Abstract of the Disclosure

Microelectronic units such as integrated-circuit chips equipped with head-conducting extensions, and also terminal pins, are sealed and bonded, face down, on a transparent mold board, precisely located with respect to gauge marks on the upper surface by observation from below, and embedded flush, or coplanar, with the surface of a cast, encapsulating block such as ceramic or epoxy. Insulated interconnecting conductors are formed on the coplanar surface of said block and embedded microelectronic units.

• Figures 1 and 2 are orthographic views of an integrated circuit chip, or microelectronic unit.
• Figure 3 is a pictorial view of an encapsulated microelectronic system, including a plurality of units such as chips like that of Figure 1.
• Figure 4 is a section taken along the lines 4-4 of Figure 3.
• Figure 5 is an enlarged detail of Figure 3.
• Figure 6 is an elevational view of part of an assembly machine.
• Figure 7 is an enlarged and partly diagrammatic view of a portion of the machine of Figure 6.
• Figure 8 is a pictorial view of a transparent mold plate, according to the present invention.
• Figure 9 is part of the view seen by the operator through the microscope of the machie of Figures 6 and 7 when carrying out the present invention on said machine.

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