United States Patent 3,536,965
October 27, 1970

Metallic Contact And Interconnection System For Semiconductor Devices
Wilburn O. Shurtleff

Filed May 10, 1968
Image of US PATENT 3,536,965

Abstract of the Disclosure

Disclosed is an ohmic contact and interconnection system for a semiconductor device where the contact and interconnection includes a rhenium layer and a layer of highly conductive metal, such as gold.
Figure descriptions: cover graphic

  • Figure 1 is a plan view of a wafer of semiconductor material having a planar transistor formed therein, with holes cut in the oxide coating for application of contacts.
  • Figure 2 is a sectional view of the semiconductor wafer of Figure 1 taken along the line 2-2.

 Citations [54]:
3,290,570 12/1966 Cunningham et al
National Museum of American History
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