1987.0487.164.03 Texas Instruments Collection Object

Integrated Circuits - 1974-6
TI number: G00412

These IC's were engineering samples built during the development phase of the program, 1974-1976. These are beam lead chips as shown by the uncapped devices. The non-hermetic package was temporary for testing while an adequate carrier was being developed, indicating these were early units.

A total of 13 radiation hardened beam lead IC's were developed by TI for the Lockheed C4 Poseidon program, but the production order was lost to competition on price. A conformal coating was used in the temporary packages for protection during environmental testing. Later, a chip carrier was developed to replace the package for all testing. Acceptable chips were removed for the carrier and mounted and shipped on glass.
Texas Instruments (Bill Brower, John Morrison.)

Contact Nance L. Briscoe for further information



National Museum of American History


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