United States Patent 3,458,102
July 29, 1969

Semiconductor Wafer Pickup And Bonding Tool
Earl A. Zanger Jr.
Peter R. Szasz

Filed October 15, 1964
Image of US PATENT 3,458,102

Abstract of the Disclosure

A semiconductor wafer or die bonding tool adapted to be connected to a workholder of a semiconductor bonding apparatus of the type adapted to locate a semiconductor wafer opposite the bonding tool in an approximately oriented position. The apparatus is adapted to engage the bonding tool upon the wafer and in a camming action to orient and position the wafer in the tip of the tool by engagement of perimetrical edges of the upper surface of the wafer upon a recessed working face in the tip of the tool. The working surface in the tip of the tool is characterized by a plurality of individual facets co-operable with upper edge portions of the wafer to avoid contacting the wafer surface during vibration incurred in bonding the wafer to a substrate.
Figure descriptions: cover graphic

  • Figure 1 is a perspective view of a wafer pickup and bonding tool embodying this invention.
  • Figure 2 is an enlarged bottom plan view of the wafer pickup and bonding tool.
  • Figure 3 is a sectional view taken along lines 3-3 of Figure 1.
  • Figure 3A is a sectional view similar to Figure 3 with the wafer being grasped by the tool.
  • Figure 4 is a sectional view of a mirrored wafer tray embodied in this invention.

 Citations [54]:
3,357,090 12/1967 Tittany 3,083,291 03/1963 Soffa 1,037,851 09/1912 Beam 2,915,201 12/1959 Calehuff
National Museum of American History
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