alexander, Mike Valek.

G00065   NMAH Catalog Number 1987.0487.361.14
 
TI number: G00065
Integrated Circuit - The assortment contains samples of function timing generator, controller, and sense amplifier for 512K and 1M bits MBM.

Summary comment by: Bill Alexander, Mike Valek.

G00065   NMAH Catalog Number 1987.0487.361.15
 
TI number: G00065
Integrated Circuit - The assortment contains samples of function timing generator, controller, and sense amplifier for 512K and 1M bits MBM.

Summary comment by: Bill Alexander, Mike Valek.

G00065   NMAH Catalog Number 1987.0487.361.16
 
TI number: G00065
Integrated Circuit - The assortment contains samples of function timing generator, controller, and sense amplifier for 512K and 1M bits MBM.

Summary comment by: Bill Alexander, Mike Valek.

G00065   NMAH Catalog Number 1987.0487.361.17
 
TI number: G00065
Integrated Circuit - The assortment contains samples of function timing generator, controller, and sense amplifier for 512K and 1M bits MBM.

Summary comment by: Bill Alexander, Mike Valek.

G00065   NMAH Catalog Number 1987.0487.361.18
 
TI number: G00065
Integrated Circuit - The assortment contains samples of function timing generator, controller, and sense amplifier for 512K and 1M bits MBM.

Summary comment by: Bill Alexander, Mike Valek.

G00076   NMAH Catalog Number 1987.0487.414.01
 
TI number: G00076
Integrated Circuits - Final version of MBM function drivers. The Write Function Driver is in 16 pin package (labeled 3&5); Read Function Driver is in 20 pin package (labeled 15).

NOTE: The device identifications were based on limited notes and Glenn Manuel's memory.

Summary comment by: Bill Alexander, Paul Coppenger, Glen Manuel.

G00076   NMAH Catalog Number 1987.0487.414.02
 
TI number: G00076
Integrated Circuits - Final version of MBM function drivers. The Write Function Driver is in 16 pin package (labeled 3&5); Read Function Driver is in 20 pin package (labeled 15).

NOTE: The device identifications were based on limited notes and Glenn Manuel's memory.

Summary comment by: Bill Alexander, Paul Coppenger, Glen Manuel.

G00076   NMAH Catalog Number 1987.0487.414.03
 
TI number: G00076
Integrated Circuits - Final version of MBM function drivers. The Write Function Driver is in 16 pin package (labeled 3&5); Read Function Driver is in 20 pin package (labeled 15).

NOTE: The device identifications were based on limited notes and Glenn Manuel's memory.

Summary comment by: Bill Alexander, Paul Coppenger, Glen Manuel.

G00079   NMAH Catalog Number 1987.0487.417.01
 
TI number: G00079
Integrated Circuit - This sense amplifier was designed specifically for use with 1M bits MBM. The uncapped device is in a ceramic package, and the completed device is in a plastic package.

Summary comment by: Bill Alexander, Paul Coppinger.

G00079   NMAH Catalog Number 1987.0487.417.02
 
TI number: G00079
Integrated Circuit - This sense amplifier was designed specifically for use with 1M bits MBM. The uncapped device is in a ceramic package, and the completed device is in a plastic package.

Summary comment by: Bill Alexander, Paul Coppinger.

G00093   NMAH Catalog Number 1987.0487.419.01
 
TI number: G00093
Integrated Circuit Dummy Flatpack - In the introductory search for markets in 1962, TI gave the electronics industry a familiarity with integrated circuits by distributing thousands of dummy packages.

The dummy packages allowed potential users to become familiar with the form factor and to develop assembly techniques. Several thousand were distributed in the 1962-3 period. This item was part of the original South Building Lobby display.

Summary comment by: Willis Adcock, Jack Kilby, Charles Phipps.

G00093   NMAH Catalog Number 1987.0487.419.02
 
TI number: G00093
Integrated Circuit Dummy Flatpack - In the introductory search for markets in 1962, TI gave the electronics industry a familiarity with integrated circuits by distributing thousands of dummy packages.

The dummy packages allowed potential users to become familiar with the form factor and to develop assembly techniques. Several thousand were distributed in the 1962-3 period. This item was part of the original South Building Lobby display.

Summary comment by: Willis Adcock, Jack Kilby, Charles Phipps.

