| 1987.0487.085 | Texas Instruments Collection | Object |
| Rectifier - 1955-6 TI number: G00356 This device is a sectioned example of the first TI epoxy encapsulated silicon rectifier design. The initial packaging work was done in 1955-6. The process started with round (Cavitron cut) silicon die and silver nail head leads. The die contained a diffused junction, and the leads were attached by means of lead silver eutectic solder. The die area was coated with a silicone varnish and potted in two B stage beads. The assembly was put in a black nylon sleeve and placed in a vacuum oven where the beads flowed under heat to complete the sealing. The project led to the 1N2069, 1N2070, and 1N2071 rectifiers. Related material in collection: G00357-9. |
| Texas Instruments (Obie Draper, Vic Machette, Bob Wallace.)
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