The Chip Collection - Packaging Series 7

Series 7

Integrated Circuit Engineering Collection

PACKAGING

Description:

A series of published packaging strategies for electronic, semiconductor and solid-state devices.

They describe the intrinsic capabilities of IC technologies and the constraints imposed by packaging. The latest being the MCM.


Box 1 (13), 1982
	Electronic Packaging Strategies for the 80’s, Volume 1: Summary for Executives Contents: published report by ICE
Box 1 (13), 1982
	Electronic Packaging Strategies for the 80’s, Volume 2: Application Oriented Considerations Contents: published report by ICE
Box 1 (13), 1982
	Electronic Packaging Strategies for the 80’s, Volume 3: Design Considerations Contents: published report by ICE
Box 1 (13), 1982
	Electronic Packaging Strategies for the 80’s, Volume 4: Density & Speed Considerations Contents: published report by ICE
Box 1 (13), 1982
	Electronic Packaging Strategies for the 80’s, Volume 5: Thermal Considerations Contents: published report by ICE
Box 1 (13), 1982
	Electronic Packaging Strategies for the 80’s, Volume 6: Quality Assurance Reliability and Testing Contents: published report by ICE

The Archives Center maintains container lists with unique collection names, series numbers and most important the Archive Center Number. When requesting information for your research either from the collecting division or the Archives it is imperative to include the associated number(s). Your contacts for requesting information and/or appointments to research the Chip Collection are:

NMAH Archives Center
Manuscript Technology Collections

Hal Wallace, Curator - CHIPS
Information Technology & Society - Electricity Collections