United States Patent 3,489,845
January 13, 1970

Ceramic-Glass Header For A Semiconductor Device
Rafael Landron

Filed August 5, 1966
Image of US PATENT 3,489,845

Abstract of the Disclosure

Disclosed is a ceramic-glass header using alternate layers of glass and ceramic and the method of making the header. The leads of the header extend through the ceramic and glass layers with the glass bonding to the leads and holding them in place. The galss also bonds the ceramic layers together, the ceramic layers defining the shape of the header. A semiconductor device is either mounted on one surface of a ceramic layer or to the leads themselves and when necessary the semiconductor device can be encapsulated.
Figure descriptions: cover graphic

  • Figure 1 is a pictorial drawing of a glass-ceramic header of the invention with leads extending therefrom.
  • Figure 2 is a cross-section of the header in Figure 1 taken across section lines 2-2 with the addition of a semiconductor device mounted thereon and enclosed by an epoxy material represented by dashed lines.
  • Figure 3 is a second embodiment of the invention showing a metallic eyelet having a flange thereon and a can shown in dashed lines enclosing the top of said header.
  • Figure 4 is a block flow diagram of the basic process for producing the header illustrated in Figure 1.
  • Figure 5 is a pictorial view of a glass-ceramic wafer produced by the process of the invention.

 Citations [54]:
2,079,354 05/1937 Knowles 2,206,515 07/1940 Scharfnagel 2,804,581 08/1957 Lichtgarn 3,295,005 12/1966 Poellet
National Museum of American History
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