G00093   NMAH Catalog Number 1987.0487.419.03
 
TI number: G00093
Integrated Circuit Dummy Flatpack - In the introductory search for markets in 1962, TI gave the electronics industry a familiarity with integrated circuits by distributing thousands of dummy packages.

The dummy packages allowed potential users to become familiar with the form factor and to develop assembly techniques. Several thousand were distributed in the 1962-3 period. This item was part of the original South Building Lobby display.

Summary comment by: Willis Adcock, Jack Kilby, Charles Phipps.

G00093   NMAH Catalog Number 1987.0487.419.04
 
TI number: G00093
Integrated Circuit Dummy Flatpack - In the introductory search for markets in 1962, TI gave the electronics industry a familiarity with integrated circuits by distributing thousands of dummy packages.

The dummy packages allowed potential users to become familiar with the form factor and to develop assembly techniques. Several thousand were distributed in the 1962-3 period. This item was part of the original South Building Lobby display.

Summary comment by: Willis Adcock, Jack Kilby, Charles Phipps.

G00093   NMAH Catalog Number 1987.0487.419.05
 
TI number: G00093
Integrated Circuit Dummy Flatpack - In the introductory search for markets in 1962, TI gave the electronics industry a familiarity with integrated circuits by distributing thousands of dummy packages.

The dummy packages allowed potential users to become familiar with the form factor and to develop assembly techniques. Several thousand were distributed in the 1962-3 period. This item was part of the original South Building Lobby display.

Summary comment by: Willis Adcock, Jack Kilby, Charles Phipps.

G00093   NMAH Catalog Number 1987.0487.419.06
 
TI number: G00093
Integrated Circuit Dummy Flatpack - In the introductory search for markets in 1962, TI gave the electronics industry a familiarity with integrated circuits by distributing thousands of dummy packages.

The dummy packages allowed potential users to become familiar with the form factor and to develop assembly techniques. Several thousand were distributed in the 1962-3 period. This item was part of the original South Building Lobby display.

Summary comment by: Willis Adcock, Jack Kilby, Charles Phipps.

G00093   NMAH Catalog Number 1987.0487.419.07
 
TI number: G00093
Integrated Circuit Dummy Flatpack - In the introductory search for markets in 1962, TI gave the electronics industry a familiarity with integrated circuits by distributing thousands of dummy packages.

The dummy packages allowed potential users to become familiar with the form factor and to develop assembly techniques. Several thousand were distributed in the 1962-3 period. This item was part of the original South Building Lobby display.

Summary comment by: Willis Adcock, Jack Kilby, Charles Phipps.

G00093   NMAH Catalog Number 1987.0487.419.08
 
TI number: G00093
Integrated Circuit Dummy Flatpack - In the introductory search for markets in 1962, TI gave the electronics industry a familiarity with integrated circuits by distributing thousands of dummy packages.

The dummy packages allowed potential users to become familiar with the form factor and to develop assembly techniques. Several thousand were distributed in the 1962-3 period. This item was part of the original South Building Lobby display.

Summary comment by: Willis Adcock, Jack Kilby, Charles Phipps.

G00093   NMAH Catalog Number 1987.0487.419.09
 
TI number: G00093
Integrated Circuit Dummy Flatpack - In the introductory search for markets in 1962, TI gave the electronics industry a familiarity with integrated circuits by distributing thousands of dummy packages.

The dummy packages allowed potential users to become familiar with the form factor and to develop assembly techniques. Several thousand were distributed in the 1962-3 period. This item was part of the original South Building Lobby display.

Summary comment by: Willis Adcock, Jack Kilby, Charles Phipps.

G00094   NMAH Catalog Number 1987.0487.420
 
TI number: G00094
Integrated Circuit - The Series 52 was the second IC catalog line introduced by TI and were the first catalog linear circuits. The first two circuits, operational amplifiers, were introduced at WESCON in 1963.

This item was part of the original S/B Lobby display. At the time of introduction, these op amps had a price advantage over discrete device equivalents of $132 vs. $300-$500.

Summary comment by: Willis Adcock, Charles Phipps.

G00095   NMAH Catalog Number 1987.0487.421.01
 
TI number: G00095
Integrated Circuits - These circuits are representative of 1962-63 production. The standard package was the 14 lead flatpack, with the unused leads clipped after assembly.

