Abstract of the Disclosure

Integrated circuit chips are formed into convection-cooled integrated circuit assemblies having minimum lead distances and accessible circuit layers by arranging the chips on printed circuit boards whose central areas carry transversely-projecting connector prongs extending in both directions, and by stacking such boards with alternate blocks that space the boards from each other and connect the prongs of one board to another with tiltable hollow prong-engaging female buses passing through the blocks. Preferably two stacks of such boards are sandwiched between carrier boards that receive current from edge-connectors.

• Figure 1 is a partly exploded perspective view illustrating an assembly embodying features of the invention.

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2,947,914  08/1960  Simons
2,954,542  09/1960  Wales
3,124,720  03/1964  Green