United States Patent 3,470,611
October 7, 1969

Semiconductor Device Assembly Method
Chandler H. McIver
Sidney R. Siegel
William W. White Jr.

Filed April 11, 1967
Image of US PATENT 3,470,611

Abstract of the Disclosure

A method is disclosed for directly attaching semiconductor chip devices to thin film circuits. A semiconductor chip, on which solder coated copper contacts have been predeposited, is placed on a thin film circuit so that the soldered contacts are in engagement with the conductors of the thin film circuit. The simultaneous application of ultrasonic energy and thermal energy to the assembly provides a superior mechanical and electrical connection between the chip and the thin film circuit.
Figure descriptions: cover graphic

  • Figure 1 is a plan view of a semiconductor chip which is illustrative of the type which may be bonded to a thin film electrical circuit in accordance with the bonding method of this invention.
  • Figure 2 is an enlarged cross-sectional view showing the apparatus utilized in forming the bond between a semiconductor chip transistor or the like and a thin film circuit.

 Citations [54]:
3,029,766 04/1962 Jones 3,255,511 06/1966 Weissenstern 3,292,240 12/1966 McNutt 3,316,458 04/1967 Jenny 3,373,481 03/1968 Lins
National Museum of American History
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