This item was part of the original S/B Lobby display. The first major production of IC's was for military applications and was started with the receipt by TI of two contracts dated November 27, 1962, from Autonetics Division of North American Aviation, (now part of Rockwell International). The first called for the development and delivery of 100 each of 19 types of devices for the Minuteman II missile guidance system. Upon completion of the development, the second contract for the delivery of production quantities. This and subsequent production contracts brought sales of more than 2000 TI IC's per missile plus spares. Included with this item is a photo used by Autonetics to illustrate the major decrease in the size of the guidance system, even with greater capability than that used for Minuteman I, because of the reduction of the number of components and package size. The Minuteman II contracts resulted in improvements in manufacturing methods to ensure device reliability and in handling and testing equipment. Welding of the package improved mechanical and hermetic qualities. (See G00031.) Development of the Mech-Pak carrier, test sockets and boards, an IC tester, a lead clipper, a special welder and printed circuit boards enlarged the TI production capacity and the capability of customers to use IC's.

Related material in collection: G00096, 97, Z00145. Summary comment by: Willis Adcock, Jack Kilby, Jim Lacy, Charles Phipps.

G00095   NMAH Catalog Number 1987.0487.421.02
 
TI number: G00095
Integrated Circuits - These circuits are representative of 1962-63 production. The standard package was the 14 lead flatpack, with the unused leads clipped after assembly.

This item was part of the original S/B Lobby display. The first major production of IC's was for military applications and was started with the receipt by TI of two contracts dated November 27, 1962, from Autonetics Division of North American Aviation, (now part of Rockwell International). The first called for the development and delivery of 100 each of 19 types of devices for the Minuteman II missile guidance system. Upon completion of the development, the second contract for the delivery of production quantities. This and subsequent production contracts brought sales of more than 2000 TI IC's per missile plus spares. Included with this item is a photo used by Autonetics to illustrate the major decrease in the size of the guidance system, even with greater capability than that used for Minuteman I, because of the reduction of the number of components and package size. The Minuteman II contracts resulted in improvements in manufacturing methods to ensure device reliability and in handling and testing equipment. Welding of the package improved mechanical and hermetic qualities. (See G00031.) Development of the Mech-Pak carrier, test sockets and boards, an IC tester, a lead clipper, a special welder and printed circuit boards enlarged the TI production capacity and the capability of customers to use IC's.

Related material in collection: G00096, 97, Z00145. Summary comment by: Willis Adcock, Jack Kilby, Jim Lacy, Charles Phipps.

G00095   NMAH Catalog Number 1987.0487.421.03
 
TI number: G00095
Integrated Circuits - These circuits are representative of 1962-63 production. The standard package was the 14 lead flatpack, with the unused leads clipped after assembly.

This item was part of the original S/B Lobby display. The first major production of IC's was for military applications and was started with the receipt by TI of two contracts dated November 27, 1962, from Autonetics Division of North American Aviation, (now part of Rockwell International). The first called for the development and delivery of 100 each of 19 types of devices for the Minuteman II missile guidance system. Upon completion of the development, the second contract for the delivery of production quantities. This and subsequent production contracts brought sales of more than 2000 TI IC's per missile plus spares. Included with this item is a photo used by Autonetics to illustrate the major decrease in the size of the guidance system, even with greater capability than that used for Minuteman I, because of the reduction of the number of components and package size. The Minuteman II contracts resulted in improvements in manufacturing methods to ensure device reliability and in handling and testing equipment. Welding of the package improved mechanical and hermetic qualities. (See G00031.) Development of the Mech-Pak carrier, test sockets and boards, an IC tester, a lead clipper, a special welder and printed circuit boards enlarged the TI production capacity and the capability of customers to use IC's.

Related material in collection: G00096, 97, Z00145. Summary comment by: Willis Adcock, Jack Kilby, Jim Lacy, Charles Phipps.

G00095   NMAH Catalog Number 1987.0487.421.04
 
TI number: G00095
Integrated Circuits - These circuits are representative of 1962-63 production. The standard package was the 14 lead flatpack, with the unused leads clipped after assembly.

