United States Patent 3,517,278
June 23, 1970

Flip Chip Structure
Richard W. Hagar

Filed October 2, 1967
Image of US PATENT 3,517,278

Abstract of the Disclosure

A flip chip structure for integrated circuits in which the circuit chip is bonded to a substrate having a printed circuit and raised contact pads serving to interconnect contact areas on the chip. The contact pads are initially affixed to the substrate. The substrate and chip both have the same base material, such as silicon. In addition, the raised contact pads are of sufficient height to permit cross-overs of existing conductors on the circuit chip.
Figure descriptions: cover graphic

  • Figure 1 is a fragmentary view of the top surface of an integrated circuit chip used in the flip chip structure of the present invention.
  • Figure 2 is a fragmentary view of the top surface of a substrate embodying the present invention.
  • Figure 3 is a cross-sectional view along the lines 3-3 of Figures 1 and 2 showing the structures of the two figures sandwiched together to form a flip-chip structure.

 Citations [54]:
3,294,988 12/1966 Packard 3,368,116 02/1968 Spaude 3,388,301 06/1968 James 3,403,438 10/1968 Best
National Museum of American History
HomeSearchChip TalkChip FunPatentsPeoplePicturesCreditsCopyrightComments