|1987.0487.085||Texas Instruments Collection||Object|
|Rectifier - 1955-6
TI number: G00356
This device is a sectioned example of the first TI epoxy encapsulated silicon rectifier design. The initial packaging work was done in 1955-6.
The process started with round (Cavitron cut) silicon die and silver nail head leads. The die contained a diffused junction, and the leads were attached by means of lead silver eutectic solder. The die area was coated with a silicone varnish and potted in two B stage beads. The assembly was put in a black nylon sleeve and placed in a vacuum oven where the beads flowed under heat to complete the sealing. The project led to the 1N2069, 1N2070, and 1N2071 rectifiers.
Related material in collection: G00357-9.
|Texas Instruments (Obie Draper, Vic Machette, Bob Wallace.)