United States Patent 3,489,952
January 13, 1970

Encapsulated Microelectronic Devices
John F. Hinchey

Filed May 15, 1967
Image of US PATENT 3,489,952

Abstract of the Disclosure

Microelectronic units such as integrated-circuit chips equipped with head-conducting extensions, and also terminal pins, are sealed and bonded, face down, on a transparent mold board, precisely located with respect to gauge marks on the upper surface by observation from below, and embedded flush, or coplanar, with the surface of a cast, encapsulating block such as ceramic or epoxy. Insulated interconnecting conductors are formed on the coplanar surface of said block and embedded microelectronic units.
Figure descriptions: cover graphic

  • Figures 1 and 2 are orthographic views of an integrated circuit chip, or microelectronic unit.
  • Figure 3 is a pictorial view of an encapsulated microelectronic system, including a plurality of units such as chips like that of Figure 1.
  • Figure 4 is a section taken along the lines 4-4 of Figure 3.
  • Figure 5 is an enlarged detail of Figure 3.
  • Figure 6 is an elevational view of part of an assembly machine.
  • Figure 7 is an enlarged and partly diagrammatic view of a portion of the machine of Figure 6.
  • Figure 8 is a pictorial view of a transparent mold plate, according to the present invention.
  • Figure 9 is part of the view seen by the operator through the microscope of the machie of Figures 6 and 7 when carrying out the present invention on said machine.

 Citations [54]:
3,290,753 12/1966 Chang 3,262,022 07/1966 Caracciolo 3,312,871 04/1967 Seki 3,370,204 02/1968 Cave 3,407,479 10/1968 Fordemwalt 2,629,802 02/1953 Pantchechnikoff 3,029,495 04/1962 Doctor
National Museum of American History
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