PATENT COVER GRAPHIC

United States Patent 3,460,241
August 12, 1969

Method Of Counting Semiconductor Devices On Thick Film Circuits
Nathan S. Eherenberg

Filed June 21, 1967
Image of US PATENT 3,460,241

Abstract of the Disclosure

A method of mounting semiconductor elements on a thick film circuit utilizing a mixture of platinum and gold to form a gold silicon eutectic bond.
Figure descriptions: cover graphic

  • Figure 1 is a diagrammatical plan view of a portion of a thick film circuit embodying the invention.
  • Figure 2 is a sectional view of the device of Figure 1 taken along the lines 2-2. 

 Citations [54]:
  
2,964,839  12/1960  Marafioti
3,316,628  02/1967  Lang
3,238,062  01/1966  Sunners
3,292,240  12/1966  McNutt
National Museum of American History
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