Abstract of the Disclosure

Disclosed is a ceramic-glass header using alternate layers of glass and ceramic and the method of making the header. The leads of the header extend through the ceramic and glass layers with the glass bonding to the leads and holding them in place. The galss also bonds the ceramic layers together, the ceramic layers defining the shape of the header. A semiconductor device is either mounted on one surface of a ceramic layer or to the leads themselves and when necessary the semiconductor device can be encapsulated.

• Figure 1 is a pictorial drawing of a glass-ceramic header of the invention with leads extending therefrom.
• Figure 2 is a cross-section of the header in Figure 1 taken across section lines 2-2 with the addition of a semiconductor device mounted thereon and enclosed by an epoxy material represented by dashed lines.
• Figure 3 is a second embodiment of the invention showing a metallic eyelet having a flange thereon and a can shown in dashed lines enclosing the top of said header.
• Figure 4 is a block flow diagram of the basic process for producing the header illustrated in Figure 1.
• Figure 5 is a pictorial view of a glass-ceramic wafer produced by the process of the invention.

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