Abstract of the Disclosure

A layer of relatively soft conductive material is deposited longitudinally on a narry strip of flexible metal material. The strip is stamped to form a plurality of integrally connected lead frames with narrow lead portions, masked, etched to remove portions of soft conductive material, plated, and bonded to a substrate supporting tips of lead portions having a layer of soft conductive material.

• Figure 1 is a view in perspective showing a plurality of lead frames in strip form according to the present invention and rolled up in a compact reel.
• Figure 2 is an enlarged fragmentary plan view of a portion of the reel strip showing one of the lead frames thereon.
• Figure 3 is an enlarged view in section taken along the line 3-3 of Figure 2.
• Figure 4 is an enlarged view in section taken along the line 4-4 of Figure 2.

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