Abstract of the Disclosure

Terminal elements and connections are provided for microminiaturized functional components. A circuit element includes metals strips, metal film and a metal alloy terminal member. The circuit element is joined to a substrate having metal lands adhered thereto. The eutectic temperature of the metal lands is selected to be less than the eutectic temperature of the metal alloy terminals. A joint is effected between the metal alloy terminal and the metal land by firing the substrate with the circuit element positioned thereon for a time interval and a temperature to partially melt the metal alloy terminal whereby the circuit element is joined to the substrate through the metal lands and assumes an elevated positioned with respect to the substrate

• Figure 1 is a flow diagram that practices the principles of the present invention.
• Figure 2 is a cut-away perspective of a substrate before fastening of miniaturized devises.
• Figure 3 is a perspective of a substrate before fastening of miniaturized devises.
• Figure 3A is an enlarged top view of a portion of the substrate in an area where interconnection is desired to be formed.
• Figure 4 is a perspective view of a fixture for positioning the miniaturized device of Figure 2 on the substrate of Figure 3.
• Figure 5 is a cross-sectional view of a miniaturized device positioned on the conductive lands of Figure 3 prior to fusing.
• Figure 6 is a cross-sectional view of the miniaturized device fused to the conductive members secured to the substrate.

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