1987.0487.101 Texas Instruments Collection Object

Wafer - 1986
TI number: G00370

The use of electron beam technology directly to pattern the metallization of a slice was a major step in cycle time reduction for applications specific integrated circuits. This capability enabled TI to offer cycle times of as little as one week from approved data base to packaged tested units.

TI was the first manufacturer to offer this service in Europe and gained a significant share of the gate array market due to the fast turn around for prototyping and low volume production. This service enabled equipment manufacturers to reduce the time from design to completed equipment by one to two months. The technology is 3 micron CMOS with single level metal. Slices are processed in a normal fabrication area through metalization and then held as evaluated master slices for subsequent customization of the metal level using the E-Beam Direct Slice Writer. This sample slice has two different chips (bars). The larger ones are plug bars with a circuit design to monitor the processing. The area of the slice to be patterned can be adjusted to any radius. In this case, the reduced area was used to save machine time since only a small number of prototypes were required. The program was started in the third quarter of 1985, and about 30 designs had been prototyped by the first quarter of 1986. Plans are to start 2 micron designs in the third quarter of 1986, with 1 micron double level metal designs in the future. This item was submitted by TIL as a significant 1985 development. See the Artifacts Historical File for additional information.

Related material in collection: G00371.
Texas Instruments (Chris Black.)

Contact Nance L. Briscoe for further information

National Museum of American History

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