United States Patent 3,537,169
November 3, 1970

Method Of Severing A Semiconductor Wafer
Jacobus Eigeman
Hermanus Antonius van de Pas Nijmegen

Filed July 3, 1968
Image of US PATENT 3,537,169

Abstract of the Disclosure

A method of severing a semiconductor wafer is disclosed whereby the wafer is electrostatically held to a flexible synthetic resin foil and is then grooved and subjected to bending forces to divide said wafer into a plurality of parts. The foil is then positioned on a support over an empty space and is heated so that the foil sags downward and effects a spaced separation among the wafer parts. The foil is then cooled to permanently set same.
Figure descriptions: cover graphic

  • Figure 1 is a plan view of a foil and a semiconductor wafer secured to it.
  • Figure 2 relates to the process of severing the wafer of Figure 1.
  • Figure 3 is a diagrammatic cross-section of the device for carrying out the method according to the invention.
  • Figure 4 shows a foil with wafer parts processed by means of the device shown in Figure 3.

 Citations [54]:
2,970,730 02/1961 Schwarz 3,040,489 06/1962 Da Costa 3,206,088 09/1965 Meyer et al 3,384,279 05/1968 Grechus 3,448,510 06/1969 Bippus et al
National Museum of American History
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