Texas Instruments Collection Wafer

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Summary comments provided by Texas Instruments' staff.


G00191   NMAH Catalog Number 1987.0487.038
 
TI number: G00191
Wafers, array, large scale integration - Display has three slices illustrating the three successive levels of metalization.

See G00186 for fabrication discussion.

Related material in collection: G00026, 186-7, 192-4, 306, 333. Summary comment by: Jim Hull, Jack Kilby, Charles Phipps.

G00383   NMAH Catalog Number 1987.0487.069.01
 
TI number: G00383
Wafers, Integrated Circuit - These slices are from a TMX3536 Video Display Processor prototype lot processed in the TIJ Miho Front End in early 1982. The TMX indicates an engineering development sample of the TMS3536. See G00382 for description of the device and its development.

These are 125 mm. slices, one of which was received broken in two pieces. The bar (chip) size is .222" x .206", and the process is MOS. See the Artifacts Historical File for additional information.

Related material in collection: G00382. Summary comment by: Jean Luc Villevieille.

G00383   NMAH Catalog Number 1987.0487.069.02
 
TI number: G00383
Wafers, Integrated Circuit - These slices are from a TMX3536 Video Display Processor prototype lot processed in the TIJ Miho Front End in early 1982. The TMX indicates an engineering development sample of the TMS3536. See G00382 for description of the device and its development.

These are 125 mm. slices, one of which was received broken in two pieces. The bar (chip) size is .222" x .206", and the process is MOS. See the Artifacts Historical File for additional information.

Related material in collection: G00382. Summary comment by: Jean Luc Villevieille.

G00375   NMAH Catalog Number 1987.0487.070
 
TI number: G00375
Wafer, Fluoractor - See G00374 for a description of a Fluoractor. This slice was fabricated during prototype production of the device. It completed all of the normal Front End operations.

The bar (chip) size is .070" x .100".

Related material in collection: G00374, 6, PG00092. Summary comment by: Mick Maytum, Dave Storey, Phil Tizzard.

G00376   NMAH Catalog Number 1987.0487.071
 
TI number: G00376
Wafer, Floractor - This slice contains bars for the Fluoractor device described under G00374 which have been processed beyond the slice under G00375. The pattern of alloy solder balls has been applied to make the contracts with the package leads.

This slice was fabricated during the prototype production of the device. See Related Material for additional information.

Related material in collection: G00374-5, PG00092. Summary comment by: Mick Maytum, Dave Storey, Phil Tizzard.

G00378   NMAH Catalog Number 1987.0487.072
 
TI number: G00378
Wafer, Transient Suppressor Thyristor - See G00377 for description of the transient suppressor thyristor. This slice was fabricated in 1981 in the initial development efforts. It completed all of the normal front end operations.

Related material in collection: G00377, 9, PG00093. Summary comment by: Mick Maytum, Dave Storey, Phil Tizzard.

G00379   NMAH Catalog Number 1987.0487.073
 
TI number: G00379
Wafer, Transient Suppressor Thyristor - This slice contains bars for the transient suppressor device described under G00377 which have been processed beyond the slice under G00378. The pattern of alloy solder balls has been applied to make the contracts with the package lead.

This slice was fabricated in 1981 during the initial development efforts.

Related material in collection: G00377-8, PG00093. Summary comment by: Mick Maytum, Dave Storey, Phil Tizzard.

G00330   NMAH Catalog Number 1987.0487.100
 
TI number: G00330
Wafer, Memory - This slice is from an initial production lot of 64K DRAM's on 125 mm. slices processed in the TI Japan Miho MOS 1 Front End. Processing was completed for shipment on July 10, 1982.

July,1982, was the first month of shipment of 125mm. slices from Miho MOS 1, and the conversion was completed in November, 1982. The five special chips on the slice are test chips to be available for slice evaluation purposes. Placing such chips on slices has been standard TI procedure. For information on the introduction of the 64K DRAM, see G00116.

Related material in collection: G00116. Summary comment by: Mohan Rao, Shuji Uemura (TIJ).

G00370   NMAH Catalog Number 1987.0487.101
 
TI number: G00370
Wafer - The use of electron beam technology directly to pattern the metallization of a slice was a major step in cycle time reduction for applications specific integrated circuits. This capability enabled TI to offer cycle times of as little as one week from approved data base to packaged tested units.

