1987.0487.090 Texas Instruments Collection Object

Gold Preforms
TI number: G00361

Gold preforms such as these have been widely used in semiconductor device production. Because gold readily alloys with germanium and silicon, the preforms provided a covalent and reliable means of mounting semiconductor chips.

The material was usually 3 - 5 mils thick approximately 99.999% pure. In some applications, it would have a small amount of germanium alloyed in to lower the melting point. The size of the preform was normally about the same as that of the chip being mounted.
Texas Instruments (Jim Lineback, Jimmy Squires, Bob Wallace.)

Contact Nance L. Briscoe for further information

National Museum of American History

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