United States Patent 3,535,773
October 27, 1970

Method Of Manufacturing Semiconductor Devices
Martin B. Bakker
Stanley A. Swearingen

Filed April 3, 1968
Image of US PATENT 3,535,773

Abstract of the Disclosure

This disclosure is for a method of making semiconductor devices which have a glass layer over the silicon dioxide layer and provides an improved means for separating the semiconductor wafer into dice.
Figure descriptions: cover graphic

  • Figure 1 shows a semiconductor diode.
  • Figure 2 shows a portion of the semiconductor wafer with the channels plowed thereon.

 Citations [54]:
2,970,730 02/1961 Schwarz 3,323,956 06/1967 Gee 3,392,440 07/1968 Yanagawa 3,396,452 08/1968 Sato et al
National Museum of American History
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