This item was part of the original S/B Lobby display. The first major production of IC's was for military applications and was started with the receipt by TI of two contracts dated November 27, 1962, from Autonetics Division of North American Aviation, (now part of Rockwell International). The first called for the development and delivery of 100 each of 19 types of devices for the Minuteman II missile guidance system. Upon completion of the development, the second contract for the delivery of production quantities. This and subsequent production contracts brought sales of more than 2000 TI IC's per missile plus spares. Included with this item is a photo used by Autonetics to illustrate the major decrease in the size of the guidance system, even with greater capability than that used for Minuteman I, because of the reduction of the number of components and package size. The Minuteman II contracts resulted in improvements in manufacturing methods to ensure device reliability and in handling and testing equipment. Welding of the package improved mechanical and hermetic qualities. (See G00031.) Development of the Mech-Pak carrier, test sockets and boards, an IC tester, a lead clipper, a special welder and printed circuit boards enlarged the TI production capacity and the capability of customers to use IC's.

Related material in collection: G00096, 97, Z00145. Summary comment by: Willis Adcock, Jack Kilby, Jim Lacy, Charles Phipps.

G00095   NMAH Catalog Number 1987.0487.421.05
 
TI number: G00095
Integrated Circuits - These circuits are representative of 1962-63 production. The standard package was the 14 lead flatpack, with the unused leads clipped after assembly.

This item was part of the original S/B Lobby display. The first major production of IC's was for military applications and was started with the receipt by TI of two contracts dated November 27, 1962, from Autonetics Division of North American Aviation, (now part of Rockwell International). The first called for the development and delivery of 100 each of 19 types of devices for the Minuteman II missile guidance system. Upon completion of the development, the second contract for the delivery of production quantities. This and subsequent production contracts brought sales of more than 2000 TI IC's per missile plus spares. Included with this item is a photo used by Autonetics to illustrate the major decrease in the size of the guidance system, even with greater capability than that used for Minuteman I, because of the reduction of the number of components and package size. The Minuteman II contracts resulted in improvements in manufacturing methods to ensure device reliability and in handling and testing equipment. Welding of the package improved mechanical and hermetic qualities. (See G00031.) Development of the Mech-Pak carrier, test sockets and boards, an IC tester, a lead clipper, a special welder and printed circuit boards enlarged the TI production capacity and the capability of customers to use IC's.

Related material in collection: G00096, 97, Z00145. Summary comment by: Willis Adcock, Jack Kilby, Jim Lacy, Charles Phipps.

G00095   NMAH Catalog Number 1987.0487.421.06
 
TI number: G00095
Integrated Circuits - These circuits are representative of 1962-63 production. The standard package was the 14 lead flatpack, with the unused leads clipped after assembly.

This item was part of the original S/B Lobby display. The first major production of IC's was for military applications and was started with the receipt by TI of two contracts dated November 27, 1962, from Autonetics Division of North American Aviation, (now part of Rockwell International). The first called for the development and delivery of 100 each of 19 types of devices for the Minuteman II missile guidance system. Upon completion of the development, the second contract for the delivery of production quantities. This and subsequent production contracts brought sales of more than 2000 TI IC's per missile plus spares. Included with this item is a photo used by Autonetics to illustrate the major decrease in the size of the guidance system, even with greater capability than that used for Minuteman I, because of the reduction of the number of components and package size. The Minuteman II contracts resulted in improvements in manufacturing methods to ensure device reliability and in handling and testing equipment. Welding of the package improved mechanical and hermetic qualities. (See G00031.) Development of the Mech-Pak carrier, test sockets and boards, an IC tester, a lead clipper, a special welder and printed circuit boards enlarged the TI production capacity and the capability of customers to use IC's.

Related material in collection: G00096, 97, Z00145. Summary comment by: Willis Adcock, Jack Kilby, Jim Lacy, Charles Phipps.

G00095   NMAH Catalog Number 1987.0487.421.07
 
TI number: G00095
Integrated Circuits - These circuits are representative of 1962-63 production. The standard package was the 14 lead flatpack, with the unused leads clipped after assembly.

