United States Patent 3,469,953
September 30, 1969

Lead Frame Assembly For Semiconductor Devices
Michael J. St. Clair
William L. Keady

Filed November 9, 1966
Image of US PATENT 3,469,953

Abstract of the Disclosure

A layer of relatively soft conductive material is deposited longitudinally on a narry strip of flexible metal material. The strip is stamped to form a plurality of integrally connected lead frames with narrow lead portions, masked, etched to remove portions of soft conductive material, plated, and bonded to a substrate supporting tips of lead portions having a layer of soft conductive material.
Figure descriptions: cover graphic

  • Figure 1 is a view in perspective showing a plurality of lead frames in strip form according to the present invention and rolled up in a compact reel.
  • Figure 2 is an enlarged fragmentary plan view of a portion of the reel strip showing one of the lead frames thereon.
  • Figure 3 is an enlarged view in section taken along the line 3-3 of Figure 2.
  • Figure 4 is an enlarged view in section taken along the line 4-4 of Figure 2.

 Citations [54]:
2,812,270 11/1957 Alexander 3,171,137 03/1965 Ikeda 3,271,625 09/1966 Carraciolo 3,293,241 12/1966 Carroll 3,325,586 06/1967 Saddick
National Museum of American History
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