|1987.0487.090||Texas Instruments Collection||Object|
TI number: G00361
Gold preforms such as these have been widely used in semiconductor device production. Because gold readily alloys with germanium and silicon, the preforms provided a covalent and reliable means of mounting semiconductor chips.
The material was usually 3 - 5 mils thick approximately 99.999% pure. In some applications, it would have a small amount of germanium alloyed in to lower the melting point. The size of the preform was normally about the same as that of the chip being mounted.
|Texas Instruments (Jim Lineback, Jimmy Squires, Bob Wallace.)