This item was part of the original S/B Lobby display. The first major production of IC's was for military applications and was started with the receipt by TI of two contracts dated November 27, 1962, from Autonetics Division of North American Aviation, (now part of Rockwell International). The first called for the development and delivery of 100 each of 19 types of devices for the Minuteman II missile guidance system. Upon completion of the development, the second contract for the delivery of production quantities. This and subsequent production contracts brought sales of more than 2000 TI IC's per missile plus spares. Included with this item is a photo used by Autonetics to illustrate the major decrease in the size of the guidance system, even with greater capability than that used for Minuteman I, because of the reduction of the number of components and package size. The Minuteman II contracts resulted in improvements in manufacturing methods to ensure device reliability and in handling and testing equipment. Welding of the package improved mechanical and hermetic qualities. (See G00031.) Development of the Mech-Pak carrier, test sockets and boards, an IC tester, a lead clipper, a special welder and printed circuit boards enlarged the TI production capacity and the capability of customers to use IC's.

Related material in collection: G00096, 97, Z00145. Summary comment by: Willis Adcock, Jack Kilby, Jim Lacy, Charles Phipps.

G00095   NMAH Catalog Number 1987.0487.421.08
 
TI number: G00095
Integrated Circuits - These circuits are representative of 1962-63 production. The standard package was the 14 lead flatpack, with the unused leads clipped after assembly.

This item was part of the original S/B Lobby display. The first major production of IC's was for military applications and was started with the receipt by TI of two contracts dated November 27, 1962, from Autonetics Division of North American Aviation, (now part of Rockwell International). The first called for the development and delivery of 100 each of 19 types of devices for the Minuteman II missile guidance system. Upon completion of the development, the second contract for the delivery of production quantities. This and subsequent production contracts brought sales of more than 2000 TI IC's per missile plus spares. Included with this item is a photo used by Autonetics to illustrate the major decrease in the size of the guidance system, even with greater capability than that used for Minuteman I, because of the reduction of the number of components and package size. The Minuteman II contracts resulted in improvements in manufacturing methods to ensure device reliability and in handling and testing equipment. Welding of the package improved mechanical and hermetic qualities. (See G00031.) Development of the Mech-Pak carrier, test sockets and boards, an IC tester, a lead clipper, a special welder and printed circuit boards enlarged the TI production capacity and the capability of customers to use IC's.

Related material in collection: G00096, 97, Z00145. Summary comment by: Willis Adcock, Jack Kilby, Jim Lacy, Charles Phipps.

G00095   NMAH Catalog Number 1987.0487.421.09
 
TI number: G00095
Integrated Circuits - These circuits are representative of 1962-63 production. The standard package was the 14 lead flatpack, with the unused leads clipped after assembly.

This item was part of the original S/B Lobby display. The first major production of IC's was for military applications and was started with the receipt by TI of two contracts dated November 27, 1962, from Autonetics Division of North American Aviation, (now part of Rockwell International). The first called for the development and delivery of 100 each of 19 types of devices for the Minuteman II missile guidance system. Upon completion of the development, the second contract for the delivery of production quantities. This and subsequent production contracts brought sales of more than 2000 TI IC's per missile plus spares. Included with this item is a photo used by Autonetics to illustrate the major decrease in the size of the guidance system, even with greater capability than that used for Minuteman I, because of the reduction of the number of components and package size. The Minuteman II contracts resulted in improvements in manufacturing methods to ensure device reliability and in handling and testing equipment. Welding of the package improved mechanical and hermetic qualities. (See G00031.) Development of the Mech-Pak carrier, test sockets and boards, an IC tester, a lead clipper, a special welder and printed circuit boards enlarged the TI production capacity and the capability of customers to use IC's.

Related material in collection: G00096, 97, Z00145. Summary comment by: Willis Adcock, Jack Kilby, Jim Lacy, Charles Phipps.

G00095   NMAH Catalog Number 1987.0487.421.10
 
TI number: G00095
Integrated Circuits - These circuits are representative of 1962-63 production. The standard package was the 14 lead flatpack, with the unused leads clipped after assembly.

This item was part of the original S/B Lobby display. The first major production of IC's was for military applications and was started with the receipt by TI of two contracts dated November 27, 1962, from Autonetics Division of North American Aviation, (now part of Rockwell International). The first called for the development and delivery of 100 each of 19 types of devices for the Minuteman II missile guidance system. Upon completion of the development, the second contract for the delivery of production quantities. This and subsequent production contracts brought sales of more than 2000 TI IC's per missile plus spares. Included with this item is a photo used by Autonetics to illustrate the major decrease in the size of the guidance system, even with greater capability than that used for Minuteman I, because of the reduction of the number of components and package size. The Minuteman II contracts resulted in improvements in manufacturing methods to ensure device reliability and in handling and testing equipment. Welding of the package improved mechanical and hermetic qualities. (See G00031.) Development of the Mech-Pak carrier, test sockets and boards, an IC tester, a lead clipper, a special welder and printed circuit boards enlarged the TI production capacity and the capability of customers to use IC's.

