1987.0487.435 Texas Instruments Collection Object

Thermal Compression Ball Bonder
TI number: G00276

This hand operated ball bonder is a TI designed and built model of the type widely used to ball bond a gold wire to the transistor or integrated circuit chip.

The bonder is complete except for the microscope. The date manufactured is not known, but its last use was on microwave devices. It was taken out of production about June 1, 1985. The basic design was put into use about 1960. Production of these bonders, with evolutionary improvements, continued until about 1970 when TI designed automatic bonders began to take over. Use of these bonders continued for many special applications, and some are still in use at this time.

Related material in collection: PG00024.
Texas Instruments (Rich Mahle, Jim Moreland.)

Contact Nance L. Briscoe for further information

National Museum of American History

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