Abstract of the Disclosure

A method of fabricating a microminiaturized circuit arrangement by forming a solid-state circuit having a semiconductor body in which at least one circuit element is formed, placing a self-supporting insulating body on the surface of the solid-state circuit, and then at least partially electrically isolating the circuit elements from one another by removing material from the semiconductor body.

• Figure 1 is a cross-sectional view of a unit fabricated according to the present invention.
• Figure 2a is an equivalent circuit diagram of another unit fabricated according to the present invention.
• Figure 2b is a top view of the unit represented in Figure 2a.

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