Related material in collection: G00096, 97, Z00145. Summary comment by: Willis Adcock, Jack Kilby, Jim Lacy, Charles Phipps.

G00095   NMAH Catalog Number 1987.0487.421.11
 
TI number: G00095
Integrated Circuits - These circuits are representative of 1962-63 production. The standard package was the 14 lead flatpack, with the unused leads clipped after assembly.

This item was part of the original S/B Lobby display. The first major production of IC's was for military applications and was started with the receipt by TI of two contracts dated November 27, 1962, from Autonetics Division of North American Aviation, (now part of Rockwell International). The first called for the development and delivery of 100 each of 19 types of devices for the Minuteman II missile guidance system. Upon completion of the development, the second contract for the delivery of production quantities. This and subsequent production contracts brought sales of more than 2000 TI IC's per missile plus spares. Included with this item is a photo used by Autonetics to illustrate the major decrease in the size of the guidance system, even with greater capability than that used for Minuteman I, because of the reduction of the number of components and package size. The Minuteman II contracts resulted in improvements in manufacturing methods to ensure device reliability and in handling and testing equipment. Welding of the package improved mechanical and hermetic qualities. (See G00031.) Development of the Mech-Pak carrier, test sockets and boards, an IC tester, a lead clipper, a special welder and printed circuit boards enlarged the TI production capacity and the capability of customers to use IC's.

Related material in collection: G00096, 97, Z00145. Summary comment by: Willis Adcock, Jack Kilby, Jim Lacy, Charles Phipps.

G00095   NMAH Catalog Number 1987.0487.421.12
 
TI number: G00095
Integrated Circuits - These circuits are representative of 1962-63 production. The standard package was the 14 lead flatpack, with the unused leads clipped after assembly.

This item was part of the original S/B Lobby display. The first major production of IC's was for military applications and was started with the receipt by TI of two contracts dated November 27, 1962, from Autonetics Division of North American Aviation, (now part of Rockwell International). The first called for the development and delivery of 100 each of 19 types of devices for the Minuteman II missile guidance system. Upon completion of the development, the second contract for the delivery of production quantities. This and subsequent production contracts brought sales of more than 2000 TI IC's per missile plus spares. Included with this item is a photo used by Autonetics to illustrate the major decrease in the size of the guidance system, even with greater capability than that used for Minuteman I, because of the reduction of the number of components and package size. The Minuteman II contracts resulted in improvements in manufacturing methods to ensure device reliability and in handling and testing equipment. Welding of the package improved mechanical and hermetic qualities. (See G00031.) Development of the Mech-Pak carrier, test sockets and boards, an IC tester, a lead clipper, a special welder and printed circuit boards enlarged the TI production capacity and the capability of customers to use IC's.

Related material in collection: G00096, 97, Z00145. Summary comment by: Willis Adcock, Jack Kilby, Jim Lacy, Charles Phipps.

G00095   NMAH Catalog Number 1987.0487.421.13
 
TI number: G00095
Integrated Circuits - These circuits are representative of 1962-63 production. The standard package was the 14 lead flatpack, with the unused leads clipped after assembly.

This item was part of the original S/B Lobby display. The first major production of IC's was for military applications and was started with the receipt by TI of two contracts dated November 27, 1962, from Autonetics Division of North American Aviation, (now part of Rockwell International). The first called for the development and delivery of 100 each of 19 types of devices for the Minuteman II missile guidance system. Upon completion of the development, the second contract for the delivery of production quantities. This and subsequent production contracts brought sales of more than 2000 TI IC's per missile plus spares. Included with this item is a photo used by Autonetics to illustrate the major decrease in the size of the guidance system, even with greater capability than that used for Minuteman I, because of the reduction of the number of components and package size. The Minuteman II contracts resulted in improvements in manufacturing methods to ensure device reliability and in handling and testing equipment. Welding of the package improved mechanical and hermetic qualities. (See G00031.) Development of the Mech-Pak carrier, test sockets and boards, an IC tester, a lead clipper, a special welder and printed circuit boards enlarged the TI production capacity and the capability of customers to use IC's.

