United States Patent 3,459,998
August 5, 1969

Modular Circuit Assembly
Joseph P. Focarile

Filed August 15, 1967
Image of US PATENT 3,459,998

Abstract of the Disclosure

Integrated circuit chips are formed into convection-cooled integrated circuit assemblies having minimum lead distances and accessible circuit layers by arranging the chips on printed circuit boards whose central areas carry transversely-projecting connector prongs extending in both directions, and by stacking such boards with alternate blocks that space the boards from each other and connect the prongs of one board to another with tiltable hollow prong-engaging female buses passing through the blocks. Preferably two stacks of such boards are sandwiched between carrier boards that receive current from edge-connectors.
Figure descriptions: cover graphic

  • Figure 1 is a partly exploded perspective view illustrating an assembly embodying features of the invention.

 Citations [54]:
2,947,914 08/1960 Simons 2,954,542 09/1960 Wales 3,124,720 03/1964 Green
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