Abstract of the Disclosure

An insulating underlayer is formed over a portion of an insulating substrate to create two surfaces wherein the microstructure variations of one surface are substantially different from the microstructure variations of the other. One or more resistive films are then formed over a portion of the underlayer surface and one or more other resistive films are formed over a portion of the substrate surface, whereby the deposited films may have the same geometry and composition of material, but will have substantially different values of resistance. Preferably, the resistive films are not thicker than 250 angstroms.

• Figures 1A through 1E are top views of a portion of an insulating substrate showing the preferred method of forming two thin-film resistors thereon having substantially different resistance values.
• Figures 2A through 2E are top views of a portion of an insulating substrate showing an alternative method of forming two thin-film resistors thereon having substantially different resistance values.

 Citations [54]:
  
3,310,711  03/1967  Hangstefer