|1987.0487.389.01||Texas Instruments Collection||Object|
TI number: G00039
Examples of 1955 studies of glass and plastic for packaging semiconductor devices. Included is a drawing of the germanium alloy transistor in the glass package.
TI introduced diodes in glass packages in 1954-5 but never used glass for transistors. Plastic was introduced for diodes, rectifiers and transistors about 1964. For transistors, glass prevented problems of sealing temperature, ruggedness and device sensitivity to light. The item was part of the original South Building lobby display. Display lists contributors as TIllery Townsend and Elmer Wolff.
|Texas Instruments (Elmer Wolff.)