United States Patent 3,488,834
January 13, 1970

Microelectronic Circuit Formed In An Insulating Substrate And Method Of Making The Same
Stephen S. Baird

Filed October 20, 1965
Image of US PATENT 3,488,834

Abstract of the Disclosure

A method is disclosed for forming spaced regions of semiconductor material in an insulating substrate for providing a microelectronic circuit. In addition, a device is disclosed including a plurality of spaced regions of semiconductor material electrically insulated from one another through the substrate. In the disclosed method mesas are selectively formed at one surface of a semiconductor wafer, the surface is coated with an insulating material to support the mesas at the one surface of the semiconductor wafer, and the semiconductor wafer is then removed to leave the semiconductor mesas embedded in the substrate.
Figure descriptions: cover graphic

  • Figures 1a - 1e are pictorial views in section of a semiconductor wafer and glass substrate which illustrate steps of one method of producing a microelectronic circuit in accordance with the invention.

 Citations [54]:
3,308,354 03/1967 Tucker 3,320,485 05/1967 Buie 3,332,137 07/1967 Kenny
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