Abstract of the Disclosure

A method is disclosed for directly attaching semiconductor chip devices to thin film circuits. A semiconductor chip, on which solder coated copper contacts have been predeposited, is placed on a thin film circuit so that the soldered contacts are in engagement with the conductors of the thin film circuit. The simultaneous application of ultrasonic energy and thermal energy to the assembly provides a superior mechanical and electrical connection between the chip and the thin film circuit.

• Figure 1 is a plan view of a semiconductor chip which is illustrative of the type which may be bonded to a thin film electrical circuit in accordance with the bonding method of this invention.
• Figure 2 is an enlarged cross-sectional view showing the apparatus utilized in forming the bond between a semiconductor chip transistor or the like and a thin film circuit.

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