Abstract of the Disclosure

A method of severing a semiconductor wafer is disclosed whereby the wafer is electrostatically held to a flexible synthetic resin foil and is then grooved and subjected to bending forces to divide said wafer into a plurality of parts. The foil is then positioned on a support over an empty space and is heated so that the foil sags downward and effects a spaced separation among the wafer parts. The foil is then cooled to permanently set same.

• Figure 1 is a plan view of a foil and a semiconductor wafer secured to it.
• Figure 2 relates to the process of severing the wafer of Figure 1.
• Figure 3 is a diagrammatic cross-section of the device for carrying out the method according to the invention.
• Figure 4 shows a foil with wafer parts processed by means of the device shown in Figure 3.

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