United States Patent 3,462,349
August 19, 1969

Method Of Forming Metal Contacts On Electrical Components
Geza E. Gorgenyi

Filed September 19, 1966
Image of US PATENT 3,462,349

Abstract of the Disclosure

The method for forming electrical contacts in the form of metallic bumps by electroplating such bumps through an opening in an electrically insulating film such as the photoresist, the electroplating action being discontinued and portions of the photoresist being removed around the bump formed at this point, after which the electroplating is continued which results in closing or filling in the gap which normally would occur under the bump
Figure descriptions: cover graphic

  • Figures 1 through 5 are successive cross-sectional, elevational views of a portion of a semiconductor device illustrating the formation of an electrical contact or bump to one region thereof.

 Citations [54]:
2,834,723 05/1958 Robinson 2,934,479 04/1960 Deer 3,208,921 09/1965 Hill 3,342,927 09/1967 Kubik 3,375,418 03/1968 Garnache
National Museum of American History
HomeSearchChip TalkChip FunPatentsPeoplePicturesCreditsCopyrightComments