TI was the first manufacturer to offer this service in Europe and gained a significant share of the gate array market due to the fast turn around for prototyping and low volume production. This service enabled equipment manufacturers to reduce the time from design to completed equipment by one to two months. The technology is 3 micron CMOS with single level metal. Slices are processed in a normal fabrication area through metalization and then held as evaluated master slices for subsequent customization of the metal level using the E-Beam Direct Slice Writer. This sample slice has two different chips (bars). The larger ones are plug bars with a circuit design to monitor the processing. The area of the slice to be patterned can be adjusted to any radius. In this case, the reduced area was used to save machine time since only a small number of prototypes were required. The program was started in the third quarter of 1985, and about 30 designs had been prototyped by the first quarter of 1986. Plans are to start 2 micron designs in the third quarter of 1986, with 1 micron double level metal designs in the future. This item was submitted by TIL as a significant 1985 development. See the Artifacts Historical File for additional information.

Related material in collection: G00371. Summary comment by: Chris Black.

G00381   NMAH Catalog Number 1987.0487.108
 
TI number: G00381
Wafer Integrated Circuit - The two slices are from the engineering work on the development of a semiconductor TV channel switch. The work was done by TID in Freising from mid 1971 to mid 1972. The customer was Grundig.

The switch was designed for eight TV channel which could be selected randomly. To achieve this function, four chips were required, two analog switch and two control chips derived from two master chips with lead pattern alterations. Two 28 pin packages, each with an analog and a control chip, were used. These two slices contain SN16781 Analog Switch chips (.102" x .076") and SN16837 Control chips (.103" x .122"). Processing was standard TI linear bipolar. The SN16837 was a reservation on the original chip, the SN16775, but was not used in full production because of a complete chip set redesign. Design work started August, 1971; the first packaged samples were available October, 1971. Production shipments were started in mid 1972 with the revised chips and has been continuous to date, June, 1986. Patents were secured both in Germany and the United States. See the Artifacts Historical File for additional information.

Summary comment by: Walter Bucksch, Guenter Heinecke.

G00381   NMAH Catalog Number 1987.0487.109
 
TI number: G00381
Wafer Integrated Circuit - The two slices are from the engineering work on the development of a semiconductor TV channel switch. The work was done by TID in Freising from mid 1971 to mid 1972. The customer was Grundig.

The switch was designed for eight TV channel which could be selected randomly. To achieve this function, four chips were required, two analog switch and two control chips derived from two master chips with lead pattern alterations. Two 28 pin packages, each with an analog and a control chip, were used. These two slices contain SN16781 Analog Switch chips (.102" x .076") and SN16837 Control chips (.103" x .122"). Processing was standard TI linear bipolar. The SN16837 was a reservation on the original chip, the SN16775, but was not used in full production because of a complete chip set redesign. Design work started August, 1971; the first packaged samples were available October, 1971. Production shipments were started in mid 1972 with the revised chips and has been continuous to date, June, 1986. Patents were secured both in Germany and the United States. See the Artifacts Historical File for additional information.

Summary comment by: Walter Bucksch, Guenter Heinecke.

G00265   NMAH Catalog Number 1987.0487.116.01
 
TI number: G00265
Photo Available Wafers, Silicon - These slices are from the first lot 150 mm. silicon slices produced at TI, June, 1983. The crystals were grown and processed to production slices at the Sherman plant.

Summary comment by: Jim Rinehart.

G00265   NMAH Catalog Number 1987.0487.116.02
 
TI number: G00265
Wafers, Silicon - These slices are from the first lot 150 mm. silicon slices produced at TI, June, 1983. The crystals were grown and processed to production slices at the Sherman plant.

Summary comment by: Jim Rinehart.

G00265   NMAH Catalog Number 1987.0487.116.03
 
TI number: G00265
Wafers, Silicon - These slices are from the first lot 150 mm. silicon slices produced at TI, June, 1983. The crystals were grown and processed to production slices at the Sherman plant.

Summary comment by: Jim Rinehart.

G00427   NMAH Catalog Number 1987.0487.165
 
TI number: G00427
Wafer - This plaque contains a probed slice from the first lot of 4in silicon processed through Sherman BP1. The lot was probed on June 28, 1976. The device type is SN7489, a 64 bit Random Access Read/Write Memory.

Summary comment by: Burrell Ketcham.

G00116   NMAH Catalog Number 1987.0487.195
 
TI number: G00116
Photo Available Wafer - The slice is from the first lot of the qualification run of 64K DRAM's on 125mm. Slices run on the Miho MOS 1 Front End. This slice lot completed processing on May 20, 1982.

