1987.0487.091 Texas Instruments Collection Object

Silicon Dual Transistor
TI number: G00362

This device is one of the types supplied by TI for use in the Minuteman II and III missile guidance systems. The package contains two chips of the same type connected independently to the external leads.

This type of packaging was developed in early 1963 for the Minuteman II program. The package required much less space per transistor and made use of the same board mounting technique used for integrated circuits. The device is shown in a Mech Pak carrier which was used for testing. Devices meeting specifications were clipped out of the carrier and had the leads formed prior to shipment. This device type was produced at TI into 1978 for the Minuteman II and III missile programs.
Texas Instruments (John Gibson, Ed Kamradt, Wayne Richey.)

Contact Nance L. Briscoe for further information

National Museum of American History

HomeSearchChip TalkChip FunPatentsPeoplePicturesCreditsCopyrightComments