Related material in collection: G00096, 97, Z00145. Summary comment by: Willis Adcock, Jack Kilby, Jim Lacy, Charles Phipps.

G00095   NMAH Catalog Number 1987.0487.421.14
 
TI number: G00095
Integrated Circuits - These circuits are representative of 1962-63 production. The standard package was the 14 lead flatpack, with the unused leads clipped after assembly.

This item was part of the original S/B Lobby display. The first major production of IC's was for military applications and was started with the receipt by TI of two contracts dated November 27, 1962, from Autonetics Division of North American Aviation, (now part of Rockwell International). The first called for the development and delivery of 100 each of 19 types of devices for the Minuteman II missile guidance system. Upon completion of the development, the second contract for the delivery of production quantities. This and subsequent production contracts brought sales of more than 2000 TI IC's per missile plus spares. Included with this item is a photo used by Autonetics to illustrate the major decrease in the size of the guidance system, even with greater capability than that used for Minuteman I, because of the reduction of the number of components and package size. The Minuteman II contracts resulted in improvements in manufacturing methods to ensure device reliability and in handling and testing equipment. Welding of the package improved mechanical and hermetic qualities. (See G00031.) Development of the Mech-Pak carrier, test sockets and boards, an IC tester, a lead clipper, a special welder and printed circuit boards enlarged the TI production capacity and the capability of customers to use IC's.

Related material in collection: G00096, 97, Z00145.

G00095   NMAH Catalog Number 1987.0487.421.15
 
TI number: G00095
Integrated Circuits - These circuits are representative of 1962-63 production. The standard package was the 14 lead flatpack, with the unused leads clipped after assembly.

This item was part of the original S/B Lobby display. The first major production of IC's was for military applications and was started with the receipt by TI of two contracts dated November 27, 1962, from Autonetics Division of North American Aviation, (now part of Rockwell International). The first called for the development and delivery of 100 each of 19 types of devices for the Minuteman II missile guidance system. Upon completion of the development, the second contract for the delivery of production quantities. This and subsequent production contracts brought sales of more than 2000 TI IC's per missile plus spares. Included with this item is a photo used by Autonetics to illustrate the major decrease in the size of the guidance system, even with greater capability than that used for Minuteman I, because of the reduction of the number of components and package size. The Minuteman II contracts resulted in improvements in manufacturing methods to ensure device reliability and in handling and testing equipment. Welding of the package improved mechanical and hermetic qualities. (See G00031.) Development of the Mech-Pak carrier, test sockets and boards, an IC tester, a lead clipper, a special welder and printed circuit boards enlarged the TI production capacity and the capability of customers to use IC's.

Related material in collection: G00096, 97, Z00145. Summary comment by: Willis Adcock, Jack Kilby, Jim Lacy, Charles Phipps.

G00095   NMAH Catalog Number 1987.0487.421.16
 
TI number: G00095
Integrated Circuits - These circuits are representative of 1962-63 production. The standard package was the 14 lead flatpack, with the unused leads clipped after assembly.

This item was part of the original S/B Lobby display. The first major production of IC's was for military applications and was started with the receipt by TI of two contracts dated November 27, 1962, from Autonetics Division of North American Aviation, (now part of Rockwell International). The first called for the development and delivery of 100 each of 19 types of devices for the Minuteman II missile guidance system. Upon completion of the development, the second contract for the delivery of production quantities. This and subsequent production contracts brought sales of more than 2000 TI IC's per missile plus spares. Included with this item is a photo used by Autonetics to illustrate the major decrease in the size of the guidance system, even with greater capability than that used for Minuteman I, because of the reduction of the number of components and package size. The Minuteman II contracts resulted in improvements in manufacturing methods to ensure device reliability and in handling and testing equipment. Welding of the package improved mechanical and hermetic qualities. (See G00031.) Development of the Mech-Pak carrier, test sockets and boards, an IC tester, a lead clipper, a special welder and printed circuit boards enlarged the TI production capacity and the capability of customers to use IC's.

