United States Patent 3,508,325
April 28, 1970

Method Of Making Insulation Structures For Crossover Leads In Integrated Circuitry
Thomas A. Perry

Filed January 25, 1965
Image of US PATENT 3,508,325

Abstract of the Disclosure

Disclosed are methods of fabricating lead arrangements for integrated circuits having multiple levels of conductive leads separated by insulated layers at the surface of a semiconductor substrate wherein an insulating layer spaced from a substrate surface preferably comprises a photo-definable material.
Figure descriptions: cover graphic

  • Figure 1 shows a semiconductor substrate having various components diffused therein.

 Citations [54]:
3,266,127 08/1966 Harding 3,292,128 12/1966 Hall 3,312,871 04/1967 Seki
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