The lot represented by this slice was used to prepare a qualification sample to secure approval of Miho MOS 1 125mm. slices with 64 DRAM chips for production use. The six special chips on the slice are test chips to be available for slice evaluation purposes. Placing such chips on slices has been standard TI procedure. The TI 64K DRAM developed at TI's Stafford (Houston) plant. Initial slice processing was done in the Lubbonck Front End. The device was announced in September, 1978, with samples available in the fourth quarter of 1978. For additional information, see Press Releases in the Artifact Historical File.

Related material in collection: G00330. Summary comment by: Mohan Rao, Shuji Uemura (TIJ).

G00249   NMAH Catalog Number 1987.0487.214
 
TI number: G00249
Integrated Circuit Display, Master Wafer - This item is one of the displays used in the mid 1960's to promote the Master Slice concept developed by TI. In addition to briefly describing the concept, key production steps are illustrated.

The display has the original title of SOLID CIRCUIT Semiconductor Networks under which TI introduced integrated circuits. The master slice idea was to provide a means of producing a new custom IC with a minimum of design time. For this slice design, 31 components were diffused into each bar (chip) such that a lead pattern mask was the only difference between several standard and custom circuits. Diffused slices could be the inefficient use of bar space caused the idea to be dropped in favor of efficient individual designs.

Related material in collection: G00344. Summary comment by: Jack Kilby, Howar Moss, Charles Phipps.

G00347   NMAH Catalog Number 1987.0487.274
 
TI number: G00347
Wafer - This slice is from an early lot of SBP 9989 material, processed in late 1980.

See G00348 for additional information on the SBP 9989.

Related material in collection: G00348,9. Summary comment by: Wally Banzhaf, John Hughes, Bill Ray, Wil Shurtleff, Jim Szot.

G00394   NMAH Catalog Number 1987.0487.275
 
TI number: G00394
Wafer - This silicon slice is from the first lot of 3in material processed in TI. It was done in the Sherman Front End, SBP1.

The red dots indicate rejects at multiprobe. The yield appears to have been good from potential bars after allowance for edge of slice, mask alignment and jigs in the processing.

G00183   NMAH Catalog Number 1987.0487.276
 
TI number: G00183
Wafer - This slice is from the first TI effort to make a large monolithic DRAM. The work was done in FEP 1 for the Equipment Group between October 8 and December 30, 1970.

The device is a 1K x 17 bits MOS DRAM. The process consisted of putting 32 standard 1K DRAMS on a 2" slice. Slices were multi probed, and those with 17 or more good 1K chips were accepted for further processing. See G00184 and G00185 for additional information. FEP1 was the result of the first TI program to build a slice processing facility utilizing the maximum practical mechanical handling and computer control. The program was known as the Front End Project.

Related material in collection: G00184-5. Summary comment by: Harvey Cragon, Bob Falt, Jim Nygaard.

G00310   NMAH Catalog Number 1987.0487.319
 
TI number: G00310
Wafers, Microwave Integrated Circuit - The display consists of three processed slices containing three microwave IC's. These circuits were developed in the 1965-7 period for use in the MERA program.

The display circuits are 500 MHz IF Preamp, Phase Shift Network (16 diode array), and TR Antenna Switch. The Antenna Switch was the first monolithic microwave integrated circuit.

Related material in collection: G00100-2, 180, 311. Summary comment by: Willis Adcock, Tom Hyltin, Roger Webster.

G00200   NMAH Catalog Number 1987.0487.360
 
TI number: G00200
Photo Available Wafer Display - Display has a slice from the first lot of TI's experimental 1 Mbit CMOS DRAM. The slice was produced in April, 1985, in the new Front End at the Miho, Japan, plant.

The display contains the 125 mm. silicon slice and an enlarged photo of the memory chip. One micron minimum feature size and state-of-the-art processing permitted the basic memory cell to be only about 4% of the area used on a DRAM of 1980. The slice has alternate rows of memory chips and test chips. In production, only a few test chips are spaced on the slice surface.

Summary comment by: Greg Armstrong, Mohan Rao.

G00063   NMAH Catalog Number 1987.0487.403
 
TI number: G00063
Wafer, Memory, Magnetic Bubble - Example of 512K Magnetic Bubble Memory production slice from the 1980-81 period.

Slice material is gadolinium gallium garnet.

Summary comment by: Dick Guldi, Ramon Rao, Mike Valek.



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