Related material in collection: G00096, 97, Z00145. Summary comment by: Willis Adcock, Jack Kilby, Jim Lacy, Charles Phipps.

G00095   NMAH Catalog Number 1987.0487.421.17
 
TI number: G00095
Integrated Circuits - These circuits are representative of 1962-63 production. The standard package was the 14 lead flatpack, with the unused leads clipped after assembly.

This item was part of the original S/B Lobby display. The first major production of IC's was for military applications and was started with the receipt by TI of two contracts dated November 27, 1962, from Autonetics Division of North American Aviation, (now part of Rockwell International). The first called for the development and delivery of 100 each of 19 types of devices for the Minuteman II missile guidance system. Upon completion of the development, the second contract for the delivery of production quantities. This and subsequent production contracts brought sales of more than 2000 TI IC's per missile plus spares. Included with this item is a photo used by Autonetics to illustrate the major decrease in the size of the guidance system, even with greater capability than that used for Minuteman I, because of the reduction of the number of components and package size. The Minuteman II contracts resulted in improvements in manufacturing methods to ensure device reliability and in handling and testing equipment. Welding of the package improved mechanical and hermetic qualities. (See G00031.) Development of the Mech-Pak carrier, test sockets and boards, an IC tester, a lead clipper, a special welder and printed circuit boards enlarged the TI production capacity and the capability of customers to use IC's.

Related material in collection: G00096, 97, Z00145. Summary comment by: Willis Adcock, Jack Kilby, Jim Lacy, Charles Phipps.

G00096   NMAH Catalog Number 1987.0487.422
 
TI number: G00096
Test Board, Integrated Circuit Carrier - These boards represent two designs made in 1963 for use in test and burn in of integrated circuits.

This item was part of the original S/B Lobby display. These and subsequently designed test boards were designed for use with the Mech-Pak carrier to facilitate handling. One test board contains an IC in a Mech-Pak carrier.

Related material in collection: L00230, 396 & 397. Summary comment by: Willis Adcock, Jack Kilby, Charles Phipps.

G00096   NMAH Catalog Number 1987.0487.423
 
TI number: G00096
Test Board, Integrated Circuit Carrier - These boards represent two designs made in 1963 for use in test and burn in of integrated circuits.

This item was part of the original S/B Lobby display. These and subsequently designed test boards were designed for use with the Mech-Pak carrier to facilitate handling. One test board contains an IC in a Mech-Pak carrier.

Related material in collection: L00230, 396 & 397. Summary comment by: Willis Adcock, Jack Kilby, Charles Phipps.

G00097   NMAH Catalog Number 1987.0487.424
 
TI number: G00097
Carrier, integrated circuit - This carrier was designed and put into production use in 1963. It was the standard means of handling completed IC's in flatpacks for testing, burning in and shipping.

This item was part of the original S/B Lobby display. Initially IC's were shipped in the carriers and clipped out by the customer for board mounting. Subsequently, carriers became available that permitted clipped devices to be tested. TI shipped devices in either carrier per customer instructions. Eventually, the Mech-Pak was phased out.

Related material in collection: G00095, 96, 252. Summary comment by: Willis Adcock, Jack Kilby, Charles Phipps.

G00099   NMAH Catalog Number 1987.0487.426
 
TI number: G00099
Integrated Circuit, Optoelectronic - A research contract from the Air Force resulted in the first optoelectronic integrated circuit. The PEX3002 was introduced at WESCON in 1964.

This item was part of the original S/B Lobby display. The PEX3002 was a multiple switch/chopper which provided a coupling of gallium arsenide and silicon to isolate driver and switch to eliminate bulky transformers. The device was introduced some six or seven years before the industry was ready for its sophistication.

Summary comment by: Charles Phipps.

G00334   NMAH Catalog Number 1987.0487.431
 
TI number: G00334
Photo Available Integrated Circuit Fabrication Display - Displays step by step process of the fabrication of an integrated circuit (initially called Semiconductor Network at TI). The display probably was made in 1962 or early 1963 and represents production of that period.

This item is the same G00027 & 148 except for part details. The estimated date for the display is based on the 7/8" slice diameter, mask size, package construction and painted device.

Related material in collection: G00027, 148. Summary comment by: Willis Adcock, Howard Moss, Charles Phipps.



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